Abstract: The inventive method enables chips (1) to be separated without damaging them, which have exposed sensitive micromechanical structures, from the group of wafers by means of standard parting-off grinding processes. During the parting-off grinding process, the micromechanical structures are covered with a thermofilm (4) thereby protecting them. The parting-off grinding, referred to as cutting (6) for short, ensues from the front side of the wafer with the aid of cutting marks (5) on the wafer. During this, the protective film (4) is completely cut through. After cutting, heat is used to detach the protective film from the separated chips (8) without leaving remnants thereon and without force acting upon the micromechanical structures. The separated chips are held by a supporting film onto which the semiconductor wafer is drawn before the cutting step (6). The properties of the supporting film are not modified during the heat treatment of the protective film.

Abstract: A deflector (2) for installation in the tow-line (4, 5) between a towing vessel and a tow which is located in the water, e.g. a cable with seismic sources or a seismic source array, is suspended by a float (1) and has a fitting (9) therefrom having a tow-point (7) near the front part of the deflector connected to the tow-line (4), and an attachment point (8) to the rear of the deflector for further connection thereto of the rear part of the tow-line connected to the two. In order to be able to locate the deflector in a desired position in relation to the towing vessel and compensate for alternations in the effects of forces from the tow or vessel in addition to movements in the water, the tow-line (5) which leads on to the actual tow from the deflector body (2) is attached (8) to the deflector via a pivotable lever (10) which is situated at the same height as the lifting force center of the deflector body.