Abstract: A method for producing a heat transfer member wherein at a first step a work piece (1) is produced comprising a curved base portion (2) with an outer (3) surface, an inner (4) surface, and a number of flanges (5) projecting from the outer surface and in a second step the heat transfer member is formed by straightening out the base portion (2) so that it becomes essentially plane The work piece in the first step is produced so that the distance (a, b) between the outer and the inner surface of the base portion is increasing from its ends towards its central part.

Abstract: A method of producing a heat transfer device comprising a base (1) and a number of flanges (2) projecting from the base (1), the device being formed with the flanges in a first mutual relation in a first operation and the base being subjected to at least partial deformation in a second operation so that the flanges projecting from the deformed portion of the base are brought into a second mutual relation, the flanges being arranged at shorter mutual distances in the second relation than in the first relation.

Abstract: A semiconductor device comprises a semiconductor wafer arranged between metallic connecting members for supplying electric current to, and leading it from, the wafer, each connecting member having a substantially cylindrical external part. A ring of a sulphone polymer or of polyphenylene sulphide, which may be reinforced with glass fibre material, has portions of its internal peripheral surface surrounding and firmly engaged with the cylindrical parts of the connecting members, the ring and the connecting members forming a protective casing around the semiconductor wafer.