Abstract: The invention relates to an impregnating resin formulation containing a component A which contains an unsaturated polyester resin comprising allyethers, a component B which contains dicyclopentadiene terminated, unsaturated polyester resin which is different from the component A, a component C which contains an additional unsaturated polymer which is different from polyester resins of components A and B, and, optionally, hardeners, accelerators, stabilizers, additives and rheology additives. Said invention also relates to the use thereof in order to impregnate windings for the production of base materials of flat isolating material and in order to cover printed circuit boards.

Abstract: The present invention relates to microcapsules containing polymerization initiators, a process for their preparation and their use.

Abstract: The invention comprises a process for impregnating components with polymerizable impregnants which are liquid at room temperature or can be liquefied by heating and are cured by combined use of heat and high-energy radiation, wherein the components are impregnated at ambient temperature or in a preheated state and, after impregnation, are heated in the impregnant until partial gelation occurs, are treated with high-energy radiation before full curing and are then fully cured by thermal means.