Patents by Inventor Gunter Herklotz

Gunter Herklotz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6610086
    Abstract: A radially expandable support structure is presented, for keeping open lumina within a body, in particular a blood vessel, having a tube-shaped structure that has at least two partial structures, with a wall surface that extends between a first and a second end, which has several cut out areas, in particular, slits, which are essentially oriented parallel to the longitudinal axis of the tube-shaped structure. At least one of the partial structures (11) extend without interruption in the axial direction generally from the first end to the second end of the tube-shaped structure. A first partial structure (1, 2) can be expanded at least in the radial direction and has at least one radial-expansion component. The individual radial expansion components (12, 13) are arranged as a helix or in a helix shape. A second partial structure (11) is generally almost rigid in the axial direction.
    Type: Grant
    Filed: June 28, 1999
    Date of Patent: August 26, 2003
    Assignee: W. C. Heraeus GmbH & Co. KG
    Inventors: Wulf Kock, Günter Herklotz, Matthias Frericks, Jens Trötzschel
  • Patent number: 6355363
    Abstract: A support structure is provided for holding open lumina, the support structure having a stainless steel substrate and a platinum layer forming the surface of the structure. The structure has at least one gold layer arranged between the substrate and the platinum layer. The platinum layer is preferably applied with a pulsed current with current reversal, in order to avoid or reduce brittleness occurring by absorption of hydrogen during galvanic deposition of platinum. Such a support structure (stent) substantially withstands the high mechanical stresses, particularly bending and torsional forces that occur during application, without the formation of significant tears in the platinum layer.
    Type: Grant
    Filed: February 16, 2000
    Date of Patent: March 12, 2002
    Assignee: W. C. Hereaus GmbH & Co. KG
    Inventors: Günter Herklotz, Frank Krüger, Thomas Frey, Thomas Giesel
  • Patent number: 6352634
    Abstract: A method for the manufacture of a leadless substrate with a basic body made of copper or copper base alloy, a solder layer applied to at least one portion of the basic body and made of metals belonging to the group of gold, gold alloy, silver, silver alloy, palladium, and palladium alloy, as well as an intermediate layer arranged between the basic body and the solder layer and made of nickel or nickel alloy, wherein the solder layer consists of at least two separate layers made of different metals and wherein the intermediate layer and the separate layers are deposited by electroplating, characterized in that at least one separate layer is made of silver or silver alloy.
    Type: Grant
    Filed: February 1, 2000
    Date of Patent: March 5, 2002
    Assignee: W. C. Heraeus GmbH & Co. KG
    Inventors: Heinz Förderer, Thomas Frey, Günter Herklotz
  • Patent number: 6264688
    Abstract: A radially expandable support structure is provided, for keeping open lumina within a body, in particular a blood vessel, having a tube-shaped body that has at least two partial structures, with a wall surface that extends between a first and a second end, which has several cut out areas, in particular, slits, which are essentially oriented parallel to the longitudinal axis of the tube-shaped structure. At least one partial structure (11) extends without interruption in the axial direction generally from the first end to the second end of the tube-shaped body. The first partial structure (1, 2) can be expanded at least in the radial direction and has at least one radial-expansion component. Individual radial expansion components (12, 13) are arranged as rings or in a ring shape, and the second partial structure (11) is almost rigid in the axial direction.
    Type: Grant
    Filed: June 28, 1999
    Date of Patent: July 24, 2001
    Assignee: W. C. Heraeus GmbH & Co. KG
    Inventors: Günter Herklotz, Jens Trötzschel
  • Patent number: 6242106
    Abstract: A fine wire made of an alloy of gold which contains 0.6 to 2 weight % of nickel, or an alloy of gold which contains 0.1 to 2 weight % of nickel, 0.0001 to 0.1 weight % of alkaline earth metal and/or rare earth metal, and optionally 0.1 to 1.0 weight % of platinum and/or palladium . The fine wire is distinguished by a favorable electrical conductivity and a good ratio of strength to elongation. The fine wire is suitable both for wire bonding of semiconductor devices and for producing the ball bumps of flip-chips.
    Type: Grant
    Filed: May 5, 1999
    Date of Patent: June 5, 2001
    Assignee: W. C. Hereaeus GmbH & Co. KG
    Inventors: Günter Herklotz, Lutz Schräpler, Christoph Simons, Jürgen Reuel, Y. C. Cho
  • Patent number: 5766405
    Abstract: A process and apparatus for producing a laminate containing a metal foil strip and a plastic film strip, in which the two strips have stamped structures repeated at regular intervals in the longitudinal direction of the strips and are disposed at contiguous points in the laminate, a pre-stamped strip and the second strip being continuously joined together from one end.
    Type: Grant
    Filed: March 26, 1997
    Date of Patent: June 16, 1998
    Assignee: W.C. Heraeus GmbH
    Inventors: Gunter Herklotz, Karl-Heinz Ullrich, Thomas Loose, Friedrich Lach, Alfred Bauer, Horst Hartmann
  • Patent number: 5656110
    Abstract: A process and apparatus for producing a laminate containing a metal foil strip and a plastic film strip, in which the two strips have stamped structures repeated at regular intervals in the longitudinal direction of the strips and are disposed at contiguous points in the laminate, a pre-stamped strip and the second strip being continuously joined together from one end.
    Type: Grant
    Filed: December 2, 1994
    Date of Patent: August 12, 1997
    Assignee: W.C. Heraeus GmbH
    Inventors: Gunter Herklotz, Karl-Heinz Ullrich, Thomas Loose, Friedrich Lach, Alfred Bauer, Horst Hartmann
  • Patent number: 5514261
    Abstract: Silver-tin alloys can be deposited by the galvanic method from a cyanide-free bath which is prepared using silver as the nitrate or diammine complex, tin as the soluble tin(II) or tin(IV) compound and mercaptoalkane-carboxylic acids and -sulfonic acids, Uniform and adhering coatings of silver-tin alloys with a silver content of approximately 20 to 99 weight % can be deposited from said bath. Silver-tin alloys are electrodeposited from said bath at a pH of 0 to 14 and a current density of 0.1 to 10 A/dm.sup.2.
    Type: Grant
    Filed: January 30, 1995
    Date of Patent: May 7, 1996
    Assignee: W. C. Heraeus GmbH
    Inventors: Gunter Herklotz, Thomas Frey, Wolfgang Hempel
  • Patent number: 5486721
    Abstract: Lead frames completely surface-plated with palladium have a nickel-phosphorus or copper-tin layer between the base element, made for example of copper, and the palladium layer. Such lead frames exhibit good bondability and good solderability without tinning.
    Type: Grant
    Filed: March 31, 1994
    Date of Patent: January 23, 1996
    Assignee: W.C. Heraeus GmbH
    Inventors: Gunter Herklotz, Heinz Forderer, Thomas Frey
  • Patent number: 5438175
    Abstract: A thin galvanically deposited gold-containing surface layer is backed by a support layer containing a palladium alloy and having a thickness between 0.05 .mu.m and 0.5 .mu.m. In a preferred embodiment the surface layer and the support layer have a combined thickness of less than 0.5 .mu.m.
    Type: Grant
    Filed: December 2, 1993
    Date of Patent: August 1, 1995
    Assignee: W. C. Heraeus GmbH
    Inventors: Gunter Herklotz, Bernd Gehlert, Thomas Frey
  • Patent number: 5422451
    Abstract: An electrical contact element having a core part made of an iron/nickel alloy and a gold/tin alloy applied to a portion of the core part which serves as a solderable connection part. The gold/tin alloy has a tin content of from about 10 to about 40% by weight and an adhesive layer, formed of a silver/tin alloy and containing about 10 to 50% by weight tin, is located between the core part and the gold/tin alloy.
    Type: Grant
    Filed: June 21, 1993
    Date of Patent: June 6, 1995
    Assignee: W. C. Heraeus GmbH
    Inventor: Gunter Herklotz
  • Patent number: 4491507
    Abstract: Bright palladium coatings which are pore-free and free of fissures and have a low internal stress are produced by galvanic depositing from a bath which contains tetrammine palladium dibromide, ammonium bromide, sulfamic acid and/or ammonium sulfamate and nicotinic acid and/or nicotinamide.
    Type: Grant
    Filed: May 9, 1984
    Date of Patent: January 1, 1985
    Assignee: W. C. Heraeus GmbH
    Inventors: Gunter Herklotz, Gerhard Arnold