Abstract: A pen-shaped input and/or output device and a method for generating a haptic signal are disclosed. In an embodiment a device includes an actuator unit comprising a piezoelectric actuator, wherein the device is a pen-shaped input and/or output device, and wherein the pen-shaped input and/or output device is configured to determine an acceleration based on voltages recorded by the piezoelectric actuator.

Abstract: A pen-shaped input and/or output device and a method for generating a haptic signal are disclosed. In an embodiment a device includes an actuator unit that has a piezoelectric actuator, wherein the device is a pen-shaped input and/or output device, wherein the pen-shaped input and/or output is configured to use the piezoelectric actuator as a sensor, wherein the piezoelectric actuator is configured to generate a voltage as a result of an actuation of the pen-shaped input and/or output device, and wherein the pen-shaped input and/or output device has a second electronics circuit configured to detect the voltage generated by the piezoelectric actuator and store a characteristic value for the voltage generated.

Abstract: A pen-shaped input and/or output device and a method for generating a haptic signal are disclosed. In an embodiment a device includes an actuator unit that has a piezoelectric actuator, wherein the device is a pen-shaped input and/or output device.

Abstract: A module (1) for contactless communication includes a plurality of electrical components (4, 5, 6, 7, 8) which each have at least two contact faces (9, 10, 11, 12, 13, 14, 15, 16) for the electrical connection. The electrical components (4, 5, 6, 7, 8) of the module are mounted both on a component side (MB) and an on adhesive side (MK) of a lead frame (M) formed by metal strips (MS). During the manufacture of the module (1) the metal strips (MS) of the lead frame (M) are held in one plane (E) and in position by means of an adhesive tape (K). The adhesive tape (K) has openings (A1, A2, A3, A4, A5, A6) at given positions of the lead frame (M) so as to enable electrical components to be mounted on the adhesive side (MK) of the lead frame (M).

Abstract: A module (1) for contactless communication includes a plurality of electrical components (4, 5, 6, 7, 8) which each have at least two contact faces (9, 10, 11, 12, 13, 14, 15, 16) for the electrical connection. The electrical components (4, 5, 6, 7, 8) of the module are mounted both on a component side (MB) and an on adhesive side (MK) of a lead frame (M) formed by metal strips (MS). During the manufacture of the module (1) the metal strips (MS) of the lead frame (M) are held in one plane (E) and in position by means of an adhesive tape (K). The adhesive tape (K) has openings (A1, A2, A3, A4, A5, A6) at given positions of the lead frame (M) so as to enable electrical components to be mounted on the adhesive side (MK) of the lead frame (M).

Abstract: The transmission coil (11) in a device (1) which includes a data carrier module (3) with a holding (4) and an integrated circuit (6) which is supported by the holding (4) and includes a transmission coil (11) which is electrically conductively connected to the integrated circuit (6) and to the holding (4), is covered, except for the area of its two coil connection contacts (13, 14), by a protective layer (16) of an electrically insulating material, a connection wire being provided between each coil connection contact (13, 14) and an associated circuit connection contact (7, 8), the integrated circuit (6) and the two connection wires (19, 20) and the areas of the two coil connection contacts (13, 14) which are not covered by the protective layer (16) being protectively covered by a single protective cap (10).