Patents by Inventor Gunter Stiefvater

Gunter Stiefvater has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8125234
    Abstract: The invention relates to a probe card assembly comprising a stiffener (1), comprising a PCB (2) disposed in the stiffener (1), and comprising a spider (3) supported by the stiffener and the PCB (2), said spider comprising at least one probe (30) to test a wafer (5). This probe card assembly of the PCB (2) is supported in a loosely decoupled manner in the stiffener (1) to prevent transmission of high thermally-induced warping effects.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: February 28, 2012
    Assignee: Micronas GmbH
    Inventors: Günter Stiefvater, Wolfgang Hauser
  • Publication number: 20080303540
    Abstract: The invention relates to a probe card assembly comprising a stiffener (1), comprising a PCB (2) disposed in the stiffener (1), and comprising a spider (3) supported by the stiffener and the PCB (2), said spider comprising at least one probe (30) to test a wafer (5). This probe card assembly of the PCB (2) is supported in a loosely decoupled manner in the stiffener (1) to prevent transmission of high thermally-induced warping effects.
    Type: Application
    Filed: June 10, 2008
    Publication date: December 11, 2008
    Applicant: MICRONAS GmbH
    Inventors: Gunter Stiefvater, Wolfgang Hauser