Patents by Inventor Gunphai Prateepphaisan

Gunphai Prateepphaisan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8514522
    Abstract: Systems for interconnecting magnetic heads of storage devices in a test assembly are provided. In one embodiment, the invention relates to a probe assembly for coupling a read head to a cavity gimbal assembly, the probe assembly including a plurality of conductive probes each including a body section including two substantially flat side surfaces and a bottom surface including a pad configured to be soldered to a corresponding pad of a laminated flexure of the cavity gimbal assembly, a spring section including an elongated arm extending away from the body section, the elongated arm shaped to make conductive contact with a pad on a trailing face of the read head, and a non-conductive adhesive layer attached to at least one of the two side surfaces, where each of the plurality of the conductive probes is attached to an adjacent one of the conductive probes by one of the adhesive layers.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: August 20, 2013
    Assignee: Western Digital (Fremont), LLC
    Inventors: Tzong-Shii Pan, Gunphai Prateepphaisan, Tahir A. Ali, Greg R. Knodel, Adisak Tokaew, Wayne Bonin
  • Patent number: 8089730
    Abstract: A suspension assembly includes a read head clamp attached to a flexure that includes structural, dielectric, and conductive layers. The clamp includes a cantilevered clamping arm sized so that its distal end is positioned to contact a leading face of a read head. The clamp also includes a wall positioned to face a trailing face of the read head. Each of a plurality of conductive probes defined in the structural layer is electrically connected to a corresponding one of a plurality of conductive traces defined in the conductive layer, by a plurality of conductive vias through the dielectric layer. Each of the plurality of conductive probes is bent out of the flexure plane and is positioned to contact the trailing face of the read head. A method for temporarily holding a read head is also disclosed.
    Type: Grant
    Filed: October 28, 2009
    Date of Patent: January 3, 2012
    Assignee: Western Digital (Fremont), LLC
    Inventors: Tzong-Shii Pan, Gunphai Prateepphaisan