Patents by Inventor Gunther Gronninger
Gunther Gronninger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8405065Abstract: An LED semiconductor body includes a semiconductor layer sequence which comprises a quantum structure which is intended to produce radiation and comprises at least one quantum layer and at least one barrier layer, wherein the quantum layer and the barrier layer are strained with mutually opposite mathematical signs.Type: GrantFiled: July 27, 2007Date of Patent: March 26, 2013Assignee: OSRAM Opto Semiconductors GmbHInventors: Günther Grönninger, Christian Jung, Peter Heidborn, Alexander Behres
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Patent number: 8194712Abstract: A monolithically integrated laser diode chip having a construction as a multiple beam laser diode, which, on a semiconductor substrate (3) comprised of GaAs, has at least two laser stacks (4a, 4b, 4c) which are arranged one above another and which each contain an active zone (7). The active zone (7) is in each case arranged between waveguide layers (8). The waveguide layers (8) each adjoin a cladding layer (6) at a side remote from the active zone. At least one of the waveguide layers (8) or cladding layers (6) of at least one laser stack (4a, 4b, 4c), comprises AlxGa1-xAs, where 0?x?1, and at least one additional material from main group III or V, such that the lattice mismatch between the at least one waveguide layer (8) or cladding layer (6) comprising the at least one additional element and the semiconductor substrate (3) composed of GaAs is reduced. This increases the lifetime of the laser diode chip.Type: GrantFiled: June 30, 2008Date of Patent: June 5, 2012Assignee: OSRAM Opto Semiconductors GmbHInventors: Martin Müller, Günther Grönninger, Alexander Behres
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Patent number: 7932526Abstract: An LED semiconductor body comprising a first radiation-generating active layer and a second radiation-generating active layer, the first active layer and the second active layer being arranged one above another in the vertical direction.Type: GrantFiled: December 13, 2006Date of Patent: April 26, 2011Assignee: OSRAM Opto Semiconductors GmbHInventors: Reiner Windisch, Günther Grönninger, Peter Heidborn, Christian Jung, Walter Wegleiter
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Patent number: 7875961Abstract: A semiconductor substrate, of GaAs with a semiconductor layer sequence applied on top of the substrate. The semiconductor layer sequence comprises a plurality of semiconductor layers of Al1-yGayAs1-xPx with 0?x?1 and 0?y?1. A number of the semiconductor layers respectively comprising a phosphorus component x which is greater than in a neighboring semiconductor layer lying thereunder in the direction of growth of the semiconductor layer sequence. Two semiconductor layers directly preceding the uppermost semiconductor layer of the semiconductor layer sequence have a smaller lattice constant than the uppermost layer.Type: GrantFiled: November 19, 2009Date of Patent: January 25, 2011Assignee: Osram Opto Semiconductors GmbHInventors: Norbert Linder, Günther Grönninger, Peter Heidborn, Klaus Streubel, Siegmar Kugler
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Publication number: 20100065890Abstract: A semiconductor substrate, of GaAs with a semiconductor layer sequence applied on top of the substrate. The semiconductor layer sequence comprises a plurality of semiconductor layers of Al1-yGayAs1-xPx with 0?x?1 and 0?y?1. A number of the semiconductor layers respectively comprising a phosphorus component x which is greater than in a neighboring semiconductor layer lying thereunder in the direction of growth of the semiconductor layer sequence. Two semiconductor layers directly preceding the uppermost semiconductor layer of the semiconductor layer sequence have a smaller lattice constant than the uppermost layer.Type: ApplicationFiled: November 19, 2009Publication date: March 18, 2010Inventors: Norbert Linder, Günther Grönninger, Peter Heidborn, Klaus Streubel, Siegmar Kugler
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Publication number: 20090302307Abstract: An LED semiconductor body includes a semiconductor layer sequence which comprises a quantum structure which is intended to produce radiation and comprises at least one quantum layer and at least one barrier layer, wherein the quantum layer and the barrier layer are strained with mutually opposite mathematical signs.Type: ApplicationFiled: July 27, 2007Publication date: December 10, 2009Applicant: OSRAM Opto Semiconductors GmbHInventors: Günther Grönninger, Christian Jung, Peter Heidborn, Alexander Behres
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Publication number: 20090122823Abstract: A monolithically integrated laser diode chip having a construction as a multiple beam laser diode, which, on a semiconductor substrate (3) comprised of GaAs, has at least two laser stacks (4a, 4b, 4c) which are arranged one above another and which each contain an active zone (7). The active zone (7) is in each case arranged between waveguide layers (8). The waveguide layers (8) each adjoin a cladding layer (6) at a side remote from the active zone. At least one of the waveguide layers (8) or cladding layers (6) of at least one laser stack (4a, 4b, 4c), comprises AlxGa1-xAs, where 0?x?1, and at least one additional material from main group III or V, such that the lattice mismatch between the at least one waveguide layer (8) or cladding layer (6) comprising the at least one additional element and the semiconductor substrate (3) composed of GaAs is reduced. This increases the lifetime of the laser diode chip.Type: ApplicationFiled: June 30, 2008Publication date: May 14, 2009Applicant: Osram Opto Semiconductors GmbHInventors: Martin Muller, Gunther Gronninger, Alexander Behres
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Patent number: 7307284Abstract: A light-emitting diode based on GaAlAs has a window layer (5) of reduced thickness and is doped continuously with Si or Sn. The net concentration of the doping is less than 1 ×1018 cm?3. This provision lessens the degradation of the light-emitting diode (1).Type: GrantFiled: May 18, 2001Date of Patent: December 11, 2007Assignee: Osram GmbHInventors: Günther Grönninger, Peter Heidborn
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Publication number: 20070090396Abstract: A semiconductor substrate (1) of GaAs with a semiconductor layer sequence (2) applied on top. The semiconductor layer sequence (2) contains a plurality of semiconductor layers (3, 4, 5, 6, 7) of Al1?yGayAs1?xPx with 0?x?1 and 0?y?1, the phosphorus component x in a number of the semiconductor layers respectively being greater than in a neighboring semiconductor layer lying thereunder in the direction of growth. Such a semiconductor substrate may be advantageously used as a quasi-substrate substrate (8) for growing further semiconductor layers (28) which have a smaller lattice constant than GaAs.Type: ApplicationFiled: September 28, 2006Publication date: April 26, 2007Applicant: Osram Opto Semiconductors GmbHInventors: Norbert Linder, Gunther Gronninger, Peter Heidborn, Klaus Streubel, Siegmar Kugler
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Publication number: 20030155576Abstract: A luminescent diode, based on GaAlAs comprises a window layer (5) with reduced thickness and doped throughout with Si or Sn. The net concentration of the doping is less than 1×1018 cm−3. The degradation of the luminescent diode (1) is thus reduced.Type: ApplicationFiled: April 15, 2003Publication date: August 21, 2003Inventors: Gunther Gronninger, Peter Heidborn
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Publication number: 20010010375Abstract: A semiconductor configuration has a substrate made of GaP and an epitaxial layer on the substrate. The expitaxial layer has an n-doped partial layer and a p-doped partial layer. A pn junction is formed at the boundary between the two partial layers. The epitaxial layer contains an impurity which is an element from the 3rd main group and/or from the 5th main group which is not identical to N. The impurity is present at a maximum concentration in the GaP epitaxial layer of between 1017 and 1018 cm−3.Type: ApplicationFiled: December 4, 2000Publication date: August 2, 2001Inventors: Gerald Neumann, Gunther Gronninger, Peter Heidborn, Gerald Schemmel
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Patent number: 5917705Abstract: A chip card includes a plastic card. A plastic body is disposed in the plastic card and a semiconductor chip is surrounded by the plastic body. Contact strips are electrically connected with the semiconductor chip and are connected to the plastic card. The contact strips have a flexible region near and outside of the plastic body and are advantageously parts of a lead frame. An adhesive which joins the contact strips to the plastic card has at least three layers including a middle layer of flexible material.Type: GrantFiled: October 28, 1996Date of Patent: June 29, 1999Assignee: Siemens AktiengesellschaftInventors: Josef Kirschbauer, Erich Hopf, Gunther Gronninger, Jurgen Fischer, Gunter Didschies, Josef Mundigl, Michael Rogalli