Abstract: Described are techniques for quality analysis using thermographic imaging. In one example, a system including a test chamber for receiving an unpowered component. The system further includes an external heat source for heating the unpowered component for a predetermined period of time. The system further includes a thermographic imaging system for collecting thermographic images of the unpowered component during the predetermined period of time. The system further includes a computer communicatively coupled to the thermographic imaging system and configured to classify a quality of the unpowered component based on the thermographic images of the unpowered component.

Abstract: A system and a method for a hardware security module having enhanced security features is disclosed. The hardware security module includes a card configured to be plugged into a computer system and at least one cryptographic chip disposed on the card. A security cover is placed over and encloses the cryptographic chip. The security cover has a first half and a second half. The first half of the security cover is located on the first side of the card, and the second half of the security cover is located on a second side of the card. To enhance the security a flex cable that has at least one sensor or circuitry configured to detect tampering with the hardware security module is embedded within the material of the security cover.

Abstract: Embodiments are directed to short and/or near short etch rework. A microfluidic device is positioned on a portion of a circuit having a defect. The microfluidic device is caused to dispense etchant that removes the defect of the circuit, where a flow of the etchant is controlled to access the portion of the circuit having the defect to thereby etch away the defect, the flow of the etchant being obstructed from accessing other portions of the circuit. The microfluidic device is used to extract the etchant from the portion of the circuit such that the etchant avoids contact with the other portions of the circuit. The microfluidic device is removed from the circuit.

Abstract: The present disclosure describes embedding thermally-resistant flexible cabling within a metal casting during die-casting. A die-casting process may include fixing the thermally-resistant flexible cabling within a die, and die-casting the metal to form a metal casting having the thermally-resistant flexible cabling embedded within the metal casting. In some cases, the thermally-resistant flexible cabling may be utilized for grounding of the metal casting.

Abstract: A computer-implemented method includes receiving, by an integrated development environment (IDE), a stack trace that comprises a plurality of function calls, the IDE is initiated in a 3-dimensional (3D) virtual reality environment for analyzing a computer application. The method further includes accessing, by the IDE, a first source-code file that includes a first function call from the stack trace, and accessing a second source-code file that includes a second function call from the stack trace, the second function call being inside a first function corresponding to the first function call. The method further includes displaying, by the IDE, in the 3D virtual reality environment a first representation of the first source-code file, a second representation of the second source-code file, and a link between the first representation and the second representation.

Abstract: The present disclosure describes embedding thermally-resistant flexible cabling within a metal casting during die-casting. A die-casting process may include fixing the thermally-resistant flexible cabling within a die, and die-casting the metal to form a metal casting having the thermally-resistant flexible cabling embedded within the metal casting. In some cases, the thermally-resistant flexible cabling may be utilized for grounding of the metal casting.