Patents by Inventor Gun-Yong Lee

Gun-Yong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240146953
    Abstract: There is provided a method of decoding an image, the method comprising: decoding information for motion information prediction of a current block from a bitstream, predicting motion information of the current block based on the information, refining motion information of the current block by using the decoded information and the predicted motion information of the current block and reconstructing the current block based on the refined motion information of the current block.
    Type: Application
    Filed: December 22, 2023
    Publication date: May 2, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Gun BANG, Hui Yong KIM, Gwang Hoon PARK, Woo Woen GWUN, Tae Hyun KIM, Won Jun LEE
  • Publication number: 20240125334
    Abstract: An air compressor according to an aspect of the present invention comprises: a housing; a rotating shaft which is disposed in the housing; a compression unit which is connected to the rotating shaft to compress and discharge inlet air; a motor unit which drives the rotating shaft; a control board which controls the motor unit; and a filter unit which filters out noise from external power and supplies the external power to the control board, wherein the housing includes a first cooling flow channel for cooling the motor unit and a second cooling flow channel for cooling the filter unit, and the first cooling flow channel communicates with the second cooling flow channel.
    Type: Application
    Filed: March 30, 2022
    Publication date: April 18, 2024
    Inventors: Kyu Sung CHOI, Hyun Chil KIM, Gun Woong PARK, Min Gyu PARK, Chi Yong PARK, Yeol Woo SUNG, Hyun Sup YANG, Jong Sung LEE
  • Patent number: 6479755
    Abstract: A printed circuit board and a pad apparatus having a solder deposit formed on the pad apparatus by using a mask having a slit are provided. The slit has the same shape as the solder deposit. The solder deposit includes first and second end portions individually shaped and sized to completely cover at an end portion of the pad a predetermined area of an end portion of the pad, the area defined by both the entire width of the pad and a predetermined length from the end of the pad. A connection web extends between the two end portions to integrate the two end portions into a single structure and is a longitudinal part having a width smaller than any one of both the width of the pad and the width of each of the two end portions. First and second trapezoidal portions are respectively formed at junctions between opposite ends of said connection web and one of the two end portions. The mask has a slit formed at a position corresponding to the position of the solder deposit.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: November 12, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Haeng-Il Kim, Gun-Yong Lee, Kwang-Soo Jung
  • Patent number: 6168068
    Abstract: Disclosed is a method of preventing a gold plate connector of a printed circuit board (PCB) from being contaminated during a soldering process. The disclosed method prevents the gold plate connector coupled with the printed circuit board from being contaminated during wave soldering of the printed circuit board after spreading flux over the printed circuit board on which electronic components are mounted, and the method includes the steps of: forming a strip mask in a form of a membrane by solidifying a masking solution after spreading the masking solution capable of being solidified over the gold plate connector of the printed circuit board, performing the spreading of the masking solution before the spreading of the flux; and removing the strip mask from the gold plate connector after performing the wave soldering. As a result, it is not necessary to perform a washing operation of the gold plate connector. The washing operation can be troublesome, time-consuming, and inconvenient.
    Type: Grant
    Filed: September 3, 1998
    Date of Patent: January 2, 2001
    Assignee: Samsung Electronic Co, Ltd.
    Inventors: Gun-Yong Lee, Masaharu Tsukue, Choul-Su Kim
  • Patent number: D695345
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: December 10, 2013
    Assignee: KT Corporation
    Inventors: Hae-Jung Park, Heon-Moon Lim, Gun-Yong Lee, Min-Yong Kwon, Kyung Lee, Sung-Ju Hong