Abstract: The invention relates to an offset regulation device for a sensor module and a method for realizing such an offset regulation, particularly for acceleration sensors and pressure sensors. The disadvantage of currently used offset regulation devices is that impermissible offset drifts or other errors are not recognized and are camouflaged by the offset regulation device. As a result, the measuring values can be distorted. The offset regulation device according to the invention comprises a monitoring device that is integrated into the offset regulation device and which recognizes and indicates such errors. This monitoring device comprises an analog or digital adder, which detects the deviation of the actual value from the desired value or values depending thereon. If the regulation takes too long because the deviation is too large and the offset is therefore not permissible, then a maximum or minimum value is reached during the adding up in the adder.

Abstract: A micromechanical acceleration sensor consists of a first semiconductor wafer and a second semiconductor wafer, where on the first semiconductor wafer first and second electrodes, are provided to create a variable capacitance and the second semiconductor wafer has a movable third electrode, and where on the first semiconductor wafer there is a microelectronic evaluation unit. The moveable electrode is a rocker suspended asymmetrically with regard to an axis of rotation such that each respective portion is of a different length and is opposite one of the first and second electrodes. A closed ring structure is disposed on the surface of the first semiconductor wafer.

Abstract: A process for the laminar joining of two or more silicon semiconductor slices (wafers) under the effect of pressure and heat, in which a thin layer of a semiconductor-compatible material is applied to at least one of the surfaces to be joined.

Abstract: This invention concerns a capacitive acceleration sensor complete with planar build-up, in particular for use as a component part of a vehicle occupant protection system within a motor vehicle. A self-supporting structure will be movably located within a hollow space between two semiconductor elements which are electrically insulated from each other but mechanically bonded, where an acceleration force acting on the inert mass of the self-supporting structure will cause a change in the distance between this self-supporting structure and the semiconductor element. This produces a change in capacity which can be evaluated by means of suitable circuitry.

Abstract: A twin-edged foam plastic cleaving machine having a machine frame and a drive for guiding and adjusting a band blade support, a workpiece table (including also a conveyor belt system), movable in relation to the machine frame, for receiving the block of foam plastic to be cut, a twin-edged band blade arrangement, and a truss which is disposed on the side of the band blade remote from the block of foam plastic to support the band blade against yielding both due to a tensile force exerted on the band blade and also due to the reaction compressive force.