Abstract: A method for producing a nanoporous layer comprises applying a plating base with adhesion strengthening onto a substrate, depositing a layer made of gold and silver onto the substrate, the composition being in the range of 20% to 40% gold and 80% to 60% silver, and selectively removing the silver in order to produce a nanoporous gold layer.

Abstract: The invention relates to a method for producing a nanoporous layer, wherein a layer made of gold and silver is deposited onto a substrate, particularly in an electrochemical or galvanic fashion, wherein the composition of said layer lies between 20% and 40% gold and 80% to 60% silver. The silver is subsequently selectively removed in order to obtain a nanoporous gold layer.

Abstract: A UBM pad has a first material layer which has a first material, and a second material layer which has a second material and represents an end layer or is arranged between an end layer and the first material layer. The first material and the second material exhibit properties with regard to a solder material that the presence of the second material prevents any metallurgical reactions of the first material with the solder material in the entire temperature range of connecting and of the operation of the structured electronic device which are detrimental to the reliability of the overall joint.

Abstract: The invention relates to a plug connector comprising an insulation displacement contact carrier which accommodates insulation displacement contacts, and a plug contact carrier which accommodates plug contacts. The plug connector further comprises a housing which connects the insulation displacement contact carrier with the plug contact carrier. The insulation displacement contact carrier is provided with a thread for a first coupling ring and the plug contact carrier is provided with a connecting section for a complementary plug connector.