Patents by Inventor Gunnar Petersen
Gunnar Petersen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240395984Abstract: In an embodiment an optoelectronic component includes at least one semiconductor component configured to emit light of a first wavelength through a surface and a converter layer arranged on the surface of the at least one semiconductor component, the converter layer configured to convert the light of the first wavelength into light of a second wavelength, wherein a portion of the converter layer comprises a wavelength-selective mirror for a range of the first wavelength.Type: ApplicationFiled: September 7, 2022Publication date: November 28, 2024Inventors: Daniel Richter, Gunnar Petersen, Simon Schwalenberg
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Publication number: 20240395994Abstract: A component comprising a plurality of semiconductor chips and a carrier is disclosed, wherein the carrier has a common metallic carrier layer with a mounting surface on which the semiconductor chips are arranged. The semiconductor chips are thermally but not electrically conductively connected to the common metallic carrier layer. The carrier has a plurality of contact layers, which are arranged next to one another and next to the common carrier layer in lateral directions and are configured for electrically contacting the component and thus for electrically contacting the semiconductor chips. The carrier has an electrically insulating housing material which holds the common metallic carrier layer and the contact layers together, wherein the common metallic carrier layer and the contact layers are adjacent to the housing material and are electrically insulated from one another by the electrically insulating housing material.Type: ApplicationFiled: September 23, 2022Publication date: November 28, 2024Inventors: Gunnar PETERSEN, Andreas REITH, Daniel RICHTER
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Publication number: 20240379912Abstract: The invention relates to an optoelectronic semiconductor layer sequence comprising:—an active layer for generating radiation, and—at least one filter layer configured to at least partially absorb the electromagnetic radiation generated by the active layer of wavelengths smaller than a predetermined cutoff wavelength. The invention also relates to an optoelectronic semiconductor device.Type: ApplicationFiled: September 12, 2022Publication date: November 14, 2024Applicant: ams-OSRAM International GmbHInventors: Daniel RICHTER, Gunnar PETERSEN
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Publication number: 20240313172Abstract: A includes A) providing a wafer having a plurality of semiconductor regions for each of the optoelectronic semiconductor chips, B) applying a color conversion layer directly onto the wafer, the color conversion layer being applied continuously over the plurality of the semiconductor regions, C) performing a color correction so that a color conversion strength of the color conversion layer is locally reduced and D) separating the wafer into the semiconductor chips, wherein the steps are performed in the recited order, and wherein the step C) includes one of the following three possibilities: 1) creating a plurality of cracks and/or bubbles within the color conversion layer, 2) delaminating the color conversion layer locally directly from an emission side of the semiconductor regions, or 3) performing a thickness reduction of the color conversion layer from a top surface, wherein the color conversion layer includes at least one intermediate layer, and wherein the intermediate layer is a mirror layer.Type: ApplicationFiled: July 5, 2022Publication date: September 19, 2024Inventors: Gunnar Petersen, Daniel Richter
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Publication number: 20240262683Abstract: In an embodiment a method includes providing a coupling element with at least one predefined coupling point, arranging at least one component with a temporary alignment with the predefined coupling point, wherein the component comprises a decoupling point which is approximately aligned with the predefined coupling point of the coupling element, performing an assisted self-alignment of the component with the predefined coupling point, wherein the self-alignment is assisted by utilizing an action of a capillary force on an alignment material which is embedded in the component or attached to the component or by diverting the alignment material, and wherein the decoupling point of the component is moved to the predefined coupling point of the coupling element and adjusted, and permanent fixing of the component to the coupling element after carrying out the assisted self-alignment of the component.Type: ApplicationFiled: May 18, 2022Publication date: August 8, 2024Inventors: Nicole Berner, Daniel Richter, Gunnar Petersen
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Publication number: 20240234669Abstract: In embodiments, an optoelectronic lighting device includes at least one optoelectronic light source configured to generate light, at least one converter configured to generate converted light by converting the light and a thermally conductive substrate, wherein the converter is arranged on the substrate and the light source is arranged above the converter, wherein a mirror coating is arranged on a side of the light source facing away from the converter, wherein the mirror coating is configured to be transparent for the converted light and/or to reflect the light, wherein an upper side of the substrate, on which the converter is arranged, comprises a flat region and a rising region adjoining the flat region, and wherein the converter is located at least on the rising region.Type: ApplicationFiled: May 10, 2022Publication date: July 11, 2024Inventors: Daniel Richter, Gunnar Petersen
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Patent number: 11888097Abstract: An optoelectronic component (1) is specified, with at least one radiation-emitting semiconductor chip generating electromagnetic radiation during operation, a coating surrounding the at least one semiconductor chip in lateral directions, a magnetic structure covered by the coating, wherein the magnetic structure enables the component to be identified. Furthermore, a process for the manufacture of such an optoelectronic component is given.Type: GrantFiled: July 1, 2019Date of Patent: January 30, 2024Assignee: OSRAM OLED GmbHInventors: Konrad Wagner, Daniel Richter, Gunnar Petersen, Nicole Berner, Michael Förster
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Patent number: 11763731Abstract: A display apparatus includes a multiplicity of picture elements for emitting visible light in different colors in an adjustable manner by means of a plurality of semiconductor layer sequences. Each of the picture elements has a plurality of types of pixels and each type of pixels is configured for emitting light of a specific color. The pixels are each subdivided into a plurality of sub-pixel. All the sub-pixels are configured for emitting light of the same color out of the display apparatus without further color change. At least two sub-pixels within each pixel have emission areas of different sizes. An electrical control unit is assigned to each pixel. The control units are each configured to automatically control the sub-pixels of a relevant pixel depending on an energization intensity in such a way that a light-emitting area of the relevant pixel increases in stepped fashion with the energization intensity.Type: GrantFiled: April 27, 2020Date of Patent: September 19, 2023Assignee: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Brendan Holland, Gunnar Petersen, Daniel Richter
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Publication number: 20220367422Abstract: In an embodiment a method includes providing a moldable substrate, applying at least one semiconductor chip to a first main surface of the moldable substrate, introducing the semiconductor chip into the moldable substrate by deforming the moldable substrate such that the semiconductor chip is embedded into the moldable substrate proceeding from the first main surface, wherein at least one electrical contact of the semiconductor chip is freely accessible from an outside, wherein the semiconductor chip is a radiation-emitting flip-chip, and wherein a radiation exit surface of the flip-chip is free of electrical contacts, providing a carrier having at least one electrical connection location on a first main surface and applying the carrier to the first main surface of the moldable substrate after introducing the semiconductor chip into the moldable substrate such that the at least one electrical contact of the semiconductor chip is electrically contacted with the electrical connection location.Type: ApplicationFiled: July 23, 2020Publication date: November 17, 2022Inventors: Gunnar Petersen, Daniel Richter
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Publication number: 20220319400Abstract: A display apparatus includes a multiplicity of picture elements for emitting visible light in different colors in an adjustable manner by means of a plurality of semiconductor layer sequences. Each of the picture elements has a plurality of types of pixels and each type of pixels is configured for emitting light of a specific color. The pixels are each subdivided into a plurality of sub-pixel. All the sub-pixels are configured for emitting light of the same color out of the display apparatus without further color change. At least two sub-pixels within each pixel have emission areas of different sizes. An electrical control unit is assigned to each pixel. The control units are each configured to automatically control the sub-pixels of a relevant pixel depending on an energization intensity in such a way that a light-emitting area of the relevant pixel increases in stepped fashion with the energization intensity.Type: ApplicationFiled: April 27, 2020Publication date: October 6, 2022Inventors: Brendan HOLLAND, Gunnar PETERSEN, Daniel RICHTER
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Patent number: 11257705Abstract: A method of selecting semiconductor chips includes: A) providing the semiconductor chips in a composite, B) producing a cohesive, mechanical first connection between the semiconductor chips and a carrier film, C) singulating the semiconductor chips, wherein the carrier film mechanically connects the semiconductor chips to one another after singulation, D) selectively weakening the first connection between some singulated semiconductor chips and the carrier film, depending on electro-optical and/or electrical properties of the semiconductor chips, and E) removing the semiconductor chips whose first connection is selectively weakened from the carrier film.Type: GrantFiled: January 24, 2018Date of Patent: February 22, 2022Assignee: OSRAM OLED GmbHInventors: Daniel Richter, Gunnar Petersen, Konrad Wagner
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Publication number: 20210358348Abstract: A light emitting cell for use as a pixel, the light emitting cell being configured to generate the three primary colors and to form different color tones therewith, comprising: a light emitting front surface, a rear surface, and a substrate arranged between the front and rear surface; a light source carried by the substrate; three luminous sections, comprising a blue luminous section, a light converting red luminous section, and a light converting green luminous section; and a primary color selection device capable of performing a repetitive movement at a certain frequency so that, during this movement, one of the luminous sections is alternately selected as a potential light emitting section, characterized in that the primary color selection device is a single mechanical component that serves to select all three luminous sections.Type: ApplicationFiled: October 15, 2019Publication date: November 18, 2021Inventors: Gunnar PETERSEN, Daniel RICHTER, Michael FOERSTER, Nicole BERNER, Konrad WAGNER
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Publication number: 20210273144Abstract: An optoelectronic component (1) is specified, with at least one radiation-emitting semiconductor chip generating electromagnetic radiation during operation, a coating surrounding the at least one semiconductor chip in lateral directions, a magnetic structure covered by the coating, wherein the magnetic structure enables the component to be identified. Furthermore, a process for the manufacture of such an optoelectronic component is given.Type: ApplicationFiled: July 1, 2019Publication date: September 2, 2021Inventors: Konrad WAGNER, Daniel RICHTER, Gunnar PETERSEN, Nicole BERNER, Michael FÖRSTER
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Publication number: 20200090975Abstract: A method of selecting semiconductor chips includes: A) providing the semiconductor chips in a composite, B) producing a cohesive, mechanical first connection between the semiconductor chips and a carrier film, C) singulating the semiconductor chips, wherein the carrier film mechanically connects the semiconductor chips to one another after singulation, D) selectively weakening the first connection between some singulated semiconductor chips and the carrier film, depending on electro-optical and or electrical properties of the semiconductor chips, and E) removing the semiconductor chips whose first connection is selectively weakened from the carrier film.Type: ApplicationFiled: January 24, 2018Publication date: March 19, 2020Inventors: Daniel Richter, Gunnar Petersen, Konrad Wagner
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Patent number: 7987945Abstract: A method for regulating the traction in a line (13) of a ladder climbing assistance device, in which method any movement of the line (13) is sensed and in dependence of the sensed movement either increasing the traction in the line to a predetermined high level (L1), maintaining the traction at a predetermined high level (L1), or decreasing the traction to a predetermined low level (L0). Furthermore, a ladder climbing assistance device comprising a line (13) that is movable along the ladder (1) and a motor (8) with a power outlet arranged to provide an essentially constant traction in the line (13). The ladder climbing assistance device comprises sensing means (25) for sensing any movement of the line (13), which sensing means is connected to controlling means (26) for controlling the power outlet from the motor (8) in response to signals from the sensing means in the above-described manner.Type: GrantFiled: March 10, 2005Date of Patent: August 2, 2011Assignee: Avanti Stigefabrik A/SInventor: Peter Gunnar Petersen
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Patent number: 7607544Abstract: Apparatus for use to check potatoes or similar items, the apparatus including a feeding device for advancing the potatoes in a plurality of rows, a conveying device adapted to receive the rows of potatoes from the feeding device and advancing them while maintaining the row structure, at least one camera with associated image processor for recording and evaluating each individual potato on the conveying device and a sorting device controlled by the image processor, the sorting device being adapted to sort the potatoes. The conveying device includes a plurality of substantially horizontal rollers, the axes of rotation of the rollers extending parallel to the advance direction of the potatoes, the rollers being rotatably mounted in a support frame and connected with a first driving device for rotating the rollers. The rollers are each independently additionally displaceable in parallel forwards and backwards in a substantially straight line.Type: GrantFiled: December 22, 2004Date of Patent: October 27, 2009Assignee: Newtec Engineering A/SInventors: Gunnar Petersen, Anders Petersen
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Publication number: 20070144946Abstract: An apparatus for use to check potatoes or similar items comprises a feeding device (2) for advancing the potatoes in a plurality of rows, a conveying device (13) adapted to receive the rows of potatoes from the feeding device (2) and advancing them while maintaining the row structure, a camera (42) with associated image processing means for recording and evaluating each individual potato on the conveying device (13), and a sorting device (31) controlled by the image processing means, said sorting device being adapted to sort the potatoes. The conveying device (13) comprises a plurality of substantially horizontal rollers (14, 15), the axes of rotation of said rollers extending parallel to the advance direction (12) of the potatoes.Type: ApplicationFiled: December 22, 2004Publication date: June 28, 2007Inventors: Gunnar Petersen, Anders Petersen