Patents by Inventor Gunther Waitl

Gunther Waitl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080173878
    Abstract: A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas.
    Type: Application
    Filed: March 26, 2008
    Publication date: July 24, 2008
    Inventors: Gunther Waitl, Herbert Brunner
  • Patent number: 7368329
    Abstract: A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: May 6, 2008
    Assignee: OSRAM GmbH
    Inventors: Gunther Waitl, Herbert Brunner
  • Patent number: 7319245
    Abstract: A radiation-emitting semiconductor component, comprising a semiconductor body which emits a primary light, a luminescent conversion element which emits fluorescent light, in which the luminescent conversion element comprises a suspension of a luminous substance in a matrix material, wherein the luminescent conversion element is in direct contact with a part of the surface of said semiconductor body, and wherein the fluorescent light emitted from said luminescent conversion element is approximately half the total emission of the light of the radiation-emitting semiconductor component.
    Type: Grant
    Filed: July 17, 2006
    Date of Patent: January 15, 2008
    Assignee: Osram GmbH
    Inventors: Herbert Brunner, Alexandra Debray, Harald Jäger, Günther Waitl
  • Publication number: 20070034889
    Abstract: A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas.
    Type: Application
    Filed: October 23, 2006
    Publication date: February 15, 2007
    Inventors: Gunther Waitl, Herbert Brunner
  • Patent number: 7138301
    Abstract: A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas.
    Type: Grant
    Filed: February 2, 2006
    Date of Patent: November 21, 2006
    Assignee: Osram GmbH
    Inventors: Gunther Waitl, Herbert Brunner
  • Publication number: 20060255355
    Abstract: A radiation-emitting semiconductor component, comprising a semiconductor body which emits a primary light, a luminescent conversion element which emits fluorescent light, in which the luminescent conversion element comprises a suspension of a luminous substance in a matrix material, wherein the luminescent conversion element is in direct contact with a part of the surface of said semiconductor body, and wherein the fluorescent light emitted from said luminescent conversion element is approximately half the total emission of the light of the radiation-emitting semiconductor component.
    Type: Application
    Filed: July 17, 2006
    Publication date: November 16, 2006
    Inventors: Herbert Brunner, Alexandra Debray, Harald Jager, Gunther Waitl
  • Patent number: 7105862
    Abstract: A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas.
    Type: Grant
    Filed: October 4, 2004
    Date of Patent: September 12, 2006
    Assignee: Osram GmbH
    Inventors: Gunther Waitl, Herbert Brunner
  • Patent number: 7078253
    Abstract: The invention describes a radiation-emmitting semiconductor component with luminescence conversion element (7), in the case of which the semiconductor body (3) is arranged in a recess in the basic body (1). Within the recess, there is shaped around the semiconductor body a bowl-like region which contains the luminescence conversion element (7) and envelopes the semiconductor body (3). The bowl-like region is formed as a depression within the recess or as an annular enclosure (6) on the base of the recess.
    Type: Grant
    Filed: August 13, 2004
    Date of Patent: July 18, 2006
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Herbert Brunner, Alexandra Debray, Harald Jäger, Günther Waitl
  • Publication number: 20060138442
    Abstract: A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas.
    Type: Application
    Filed: February 2, 2006
    Publication date: June 29, 2006
    Inventors: Gunther Waitl, Herbert Brunner
  • Publication number: 20050244993
    Abstract: The invention describes two methods of fabricating semiconductor components in which a luminescence conversion element is applied directly to the semiconductor body (1). In the first method, a suspension (4) containing a bonding agent and at least one luminescent material (5) is applied to the semiconductor body (1) in layers. In the next step the solvent escapes, leaving only the luminescent material (5) with the bonding agent on the semiconductor body. In the second method, the semiconductor body (1) is provided with a layer (6) of bonding agent to which the luminescent material (5) is applied directly.
    Type: Application
    Filed: March 2, 2001
    Publication date: November 3, 2005
    Inventors: Georg Bogner, Gunther Waitl, Alexandra Debray
  • Publication number: 20050110123
    Abstract: A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas.
    Type: Application
    Filed: October 4, 2004
    Publication date: May 26, 2005
    Inventors: Gunther Waitl, Herbert Brunner
  • Patent number: 6897490
    Abstract: The invention describes a radiation-emitting semiconductor component with a luminescent conversion element, at which the semiconductor body is placed in a recess of the base body. A cup-like area is molded inside of the recess around the semiconductor body, which contains the luminescent conversion element and coats the semiconductor body. The cup-like portion is formed as indentation inside of the recess or as annular border on the base of the recess.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: May 24, 2005
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Herbert Brunner, Alexandra Debray, Harald Jāger, Günther Waitl
  • Patent number: 6858879
    Abstract: A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas.
    Type: Grant
    Filed: July 9, 2003
    Date of Patent: February 22, 2005
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Gunther Waitl, Herbert Brunner
  • Publication number: 20050014302
    Abstract: The invention describes a radiation-emitting semiconductor component with a luminescent conversion element, at which the semiconductor body is placed in a recess of the base body. A cup-like area is molded inside of the recess around the semiconductor body, which contains the luminescent conversion element and coats the semiconductor body. The cup-like portion is formed as indentation inside of the recess or as annular border on the base of the recess.
    Type: Application
    Filed: August 13, 2004
    Publication date: January 20, 2005
    Inventors: Herbert Brunner, Alexandra Debray, Harald Jager, Gunther Waitl
  • Publication number: 20040104445
    Abstract: A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas.
    Type: Application
    Filed: July 9, 2003
    Publication date: June 3, 2004
    Applicant: Osram Opto Semiconductors GmbH & Co.
    Inventors: Gunther Waitl, Herbert Brunner
  • Patent number: 6624491
    Abstract: A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: September 23, 2003
    Assignee: Osram Opto Semiconductors GmbH & Co.
    Inventors: Gunther Waitl, Herbert Brunner
  • Publication number: 20030141510
    Abstract: The invention describes a radiation-emitting semiconductor component with a luminescent conversion element, at which the semiconductor body is placed in a recess of the base body. A cup-like area is molded inside of the recess around the semiconductor body, which contains the luminescent conversion element and coats the semiconductor body. The cup-like portion is formed as indentation inside of the recess or as annular border on the base of the recess.
    Type: Application
    Filed: October 28, 2002
    Publication date: July 31, 2003
    Applicant: Osram Opto Semiconductors GmbH
    Inventors: Herbert Brunner, Alexandra Debray, Harald Jager, Gunther Waitl
  • Publication number: 20010022390
    Abstract: A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas.
    Type: Application
    Filed: December 29, 2000
    Publication date: September 20, 2001
    Inventors: Gunther Waitl, Herbert Brunner
  • Patent number: 6087680
    Abstract: An LED device includes at least one LED chip having a front contact metallization disposed on a light exit surface of a light-emitting member and a rear contact metallization disposed on a side of the light-emitting member opposite the light exit surface. The LED chip is disposed between first and second conductor track supports. The first conductor track support is transparent and has at least one first electric conductor contacting the front contact metallization. The second conductor track support has at least one second electric conductor contacting the rear contact metallization. The LED device has, inter alia, the special advantage of permitting the size of the LED chips to be reduced, in contrast with the chip size in conventional LED devices, thus allowing the luminous spot density to be increased.
    Type: Grant
    Filed: July 31, 1998
    Date of Patent: July 11, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang Gramann, Werner Spath, Gunther Waitl, Herbert Brunner