Patents by Inventor Gunnar Petzold

Gunnar Petzold has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDERING MATERIAL BASED ON SN AG AND CU
    Publication number: 20220168851
    Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.
    Type: Application
    Filed: February 18, 2022
    Publication date: June 2, 2022
    Inventors: Hans-Jurgen Albrecht, Gunnar Petzold, Klaus Wilke, Klaus Heinrich Georg Bartl, Hector Andrew Steen, Klaus Muller, Werner Kruppa, Mathias Nowottnick, Klaus Wittke
  • Soldering material based on Sn Ag and Cu
    Patent number: 11285569
    Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: March 29, 2022
    Assignees: Henkel AG & Co. KGaA, Heraeus Duetschland GmbH & Co. KG, Alpha Assembly Solutions Inc.
    Inventors: Hans-Jurgen Albrecht, Gunnar Petzold, Klaus Wilke, Klaus Heinrich Georg Bartl, Hector Andrew Hamilton Steen, Klaus Muller, Werner Kruppa, Mathias Nowottnick, Klaus Wittke
  • SOLDERING MATERIAL BASED ON SN AG AND CU
    Publication number: 20200023472
    Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.
    Type: Application
    Filed: August 2, 2019
    Publication date: January 23, 2020
    Inventors: Hans-Jurgen Albrecht, Gunnar Petzold, Klaus Wilke, Klaus Heinrich Georg Bartl, Hector Andrew Hamilton Steen, Klaus Muller, Werner Kruppa, Mathias Nowottnick, Klaus Wittke
  • Soldering material based on Sn Ag and Cu
    Patent number: 10376994
    Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.
    Type: Grant
    Filed: April 21, 2004
    Date of Patent: August 13, 2019
    Inventors: Hans-Jürgen Albrecht, Klaus Heinrich Georg Bartl, Werner Kruppa, Klaus Müller, Mathias Nowottnick, Gunnar Petzold, Hector Andrew Hamilton Steen, Klaus Wilke, Klaus Wittke
  • Soldering material based on sn ag and cu
    Publication number: 20070036671
    Abstract: The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.
    Type: Application
    Filed: April 21, 2004
    Publication date: February 15, 2007
    Inventors: Hans-Jurgen Albrecht, Klaus Bartl, Werner Kruppa, Klaus Muller, Mathias Nowottnick, Gunnar Petzold, Hector Andrew Steen, Klaus Wilke, Klaus Wittke
  • Substrate for producing a soldering connection to a second substrate
    Publication number: 20060237855
    Abstract: A substrate for producing a soldering connection to a second substrate is disclosed. Soldering pads are distributed on the substrate surface. Solder balls can be applied to these pads. A soldering pad has a top side area and side areas connected to a conductor track. A soldering mask with openings in the region of the soldering pads is applied to the substrate. A soldering pad is provided with holding mechanism for the solder balls in such a way that, within the top side area of the soldering pad, a depression is introduced in the direction of the substrate or an elevation rising above the top side area is applied.
    Type: Application
    Filed: March 29, 2006
    Publication date: October 26, 2006
    Inventors: Steffen Kroehnert, Gunnar Petzold, Jens Oswald, Martin Reiss, Oliver Grassme, Kerstin Nocke, Knut Kahlisch, Soo Park