Abstract: A circuit arrangement with semiconductor elements arranged in chips is described. The circuit arrangement is characterized by at least one metal body (s1) for electrically contacting the semiconductor elements and for dissipating the heat produced by the semiconductor elements, said metal body (s1) being adapted to simultaneously function as the support for the semiconductor elements and the chips (c1) of the semiconductor elements being fastened on the body (s1).

Abstract: Substituted monocyclopentadienyl, monoindenyl, monofluorenyl or heterocyclopentadienyl complexes of chromium, molybdenum or tungsten, wherein at least one of the substituents of the cyclopentadienyl ring carries a rigid donor function which is not exclusively bonded through sp3-hybridized carbon or silicon atoms, and a process for polymerizing olefins.

Abstract: Substituted monocyclopentadienyl, monoindenyl, monofluorenyl and heterocyclopentadienyl complexes of chromium, molybdenum or tungsten in which at least one of the substituents on the cyclopentadienyl ring carries a donor function which is bonded rigidly, not exclusively via sp3-hybridized carbon or silicon atoms, and a process for the polymerization of olefins.

Abstract: Substituted monocyclopentadienyl, monoindenyl, monofluorenyl and heterocyclopentadienyl complexes of chromium, molybdenum or tungsten in which at least one of the substituents on the cyclopentadienyl ring carries a donor function which is bonded rigidly, not exclusively via sp3-hybridized carbon or silicon atoms, and a process for the polymerization of olefins.

Abstract: A mounting configuration of electric and/or electronic components, in particular electrolytic capacitors, on a printed circuit board is described. The printed circuit board is formed by at least two metallic plates insulated electrically from one another by an insulating layer that preferably conducts heat well and has holes for the connecting pins of the electric and/or electronic components. Through which holes the connecting pins are plugged and connected electrically to the respectively associated metallic plate.

Abstract: Substituted monocyclopentadienyl, monoindenyl, monofluorenyl and heterocyclopentadienyl complexes of chromium, molybdenum or tungsten in which at least one of the substituents on the cyclopentadienyl ring carries a donor function which is bonded rigidly, not exclusively via sp3-hybridized carbon or silicon atoms, and a process for the polymerization of olefins.

Abstract: A circuit arrangement with semiconductor elements arranged in chips is described. The circuit arrangement is characterized by at least one metal body (s1) for electrically contacting the semiconductor elements and for dissipating the heat produced by the semiconductor elements, said metal body (s1) being adapted to simultaneously function as the support for the semiconductor elements and the chips (c1) of the semiconductor elements being fastened on the body (s1).

Abstract: Substituted monocyclopentadienyl, monoindenyl, monofluorenyl and heterocyclopentadienyl complexes of chromium, molybdenum or tungsten in which at least one of the substituents on the cyclopentadienyl ring carries a donor function which is bonded rigidly, not exclusively via sp3-hybridized carbon or silicon atoms, and a process for the polymerization of olefins.

Abstract: Substituted monocyclopentadienyl, monoindenyl, monofluorenyl and heterocyclopentadienyl complexes of chromium, molybdenum or tungsten in which at least one of the substituents on the cyclopentadienyl ring carries a donor function which is bonded rigidly, not exclusively via sp3-hybridized carbon or silicon atoms, and a process for the polymerization of olefins.

Abstract: Substituted monocyclopentadienyl, monoindenyl, monofluorenyl and heterocyclopentadienyl complexes of chromium, molybdenum or tungsten in which at least one of the substituents on the cyclopentadienyl ring carries a donor function which is bonded rigidly, not exclusively via sp3-hybridized carbon or silicon atoms, and a process for the polymerization of olefins.

Abstract: A mounting configuration of electric and/or electronic components, in particular electrolytic capacitors, on a printed circuit board is described. The printed circuit board is formed by at least two metallic plates insulated electrically from one another by an insulating layer that preferably conducts heat well and has holes for the connecting pins of the electric and/or electronic components. Through which holes the connecting pins are plugged and connected electrically to the respectively associated metallic plate.

Abstract: Substituted monocyclopentadienyl, monoindenyl, monofluorenyl and heterocyclopentadienyl complexes of chromium, molybdenum or tungsten in which at least one of the substituents on the cyclopentadienyl ring carries a donor function which is bonded rigidly, not exclusively via sp3-hybridized carbon or silicon atoms, and a process for the polymerization of olefins.

Abstract: A housing configuration for a printed circuit board equipped with components, includes a housing with at least partially metallic housing walls as well as at least one metallic spring profile element. The spring profile element has a first and a second profile leg, which are connected to one another forming an essentially V-shaped profile cross section, and is inserted into a gap region between an edge of the printed circuit board and the housing wall. The first profile leg is connected to a ground terminal of the printed circuit board, and the second profile leg exerts an elastic spreading force as it bears against the housing wall and makes electrical contact with the latter.