Patents by Inventor Gun Hwi HYUNG

Gun Hwi HYUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate with electronic component embedded therein
    Patent number: 11490503
    Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: November 1, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Hwa Park, Chi Seong Kim, Eun Heay Lee, Yo Han Song, Gun Hwi Hyung, Jae Heun Lee, Deok Man Kang, Jin Oh Park
  • ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE
    Publication number: 20220301975
    Abstract: An electronic component-embedded substrate includes a core layer, a first cavity formed in the core layer, a heat dissipating member disposed in the first cavity and having a second cavity, and an electronic component disposed in the second cavity. The heat dissipating member includes a carbon fiber reinforced polymer (CFRP).
    Type: Application
    Filed: June 4, 2021
    Publication date: September 22, 2022
    Inventors: Ho Hyung HAM, Gun Hwi HYUNG, Jun Hyeong JANG, Tae Hong MIN
  • SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN
    Publication number: 20220022310
    Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.
    Type: Application
    Filed: March 17, 2021
    Publication date: January 20, 2022
    Inventors: Chang Hwa Park, Chi Seong Kim, Eun Heay Lee, Yo Han Song, Gun Hwi Hyung, Jae Heun LEE, Deok Man Kang, Jin Oh Park
  • Coil electronic component
    Patent number: 10902994
    Abstract: A coil electronic component includes a body including a plurality of insulating layers and coil patterns disposed on the insulating layers, and external electrodes formed on external surfaces of the body and connected to the coil patterns, wherein the external electrodes include first layers being electroless plating layers and second layers formed on the first layers and having a form in which metal particles are dispersed in a polymer base, respectively.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: January 26, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chi Seong Kim, Jun Il Kang, Sa Yong Lee, Gun Hwi Hyung
  • COIL ELECTRONIC COMPONENT
    Publication number: 20190115145
    Abstract: A coil electronic component includes a body including a plurality of insulating layers and coil patterns disposed on the insulating layers, and external electrodes formed on external surfaces of the body and connected to the coil patterns, wherein the external electrodes include first layers being electroless plating layers and second layers formed on the first layers and having a form in which metal particles are dispersed in a polymer base, respectively.
    Type: Application
    Filed: May 24, 2018
    Publication date: April 18, 2019
    Inventors: Chi Seong KIM, Jun Il KANG, Sa Yong LEE, Gun Hwi HYUNG