Abstract: An edge crack monitoring system for an integrated circuit provided on a die, comprises a conductive trace comprising at least a first conductive path for allowing current in a first direction, and a second adjacent conductive path for allowing current in a second direction opposite to the first direction. Both adjacent conductive paths form at least one loop surrounding a semiconductor device on a die. The arrangement of the trace is adapted to provide compensation of EM interferences. The trace comprises two terminals being connectable to a detection circuit for detecting damages by generating a fault signal upon detection of disruption of the conductive trace due to a damage. The conductive trace comprises high resistance portions with a resistance of at least 1 k?, adapted for reducing self-resonance.

Abstract: A device for position sensing comprises sensing means arranged for producing at least two sensor signals, and a signal construction unit. The signal construction unit comprises selection means for selecting in a serial way one of at least two time-synchronous signals, sampling means for sampling a selected time-synchronous signal at given sampling instants, storage means for storing sampled data representing the selected time-synchronous signal and timing information indicating which of the given sampling instants were used to obtain the sampled data, and processing means for determining at one of the given sampling instants a value for at least one of said time-synchronous signals that was not sampled at the one given sampling instant by performing an interpolation using data values of the at least one time synchronous signal stored in the storage means and obtained at another point in time than the one given sampling instant.

Abstract: An edge crack monitoring system for an integrated circuit provided on a die, comprises a conductive trace comprising at least a first conductive path for allowing current in a first direction, and a second adjacent conductive path for allowing current in a second direction opposite to the first direction. Both adjacent conductive paths form at least one loop surrounding a semiconductor device on a die. The arrangement of the trace is adapted to provide compensation of EM interferences. The trace comprises two terminals being connectable to a detection circuit for detecting damages by generating a fault signal upon detection of disruption of the conductive trace due to a damage. The conductive trace comprises high resistance portions with a resistance of at least 1 k?, adapted for reducing self-resonance.

Abstract: An edge crack monitoring system for an integrated circuit provided on a die, comprises a conductive trace comprising at least a first conductive path for allowing current in a first direction, and a second adjacent conductive path for allowing current in a second direction opposite to the first direction. Both adjacent conductive paths form at least one loop surrounding a semiconductor device on a die. The arrangement of the trace is adapted to provide compensation of EM interferences. The trace comprises two terminals being connectable to a detection circuit for detecting damages by generating a fault signal upon detection of disruption of the conductive trace due to a damage. The conductive trace comprises high resistance portions with a resistance of at least 1 k?, adapted for reducing self-resonance.

Abstract: A device for position sensing comprises sensing means arranged for producing at least two sensor signals, and a signal construction unit. The signal construction unit comprises selection means for selecting in a serial way one of at least two time-synchronous signals, sampling means for sampling a selected time-synchronous signal at given sampling instants, storage means for storing sampled data representing the selected time-synchronous signal and timing information indicating which of the given sampling instants were used to obtain the sampled data, and processing means for determining at one of the given sampling instants a value for at least one of said time-synchronous signals that was not sampled at the one given sampling instant by performing an interpolation using data values of the at least one time synchronous signal stored in the storage means and obtained at another point in time than the one given sampling instant.

Abstract: An edge crack monitoring system for an integrated circuit provided on a die, comprises a conductive trace comprising at least a first conductive path for allowing current in a first direction, and a second adjacent conductive path for allowing current in a second direction opposite to the first direction. Both adjacent conductive paths form at least one loop surrounding a semiconductor device on a die. The arrangement of the trace is adapted to provide compensation of EM interferences. The trace comprises two terminals being connectable to a detection circuit for detecting damages by generating a fault signal upon detection of disruption of the conductive trace due to a damage. The conductive trace comprises high resistance portions with a resistance of at least 1 k?, adapted for reducing self-resonance.

Abstract: An integrated circuit device comprises an internal pull up current source Ipup and a pull up resistor Rpup connected in parallel between a voltage supply pin Vs and an output node OUT. A standby switch SBY is connected in series with the pull up resistor Rpup. The standby switch SBY is controlled by a standby detect means SBY Detect, which is also connected to the output node OUT. If it is desired to switch the device to standby mode, the output node OUT is externally drawn to ground by microprocessor 200. The circuit stays in the standby mode as long as the OUT is drawn to ground. In order to save current during standby mode, the SBY Detect is operable to disconnect the pull-up resistance Rpup by means of switch SBY. As the pull-up resistance Rpup is disconnected during the standby mode, the current source Ipup supplies a minimal current to OUT. This ensures that the circuit can always leave an undesired standby mode rapidly.