Abstract: A micro-robot magnetic drive device and a control method based on double closed loop three-dimensional path tracking are disclosed. The method includes: inputting a desired tracking path, obtaining current pose information of a magnetic micro-robot through a camera, and then calculating a position of a center of mass, an actual axial direction, coordinates of a desired position point with the shortest distance from the center of mass on a desired tracking path, and a tangent direction of this point; calculating a horizontal distance, a vertical distance, a direction angle error, and a pitch angle error of the two points according to the actual axial direction, the tangent direction, and disturbance compensation; and obtaining a required rotating magnetic field according to a designed position closed loop controller.

Abstract: The present disclosure discloses a method for synthesizing quinolones intermediates by a continuous flow reaction. Specifically, according to the method, a microchannel reactor is used, which improves the selectivity and conversion rate of the reaction, and the conversion rate of compound ii is increased to more than 95% and the yield is increased to more than 85%; avoids the use of a solvent such as methanol, and methyl tert-butyl ether, etc., in the intermittent reaction process, which simplifies the post-processing method, shortens the overall operation time from about 24 hours to a few minutes, greatly improving the production efficiency, and realizing the continuity and automation of the whole process; and thus makes the product have high purity and high yield, which is suitable for industrial production.

Abstract: A piezoelectric microelectromechanical systems microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can include a single piezoelectric film layer disposed over the top end of the substrate and defining a diaphragm structure, the single piezoelectric film layer having substantially zero residual stress and formed from a piezoelectric wafer. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when subjected to sound pressure via the opening in the substrate.

Abstract: An acoustic sensor (e.g., for use in a piezoelectric MEMS microphone) includes a substrate and a cantilever beam attached to the substrate. The cantilever beam has a proximal portion attached to the substrate and a distal portion that extends from the proximal portion to a free end of the beam, the beam extending generally linearly from the proximal portion toward the free end in a first direction. The beam has a wall portion at or proximate the free end that extends in a second direction generally transverse to the first direction and increases an acoustic resistance of the gap between sensors. An electrode is disposed on or in the proximal portion of the beam.

Abstract: An electronic device package comprises a primary microphone having a frequency response having a first resonance frequency, and a reference microphone having a frequency response including a second resonance frequency, the primary microphone and the reference microphone configured to substantially simultaneously receive a same acoustic signal to produce a transduced signal of the primary microphone and a transduced signal of the reference microphone, the second resonance frequency of the reference microphone being different than the first resonance frequency of the primary microphone, the package having dimensions that cause the primary microphone and reference microphone to be acoustically isolated from one another at the resonance frequency of the primary microphone, there being less than 3 dB of acoustic coupling between the primary microphone and reference microphone at the first resonance frequency.

Abstract: A piezoelectric microelectromechanical system microphone assembly comprises a carrier substrate including one of a through-hole or a recess, and a package including a microelectromechanical system die having a piezoelectric microelectromechanical system microphone mounted on a microphone substrate and a lid, at least a portion of the package disposed within the one of the through-hole or recess.

Abstract: This invention relates to the technical field of isolation passage for fever clinics, and it discloses a two-way negative pressure isolation passage for fever clinics, comprising an inquiry compartment, a dressing room and a doctor passage compartment, wherein, a negative pressure disinfection compartment is arranged between the inquiry compartment and the dressing room, and a negative pressure buffer compartment is arranged between the dressing room and the doctor passage compartment; the isolation passage also comprises a trash conveying compartment arranged below the outer side wall of the inquiry compartment, the dressing room and the doctor's passage compartment, and a bathroom is also arranged in the dressing room.

Abstract: A side-port piezoelectric microelectromechanical system microphone package includes a microelectromechanical system die disposed on the microphone substrate and including a microphone membrane and a membrane support substrate, the microphone membrane being disposed on a wall of a membrane support substrate, and an acoustic port defined by an aperture passing through a portion of the wall of the membrane support substrate.

Abstract: An electronic device package comprises an electronic acoustic device including a primary microphone having a frequency response having a resonance frequency, and a reference microphone having a frequency response including a resonance frequency. The primary microphone and the reference microphone are configured to substantially simultaneously receive a common acoustic signal to produce a transduced signal of the primary microphone and a transduced signal of the reference microphone, the resonance frequency of the reference microphone being different than the resonance frequency of the primary microphone. An equalization module is configured to equalize the frequency response of the microphone based on the transduced signal of the microphone and the transduced signal of the reference microphone. The package defines a first back cavity of the primary microphone and a second back cavity of the reference microphone, the second back cavity being acoustically isolated from the first back cavity.

Abstract: A piezoelectric microelectromechanical system microphone comprises a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential, and a dummy electrode electrically unconnected to the sensing electrode and disposed on a portion of the piezoelectric element that is free of the sensing electrode, the dummy electrode configured to reduce static deformation of the piezoelectric element caused by residual stresses in the piezoelectric element.

Abstract: A method for manufacturing a microelectromechanical systems (MEMS) microphone comprises depositing a membrane on a first sacrificial layer, wherein the first sacrificial layer is deposited on a substrate, etching the substrate to define a cavity, releasing the membrane by removing at least the first sacrificial layer, and forming at least one anchor at the edge of the membrane.

Abstract: A method for manufacturing a microelectromechanical systems microphone comprises depositing a membrane on a first sacrificial layer on a substrate, releasing the membrane by removing the first sacrificial layer, depositing a resist layer on the membrane, and patterning the resist layer to expose the membrane, such that at least one section of resist layer remains at at least one edge of the membrane to form an anchor. A microphone manufactured by this method is also provided. There is also provided a method for manufacturing a microelectromechanical systems microphone comprising depositing a membrane on a first sacrificial layer deposited on a substrate, releasing the membrane by removing at least the first sacrificial layer, depositing a resist layer on membrane, patterning the resist layer to expose an edge of the membrane, and forming an anchor at the exposed edge of the membrane. A microphone manufactured by this method is also provided.

Abstract: A cantilever sensor (e.g., piezoelectric sensor) includes a beam with a sensor or electrode at a proximal end and a tip that extends from the sensor to the distal (unsupported) end of the beam. The tip is modified to modify (e.g., tune) the resonant frequency of the cantilever sensor. The resonant frequency of the cantilever sensor is tuned by using a material for the tip with a stiffness (e.g., a Young's Modulus) and/or a mass or density that results in the desired resonant frequency. The resonant frequency of the cantilever sensor can also be tuned by modifying the shape of the tip to have a higher vertical structure in a Z direction transverse to a length of the beam of the sensor.

Abstract: A method for making a cantilever sensor includes forming a beam extending between a proximal portion and a distal end, and forming and attaching an electrode on the proximal portion. The beam is attached to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal end of the beam is unsupported. The method includes modifying the resonance frequency of the cantilever sensor by forming at least the tip of the beam of a material having one or both of a density and Young's modulus that provides the desired resonant frequency, or by forming at least the tip of the beam so that it has a greater height in a Z direction transverse to a length of the beam than the proximal portion of the beam to thereby tune a resonant frequency of the sensor.

Abstract: A piezoelectric microelectromechanical system microphone comprises a support substrate, a diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm, and a compliant anchor formed of a material with a greater compliance than a compliance of the piezoelectric material, the compliant anchor defined in the diaphragm in an anchor region between the piezoelectric material of the diaphragm and the support substrate to improve sensitivity and reduce residual stress impact of the piezoelectric microelectromechanical system microphone.

Abstract: A method of making a piezoelectric sensor includes forming piezoelectric layer(s) to define a beam extending between a proximal portion and a distal end. The method also includes modeling a strain distribution on the beam based on a force applied to the beam, and defining an outer boundary with a shape substantially corresponding to a contour line of the strain distribution on the beam. The method also includes forming an electrode having said outer boundary shape, and attaching the electrode to the beam. The method also includes attaching the beam to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal end of the beam is unsupported.

Abstract: A piezoelectric sensor (e.g., for use in a piezoelectric MEMS microphone) includes a substrate and a cantilever beam attached to the substrate. The cantilever beam has a proximal portion attached to the substrate and extending to an unsupported distal end. An electrode is disposed on or in the proximal portion of the beam and has an outer boundary with a shape substantially corresponding to a contour line of a strain distribution plot for the cantilever beam resulting from a force applied to the cantilever beam.

Abstract: Electronic acoustic devices and methods of operating the same include a microphone having a frequency response including a resonance frequency, a reference microphone having a frequency response including a resonance frequency, the microphone and the reference microphone configured to substantially simultaneously receive a common acoustic signal to produce a transduced signal of the microphone and a transduced signal of the reference microphone, the resonance frequency of the reference microphone being different than the resonance frequency of the microphone, and an equalization module configured to equalize the frequency response of the microphone based on the transduced signal of the microphone and the transduced signal of the reference microphone.

Abstract: A piezoelectric microelectromechanical systems microphone can be mounted on a printed circuit board. The microphone can include a substrate with an opening between a bottom end of the substrate and a top end of the substrate. The microphone can include a single piezoelectric film layer disposed over the top end of the substrate and defining a diaphragm structure, the single piezoelectric film layer having substantially zero residual stress and formed from a piezoelectric wafer. The microphone can include one or more electrodes disposed over the diaphragm structure. The diaphragm structure is configured to deflect when subjected to sound pressure via the opening in the substrate.

Abstract: A piezoelectric microelectromechanical systems microphone is provided comprising a substrate including at least one wall defining a cavity, the at least one wall defining an anchor region around a perimeter, a piezoelectric film layer forming a membrane, the piezoelectric film layer being supported at the anchor region by a spring region, and an electrode disposed over the piezoelectric film layer. A method of manufacturing such a MEMS microphone is also provided.