Abstract: The present invention provides for a super-narrow band filter using frequency dependent L-C components. The invention utilizes a frequency dependent L-C circuit with a positive slope k for the inductor values as a function of frequency. The positive k value allows the realization of a very narrow-band filter.

Abstract: A broadband matching network for coupling a magnetic resonance probe to a preamplifier utilizes superconducting matching coils and superconducting locatable shields to detect very weak magnetic signals over a broad bandwidth. The superconducting matching coils and shields minimize signal loss in the matching amplifier. When used with a superconducting magnetic resonance probe, the circuit provides a significant broadening in bandwidth over that of the probe without loss of performance.

Abstract: A magnetic resonance probe coil is fabricated using a superconductive material for the coil. Three distinct embodiments are described: a single-layer coil with no crossovers; a dual-film coil wherein the capacitors are formed through an intermediate dielectric layer; a single-layer coil incorporating a superconducting crossover. All of the embodiments are designed to take advantage of the properties of the superconducting material to achieve very high quality factors (Q) of tens of thousands to over a million. The superconductor is patterned into a spiral design to achieve self-resonance at a desired frequency in the range of 1 to 1000 MHz and the device operates at temperatures higher than 30 K. A broadband matching network is also disclosed which, when operated in conjunction with the superconducting magnetic resonance probe coil, allows operation over a wide range of frequencies while maintaining extremely low loss.

Abstract: A lobed package for the protection and electrical connection of microwave devices is presented. The distinctive shape of the package allows several large devices to be connected in series in a coplanar arrangement. In the preferred embodiment, a base layer is formed into a trefoil shape with a central raised pedestal. Three wafer sized modules are cut to fit together at 120.degree. angles and are placed on the pedestal and electrically interconnected. A retaining shim is placed around the outside of the modules. An intermediate spring retaining plate with a recessed three-lobed well is placed atop the modules. Springs are placed in holes in the retaining plate. The springs are compressed by a cover plate placed on top of the retaining plate. Electrical connections are made to the cascaded device through the base or edge of the package. One application is to packaging three delay lines in series, each device occupying most of the space of a standard wafer.