Abstract: Disclosed is a three-axis Hall angle sensor with an accuracy of 0.3°. The sensor is mainly designed by means of finite element software and COMSOL Multiphysics. The present specification will be mainly performed in three steps. In the first step, a cross-shape horizontal Hall element for measuring the magnetic field in the vertical direction, that is, the direction z, is studied. The second section mainly studies a three-contact four-Hall vertical element for measuring the magnetic field in the directions x, y. The third part is to design the angle sensor. Compared with the horizontal Hall element, the vertical Hall element has a relatively large offset, therefore, four vertical Hall elements are used to measure the magnetic field in the horizontal direction, and two complementary vertical structures are used to eliminate the error when the magnetic field in the same horizontal direction is measured.

Abstract: Provided is an ATF (Automatic Transmission Fluid) oil and corona-resistant enameled wire for electric vehicle motors, belonging to the insulating materials field. The ATF oil and corona-resistant enameled wire for electric vehicle motors comprises a copper conductor and an insulating layer, wherein said insulating layer from inside to outside is composed of ATF oil and corona-resistant protective film, corona-resistant PAI film, ATF oil and corona-resistant protective film, corona-resistant PAI film, ATF oil and corona-resistant protective film. The ATF oil and corona resistant enameled wire of this disclosure is suitable for the preparation of oil-cooled electric vehicle motor loose winding coil due to the advantages of good manufacturability, excellent ATF oil and corona resistance, and low manufacturing cost.

Abstract: An electronic device includes a package substrate having a top surface and a bottom surface. An integrated circuit (“IC”) die is disposed on the top surface of the package substrate. The electronic device also includes a stiffener having a ring body and a plurality of support members. The ring body is secured to the top surface of the package substrate and circumscribes the IC die. The plurality of support members extend from the ring body to below the bottom surface of the package substrate.

Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a cooling component, and a frame structure that is coupled to the cooling component by way of at least one fastener. The SoW assembly can include an interposer assembly that is disposed on a SoW. At least a portion of the interposer assembly can be disposed between the cooling component and the frame structure. The SoW assembly can include a gasket disposed between the portion of the interposer assembly and the frame structure.

Abstract: Electronic assemblies with a cold plate having an opening are provided. In one aspect. a system includes an array of electronic components. a control board. and a cold plate having a plurality of openings therethrough. The cold plate can be arranged between the array of electronic components and the control board. The cold plate can cool the array of electronic components. The system can also include a plurality of pass through connectors arranged in the openings in the cold plate and configured to connect the array of electronic components to the control board. The cold plate can also be used to cool the control board electronics and the connectors passing through.

Abstract: A connector system is disclosed. The connector system can include a support structure, a holder coupled to the support structure, an alignment adjustment structure positioned between the support structure and the holder, and an actuator. The holder can receive a first connector of a connection line. The alignment adjustment structure is compressible along a first axis and movable along a second axis different from the first axis. The actuator is configured to provide movement of the holder so as to connect the first connector to a second connector of a processor system, such as a system on wafer (SoW) assembly.

Abstract: An array of compliant connectors for electronic assemblies is provided. In one aspect, a system includes an array of first electronic components and an array of second electronic components. Each of the second electronic components is paired with corresponding to one of the first electronic components. Each pair of the first and second electronic components is coupled via a plurality of compliant connectors.

Abstract: An electrical connection device includes a panel and a connector. The panel is formed with an opened hole. The connector includes an insulative housing and a locking member. The insulative housing is configured to be capable of inserting into the opened hole of the panel and moving to an assembled position. The locking member has a protecting frame and a locking arm. The protecting frame has an inner frame body, an outer frame body and two side frame bodies which connects the inner frame body and the outer frame body. The locking arm has two end portions, an elastic arm portion and a lock protruding portion. The elastic arm portion is constructed as an elastic zone. The two end portions are connected to an inner side of the outer frame body so that the two side frame bodies are constructed as a deformable zone. When the lock protruding portion is squeezed by the panel, the elastic zone and the deformable zone all are capable of bending deformation.

Abstract: Wafer assemblies and related methods of manufacture are disclosed. Such assemblies and methods can account for different heights of electronic modules positioned on a wafer. In an embodiment, a wafer assembly includes a cooling system, a wafer, a first electronic module, a second electronic module, and a height adjustment structure. A first thermal interface material (TIM) can be disposed between the first electronic module and a first portion of the cooling system. A second TIM can be disposed between the second electronic module and a second portion of the cooling system. The height adjustment structure can compensate for a height difference between the first electronic module and the second electronic module. Other wafer assemblies and methods of manufacture are disclosed.

Abstract: An electrical connector assembly, a first electrical connector and a second electrical connector are provided. The first electrical connector includes a first insulating body and a plurality of first conductive terminals. The first insulating body includes a mis-insertion proof connecting board which is provided between the two adjacent terminal receiving posts and a mis-insertion proof rib which protrudes upwardly from the terminal receiving post. The second electrical connector includes a second insulating body and a plurality of second conductive terminals. The second insulating body includes a mis-insertion proof notch which is provided on the partitioning wall and mis-insertion proof avoiding openings which are provided to a top portion of the mating cavity.

Abstract: A frame rate control method is provided. A primary scenario and a non-primary scenario are identified according to two or more windows displayed on a screen. Each of the primary scenario and the non-primary scenario is performed by an individual application. A frame rate of the non-primary scenario is decreased when a performance index indicates that a first condition is present. The application corresponding to the non-primary scenario is disabled when the performance index indicates that a second condition is present after decreasing the frame rate of the non-primary scenario, so as to remove the window corresponding to the non-primary scenario from the screen.

Abstract: A modeling method for a tubular structure includes: acquiring a structural wire-frame; generating, at each non-manifold node of non-manifold nodes of the structural wire-frame, a polyhedral structure formed by faces of a polyhedron; generating, at each manifold node of manifold nodes of the structural wire-frame, a connecting face; generating, at each end node of end nodes of the structural wire-frame, an end face; connecting vertices of the connecting wire-frame, vertices of the connecting face, and vertices of the end face; and carrying out curved-surface subdivision.

Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a first SoW assembly structure with a first coefficient of thermal expansion (CTE). The first SoW assembly structure includes first to third slots at different locations. The SoW assembly can include a second SoW assembly structure stacked on the first SoW assembly structure. The second SoW assembly structure has a second CTE different from the first CTE. The second SoW assembly structure has first to third pins extending therefrom and disposed in the first to third slots. The first and second slots shaped to allow the first and second pins to move along a first axis, and the third slot shaped to allow the third pin to move along a second axis. The first SoW assembly structure can be a SoW and the second SoW assembly structure can be a heat dissipation structure in certain applications.

Abstract: The present invention relates to a high-order parity-time (PT) symmetry wireless power transfer (WPT) system and method. The method includes the following steps: providing an N-order composite coil which includes N resonance circuits, where N is an odd number; providing an M-order composite coil which includes M resonance circuits, where M is an even number; connecting a scattering capacitor to end portions of two adjacent resonance circuits; coupling the first resonance circuits in the two composite coils to realize WPT; connecting a load to an alternating current power supply; and adjusting a capacitor in the resonance circuit symmetrical to the two first resonance circuits according to a change in coupling strength caused by a change in coupling distance in a WPT process to obtain an optimal transfer efficiency.

Abstract: A method for promoting the rapid precipitation of travertine crystals by algae is disclosed. Microalgae is added to a body of water having a calcium ion concentration of 100-500 mg/L and stirred. The amount of microalgae is 0.1-8×108 cells/L. The invention adopts a method for promoting the rapid precipitation of travertine crystals by algae, which significantly improves the sedimentation rate of travertine crystals. At the same time, there are pseudomonas in the calcified water body of algae, which can be used for algae-lysing bacteria isolation and purification.

Abstract: Provided are modulators of androgen receptor (AR) condensates, methods of modulating or inhibiting AR condensates, and methods of treating diseases and conditions using such modulators or inhibitors of AR condensates.

Abstract: The present disclosure relates to processing systems and more specifically to integrated circuit (IC) packages designed to reduce the effects of electrostatic discharge and/or electromagnetic interference during integrated circuit manufacture and/or use. The IC assembly may include a wafer positioned between a cooling system and thermal dissipation structure. The cooling system and thermal dissipation structure include electrically conductive material at a ground potential such that the thermal systems act as electrical ground. The wafer may be electrically connected to the cooling system and thermal dissipation structure to reduce static charge accumulation during the assembly process. The cooling system and thermal dissipation structure may further provide radio frequency (RF) shielding to reduce electromagnetic interference during use of the IC assembly.

Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a first SoW assembly structure with a first coefficient of thermal expansion (CTE). The first SoW assembly structure includes first to third slots at different locations. The SoW assembly can include a second SoW assembly structure stacked on the first SoW assembly structure. The second SoW assembly structure has a second CTE different from the first CTE. The second SoW assembly structure has first to third pins extending therefrom and disposed in the first to third slots. The first and second slots shaped to allow the first and second pins to move along a first axis, and the third slot shaped to allow the third pin to move along a second axis. The first SoW assembly structure can be a SoW and the second SoW assembly structure can be a heat dissipation structure in certain applications.

Abstract: A voltage regulating module design is provided. In one aspect, a voltage regulating module (VRM) includes a first layer configured to output a regulated voltage that is based on a stepped down voltage, and a second layer stacked with the first layer, and a plurality of contacts, such as a ball grid array (BGA), on the first layer. The second layer includes a plurality of active components configured to provide the stepped down voltage to the first layer. The first and second layers have overlapping recesses, and the recess of the first layer has a larger footprint than the recess of the second layer. A plurality of the VRMS can be arranged to form an opening including a counterbore. A faster, such as a bolt, can be positioned in the opening. The first layer can have a larger clearance from the fastener positioned in the opening than the second layer.

Abstract: An image sensor includes a pixel array and a color filter array covering the pixel array, where the color filter array includes a plurality of color filter elements, the plurality of color filter elements include at least one first color filter element and at least one second color filter element, each first color filter element includes a basic color filter and an extended color filter, and each second color filter element includes a plurality of basic color filters. A color of the extended color filter is different from a color of the basic color filter. An optical signal passing through the basic color filter is at least for imaging, and an optical signal passing through the extended color filter is for spectral measurement.