Patents by Inventor Gunter Herklotz
Gunter Herklotz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6610086Abstract: A radially expandable support structure is presented, for keeping open lumina within a body, in particular a blood vessel, having a tube-shaped structure that has at least two partial structures, with a wall surface that extends between a first and a second end, which has several cut out areas, in particular, slits, which are essentially oriented parallel to the longitudinal axis of the tube-shaped structure. At least one of the partial structures (11) extend without interruption in the axial direction generally from the first end to the second end of the tube-shaped structure. A first partial structure (1, 2) can be expanded at least in the radial direction and has at least one radial-expansion component. The individual radial expansion components (12, 13) are arranged as a helix or in a helix shape. A second partial structure (11) is generally almost rigid in the axial direction.Type: GrantFiled: June 28, 1999Date of Patent: August 26, 2003Assignee: W. C. Heraeus GmbH & Co. KGInventors: Wulf Kock, Günter Herklotz, Matthias Frericks, Jens Trötzschel
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Patent number: 6355363Abstract: A support structure is provided for holding open lumina, the support structure having a stainless steel substrate and a platinum layer forming the surface of the structure. The structure has at least one gold layer arranged between the substrate and the platinum layer. The platinum layer is preferably applied with a pulsed current with current reversal, in order to avoid or reduce brittleness occurring by absorption of hydrogen during galvanic deposition of platinum. Such a support structure (stent) substantially withstands the high mechanical stresses, particularly bending and torsional forces that occur during application, without the formation of significant tears in the platinum layer.Type: GrantFiled: February 16, 2000Date of Patent: March 12, 2002Assignee: W. C. Hereaus GmbH & Co. KGInventors: Günter Herklotz, Frank Krüger, Thomas Frey, Thomas Giesel
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Patent number: 6352634Abstract: A method for the manufacture of a leadless substrate with a basic body made of copper or copper base alloy, a solder layer applied to at least one portion of the basic body and made of metals belonging to the group of gold, gold alloy, silver, silver alloy, palladium, and palladium alloy, as well as an intermediate layer arranged between the basic body and the solder layer and made of nickel or nickel alloy, wherein the solder layer consists of at least two separate layers made of different metals and wherein the intermediate layer and the separate layers are deposited by electroplating, characterized in that at least one separate layer is made of silver or silver alloy.Type: GrantFiled: February 1, 2000Date of Patent: March 5, 2002Assignee: W. C. Heraeus GmbH & Co. KGInventors: Heinz Förderer, Thomas Frey, Günter Herklotz
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Patent number: 6264688Abstract: A radially expandable support structure is provided, for keeping open lumina within a body, in particular a blood vessel, having a tube-shaped body that has at least two partial structures, with a wall surface that extends between a first and a second end, which has several cut out areas, in particular, slits, which are essentially oriented parallel to the longitudinal axis of the tube-shaped structure. At least one partial structure (11) extends without interruption in the axial direction generally from the first end to the second end of the tube-shaped body. The first partial structure (1, 2) can be expanded at least in the radial direction and has at least one radial-expansion component. Individual radial expansion components (12, 13) are arranged as rings or in a ring shape, and the second partial structure (11) is almost rigid in the axial direction.Type: GrantFiled: June 28, 1999Date of Patent: July 24, 2001Assignee: W. C. Heraeus GmbH & Co. KGInventors: Günter Herklotz, Jens Trötzschel
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Patent number: 6242106Abstract: A fine wire made of an alloy of gold which contains 0.6 to 2 weight % of nickel, or an alloy of gold which contains 0.1 to 2 weight % of nickel, 0.0001 to 0.1 weight % of alkaline earth metal and/or rare earth metal, and optionally 0.1 to 1.0 weight % of platinum and/or palladium . The fine wire is distinguished by a favorable electrical conductivity and a good ratio of strength to elongation. The fine wire is suitable both for wire bonding of semiconductor devices and for producing the ball bumps of flip-chips.Type: GrantFiled: May 5, 1999Date of Patent: June 5, 2001Assignee: W. C. Hereaeus GmbH & Co. KGInventors: Günter Herklotz, Lutz Schräpler, Christoph Simons, Jürgen Reuel, Y. C. Cho
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Patent number: 5766405Abstract: A process and apparatus for producing a laminate containing a metal foil strip and a plastic film strip, in which the two strips have stamped structures repeated at regular intervals in the longitudinal direction of the strips and are disposed at contiguous points in the laminate, a pre-stamped strip and the second strip being continuously joined together from one end.Type: GrantFiled: March 26, 1997Date of Patent: June 16, 1998Assignee: W.C. Heraeus GmbHInventors: Gunter Herklotz, Karl-Heinz Ullrich, Thomas Loose, Friedrich Lach, Alfred Bauer, Horst Hartmann
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Patent number: 5656110Abstract: A process and apparatus for producing a laminate containing a metal foil strip and a plastic film strip, in which the two strips have stamped structures repeated at regular intervals in the longitudinal direction of the strips and are disposed at contiguous points in the laminate, a pre-stamped strip and the second strip being continuously joined together from one end.Type: GrantFiled: December 2, 1994Date of Patent: August 12, 1997Assignee: W.C. Heraeus GmbHInventors: Gunter Herklotz, Karl-Heinz Ullrich, Thomas Loose, Friedrich Lach, Alfred Bauer, Horst Hartmann
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Patent number: 5514261Abstract: Silver-tin alloys can be deposited by the galvanic method from a cyanide-free bath which is prepared using silver as the nitrate or diammine complex, tin as the soluble tin(II) or tin(IV) compound and mercaptoalkane-carboxylic acids and -sulfonic acids, Uniform and adhering coatings of silver-tin alloys with a silver content of approximately 20 to 99 weight % can be deposited from said bath. Silver-tin alloys are electrodeposited from said bath at a pH of 0 to 14 and a current density of 0.1 to 10 A/dm.sup.2.Type: GrantFiled: January 30, 1995Date of Patent: May 7, 1996Assignee: W. C. Heraeus GmbHInventors: Gunter Herklotz, Thomas Frey, Wolfgang Hempel
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Patent number: 5486721Abstract: Lead frames completely surface-plated with palladium have a nickel-phosphorus or copper-tin layer between the base element, made for example of copper, and the palladium layer. Such lead frames exhibit good bondability and good solderability without tinning.Type: GrantFiled: March 31, 1994Date of Patent: January 23, 1996Assignee: W.C. Heraeus GmbHInventors: Gunter Herklotz, Heinz Forderer, Thomas Frey
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Patent number: 5438175Abstract: A thin galvanically deposited gold-containing surface layer is backed by a support layer containing a palladium alloy and having a thickness between 0.05 .mu.m and 0.5 .mu.m. In a preferred embodiment the surface layer and the support layer have a combined thickness of less than 0.5 .mu.m.Type: GrantFiled: December 2, 1993Date of Patent: August 1, 1995Assignee: W. C. Heraeus GmbHInventors: Gunter Herklotz, Bernd Gehlert, Thomas Frey
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Patent number: 5422451Abstract: An electrical contact element having a core part made of an iron/nickel alloy and a gold/tin alloy applied to a portion of the core part which serves as a solderable connection part. The gold/tin alloy has a tin content of from about 10 to about 40% by weight and an adhesive layer, formed of a silver/tin alloy and containing about 10 to 50% by weight tin, is located between the core part and the gold/tin alloy.Type: GrantFiled: June 21, 1993Date of Patent: June 6, 1995Assignee: W. C. Heraeus GmbHInventor: Gunter Herklotz
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Patent number: 4491507Abstract: Bright palladium coatings which are pore-free and free of fissures and have a low internal stress are produced by galvanic depositing from a bath which contains tetrammine palladium dibromide, ammonium bromide, sulfamic acid and/or ammonium sulfamate and nicotinic acid and/or nicotinamide.Type: GrantFiled: May 9, 1984Date of Patent: January 1, 1985Assignee: W. C. Heraeus GmbHInventors: Gunter Herklotz, Gerhard Arnold