Patents by Inventor Gun Bum LEE

Gun Bum LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF SAFELY USING CONTROLLED COOLING SYSTEMS AND DEVICES
    Publication number: 20240108391
    Abstract: Present disclosure provides a cooling device with safety features and methods for controlling temperature of the cooling device for safe cooling of target surface.
    Type: Application
    Filed: November 30, 2023
    Publication date: April 4, 2024
    Inventors: Gun-Ho KIM, Jae Bum CHO, Dae Hyun KIM, Chul Ho LEE
  • Substrate treatment method and substrate treatment apparatus
    Patent number: 10985040
    Abstract: A substrate treatment method in accordance with an exemplary embodiment includes: heating a substrate, for a substrate treatment process, so that a temperature of the substrate reaches a target temperature; calculating the temperature of the substrate using a sensor located facing the substrate while heating the substrate; and controlling an operation of a heating part configured to heat the substrate according to the temperature calculated from the calculating the temperature, wherein the calculating the temperature comprises: measuring a total radiant energy (Et) radiated from the substrate using the sensor; calculating a corrected total emissivity (?t0) by applying a correction value for correcting the total emissivity (?t) which is the emissivity of the radiant energy (Et); and calculating the temperature (Ts) of the substrate using the total radiant energy (Et) and the corrected total emissivity (?t0).
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: April 20, 2021
    Inventors: Sang Hyun Ji, Yong Soo Moon, Gun Bum Lee
  • SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
    Publication number: 20190103296
    Abstract: A substrate treatment method in accordance with an exemplary embodiment includes: heating a substrate, for a substrate treatment process, so that a temperature of the substrate reaches a target temperature; calculating the temperature of the substrate using a sensor located facing the substrate while heating the substrate; and controlling an operation of a heating part configured to heat the substrate according to the temperature calculated from the calculating the temperature, wherein the calculating the temperature comprises: measuring a total radiant energy (Et) radiated from the substrate using the sensor; calculating a corrected total emissivity (?t0) by applying a correction value for correcting the total emissivity (?t) which is the emissivity of the radiant energy (Et); and calculating the temperature (Ts) of the substrate using the total radiant energy (Et) and the corrected total emissivity (?t0).
    Type: Application
    Filed: September 14, 2018
    Publication date: April 4, 2019
    Inventors: Sang Hyun JI, Yong Soo MOON, Gun Bum LEE