Patents by Inventor Gun Young GIL

Gun Young GIL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the composition
    Patent number: 10392499
    Abstract: An inorganic filler included in an epoxy resin composition includes a coating layer formed on a surface thereof, and the surface of the coating layer includes at least two elements selected from the group consisting of C, N and O.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: August 27, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sung Jin Yun, Jae Man Park, Hyun Gu Im, Jin A Gu, Gun Young Gil, Se Woong Na, Sang A Ju
  • Epoxy resin composite and printed circuit board comprising insulating layer using the same
    Patent number: 10280289
    Abstract: An epoxy resin composition according to one embodiment of the present invention comprises an epoxy resin, a curing agent, and an inorganic filler, and the inorganic filler includes boron nitride on which a metal oxide film is formed.
    Type: Grant
    Filed: April 16, 2015
    Date of Patent: May 7, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jina Gu, Gun Young Gil, Jae Man Park, Sung Jin Yun
  • INORGANIC FILLER, EPOXY RESIN COMPOSITION INCLUDING THE SAME AND LIGHT EMITTING ELEMENT INCLUDING INSULATING LAYER USING THE COMPOSITION
    Publication number: 20170130033
    Abstract: An inorganic filler included in an epoxy resin composition includes a coating layer formed on a surface thereof, and the surface of the coating layer includes at least two elements selected from the group consisting of C, N and O.
    Type: Application
    Filed: June 19, 2015
    Publication date: May 11, 2017
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sung Jin YUN, Jae Man PARK, Hyun Gu IM, Jin A GU, Gun Young GIL, Se Woong NA, Sang A JU
  • EPOXY RESIN COMPOSITE AND PRINTED CIRCUIT BOARD COMPRISING INSULATING LAYER USING THE SAME
    Publication number: 20170051133
    Abstract: An epoxy resin composition according to one embodiment of the present invention comprises an epoxy resin, a curing agent, and an inorganic filler, and the inorganic filler includes boron nitride on which a metal oxide film is formed.
    Type: Application
    Filed: April 16, 2015
    Publication date: February 23, 2017
    Inventors: Jina Gu, Gun Young Gil, Jae Man Park, Sung Jin Yun
  • Epoxy resin compound and radiant heat circuit board using the same
    Patent number: 9282637
    Abstract: There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.
    Type: Grant
    Filed: August 16, 2013
    Date of Patent: March 8, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sung Jin Yun, Hyuk Soo Lee, In Hee Cho, Jae Man Park, Myeong Jeong Kim, Jong Heum Yoon, Jeung Ook Park, Jong Sik Lee, Gun Young Gil, Thanh Kieu Giang, Jin Hwan Kim
  • METHOD OF FABRICATING SILICON CARBIDE
    Publication number: 20140209838
    Abstract: A method of fabricating silicon carbide according to the embodiment comprises the steps of preparing a mixture by mixing a silicon source comprising silicon with a solid carbon source or a carbon source comprising an organic carbon compound; supplying binder into the mixture to granulate the mixture; and reacting the granulated mixture.
    Type: Application
    Filed: August 8, 2012
    Publication date: July 31, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Jung Eun Han, Byung Sook Kim, Gun Young Gil
  • EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME
    Publication number: 20140048316
    Abstract: There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.
    Type: Application
    Filed: August 16, 2013
    Publication date: February 20, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sung Jin YUN, Hyuk Soo LEE, In Hee CHO, Jae Man PARK, Myeong Jeong KIM, Jong Heum YOON, Jeung Ook PARK, Jong Sik LEE, Gun Young GIL, Thanh Kieu GIANG, Jin Hwan KIM