Abstract: An electronic device includes a package substrate having a top surface and a bottom surface. An integrated circuit (“IC”) die is disposed on the top surface of the package substrate. The electronic device also includes a stiffener having a ring body and a plurality of support members. The ring body is secured to the top surface of the package substrate and circumscribes the IC die. The plurality of support members extend from the ring body to below the bottom surface of the package substrate.

Abstract: Techniques for providing connectivity between cloud and on-premises systems are disclosed. A computer system may receive, by a node of a virtual private cloud from a software application running on the virtual private cloud, a virtual host identification of a destination host running on an on-premises network, and identify, by the node, a virtual Internet Protocol (IP) address of the destination host based on the virtual host identification. Then, the computer system may send, by the node, a request comprising the virtual IP address of the destination host to a software agent running on the on-premises network, where the software agent is configured to send the request to the destination host using the virtual IP address.

Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a cooling component, and a frame structure that is coupled to the cooling component by way of at least one fastener. The SoW assembly can include an interposer assembly that is disposed on a SoW. At least a portion of the interposer assembly can be disposed between the cooling component and the frame structure. The SoW assembly can include a gasket disposed between the portion of the interposer assembly and the frame structure.

Abstract: Electronic assemblies with a cold plate having an opening are provided. In one aspect. a system includes an array of electronic components. a control board. and a cold plate having a plurality of openings therethrough. The cold plate can be arranged between the array of electronic components and the control board. The cold plate can cool the array of electronic components. The system can also include a plurality of pass through connectors arranged in the openings in the cold plate and configured to connect the array of electronic components to the control board. The cold plate can also be used to cool the control board electronics and the connectors passing through.

Abstract: An array of compliant connectors for electronic assemblies is provided. In one aspect, a system includes an array of first electronic components and an array of second electronic components. Each of the second electronic components is paired with corresponding to one of the first electronic components. Each pair of the first and second electronic components is coupled via a plurality of compliant connectors.

Abstract: A method for fabricating the three-dimensional comb-tooth-shaped groove array surface, the surface of the bearing is first etched with grooves having a certain depth by means of femtosecond lase, then a PTFE film is impressed and attached to the surface of the inner ring of the bearing, the position of a laser focus is adjusted to focus on the lower surface of the PTFE film, the same pit is scanned repeatedly, ripple characteristic stripes occur on the surface of the inner ring of the bearing while the film gasifies instantly under the action of laser ablation heating, a part of polymer material in the gasified part is adsorbed to a mechanical surface in each pit under the action of mechanical interlocking, and a super-oleophobic PTFE surface is obtained in each groove.

Abstract: A connector system is disclosed. The connector system can include a support structure, a holder coupled to the support structure, an alignment adjustment structure positioned between the support structure and the holder, and an actuator. The holder can receive a first connector of a connection line. The alignment adjustment structure is compressible along a first axis and movable along a second axis different from the first axis. The actuator is configured to provide movement of the holder so as to connect the first connector to a second connector of a processor system, such as a system on wafer (SoW) assembly.

Abstract: Method, systems and devices for determining a transport block size (TBS) are disclosed. The method comprises determining the TBS based on a parameter or a signaling associated with an event of determining an intermediate value of a TBS determination procedure, wherein the parameter or a signaling is available for a wireless terminal supporting a release version, wherein the intermediate value is determined based on a plurality of resource parameters, wherein the plurality of resource parameters comprises at least one of the total number of resource elements allocated to the wireless terminal, a rate, a modulation order, and the number of layers.

Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) of a group of UEs may receive a groupcast retransmission from one or more UEs of the group. For example, a base station may transmit a groupcast transmission to the group of UEs. A first UE of the group of UEs may fail to receive the groupcast transmission and, in response, may transmit a feedback message via a sidelink feedback resource to a second UE of the group of UEs. The feedback message may include a negative acknowledgement (NACK) that indicates the failed reception of the groupcast transmission by the first UE, and the sidelink feedback resource may be indicated by the base station. The second UE may transmit a retransmission of the groupcast transmission to the first UE via a sidelink resource based on receiving the feedback message.

Abstract: In an example embodiment, a predictive system maintenance module is created based on machine learning. The predictive system maintenance module achieves an improvement in predicting condition-based maintenance decision-making through a cloud-based approach, using a wide variety of information. Factors that influence downtime loss are identified and a generalized loss function, known as the downtime loss function, is defined. A prediction model is then built based on a multi-step forecasting time series model. The prediction model is then used to forecast a window that minimizes downtime loss. The predictive maintenance module uses historical data to foresee when and how to implement the seamless upgrading at a proper time so that it could have minimum downtime loss on the customer.

Abstract: Disclosed are a rainwater treatment method and a rainwater treatment system applied to mine wasteland, and the method includes following steps: collecting rainwater data of the mine wasteland, and processing the rainwater data of the mine wasteland to generate rainwater data; extracting parameters from the rainwater data to obtain rainwater parameters; constructing a mine three-dimensional model, and inputting the rainwater parameters into the mine three-dimensional model to generate a visual three-dimensional model; and treating the rainwater in the mine wasteland based on the visual three-dimensional model.

Abstract: A computer-implemented method, according to one approach, includes: determining whether a destination for a domain name system (DNS) query corresponds to an existing source network address translation (SNAT) port in response to receiving the DNS query. In response to determining that the destination for the DNS query corresponds to an existing SNAT port, the DNS query is modified to incorporate the existing SNAT port. A map entry corresponding to the existing SNAT port is also updated, and the modified DNS query is satisfied. Other systems, methods, and computer program products are described in additional approaches.

Abstract: Systems and methods for publication and external interfacing for a unified document surface are disclosed. An example system may include a document serving circuit structured to access a document data, the document data including data for a unified document surface, and to provide at least a portion of the document data to a client serving circuit; the client serving circuit structured to implement a unified document surface interface in response to the at least a portion of the document data; the client serving circuit further structured to implement an extension creation interface, and to provide a pack implementation value to the document serving circuit in response to user interactions with the extension creation interface; and wherein the document serving circuit is further structured to determine a pack definition value in response to the pack implementation value.

Abstract: An electrical connection device includes a panel and a connector. The panel is formed with an opened hole. The connector includes an insulative housing and a locking member. The insulative housing is configured to be capable of inserting into the opened hole of the panel and moving to an assembled position. The locking member has a protecting frame and a locking arm. The protecting frame has an inner frame body, an outer frame body and two side frame bodies which connects the inner frame body and the outer frame body. The locking arm has two end portions, an elastic arm portion and a lock protruding portion. The elastic arm portion is constructed as an elastic zone. The two end portions are connected to an inner side of the outer frame body so that the two side frame bodies are constructed as a deformable zone. When the lock protruding portion is squeezed by the panel, the elastic zone and the deformable zone all are capable of bending deformation.

Abstract: A power tool comprises a housing defining a grip portion, a motor having a motor drive shaft, a drive assembly including a crankshaft configured to receive torque from the motor drive shaft, an output assembly having an output member configured to receive torque from the crankshaft, a bearing rotatably supporting the crankshaft, a retainer configured to prevent translation of the bearing along the crankshaft past the retainer, and a transducer assembly disposed between the grip portion and the output member to measure the amount of torque applied through the output member.

Abstract: The present disclosure relates to a method for analyzing a geological body with the help of physical and chemical properties thereof, and in particular, to a method for identifying an exudative sandstone uranium deposit. With the method for identifying an exudative sandstone uranium deposit according to the embodiments of the present disclosure, an exudative sandstone uranium deposit formed by an exudation metallogenesis may be systematically identified, so as to guide prediction and prospecting evaluation of a uranium deposit in red variegated sandstone formations of a sedimentary basin, avoid ore dislocation and ore leakage, open up new prospecting positions and spaces, and break through new uranium resources.

Abstract: Wafer assemblies and related methods of manufacture are disclosed. Such assemblies and methods can account for different heights of electronic modules positioned on a wafer. In an embodiment, a wafer assembly includes a cooling system, a wafer, a first electronic module, a second electronic module, and a height adjustment structure. A first thermal interface material (TIM) can be disposed between the first electronic module and a first portion of the cooling system. A second TIM can be disposed between the second electronic module and a second portion of the cooling system. The height adjustment structure can compensate for a height difference between the first electronic module and the second electronic module. Other wafer assemblies and methods of manufacture are disclosed.

Abstract: An electrical connector assembly, a first electrical connector and a second electrical connector are provided. The first electrical connector includes a first insulating body and a plurality of first conductive terminals. The first insulating body includes a mis-insertion proof connecting board which is provided between the two adjacent terminal receiving posts and a mis-insertion proof rib which protrudes upwardly from the terminal receiving post. The second electrical connector includes a second insulating body and a plurality of second conductive terminals. The second insulating body includes a mis-insertion proof notch which is provided on the partitioning wall and mis-insertion proof avoiding openings which are provided to a top portion of the mating cavity.

Abstract: Presented are systems and methods for determining downlink control information. A wireless communication device may receive a downlink signaling that includes a first indication field and a second indication field from a wireless communication node. The wireless communication device may simultaneously transmitting a first Physical Uplink Shared Channel (PUSCH) transmission and a second PUSCH transmission. The first PUSCH transmission can be indicated by the first indication field. The second PUSCH transmission can be indicated by one of the first indication field or the second indication field.

Abstract: A display substrate includes: a base substrate and a plurality of sub-pixels arranged on the base substrate, the sub-pixel include a sub-pixel driving circuit, the sub-pixel driving circuit includes: a first transistor, a driving transistor, and a first conductive connection portion; a first electrode of the first transistor is coupled to a second electrode of the driving transistor, a second electrode of the first transistor and a first end portion of the first conductive connection portion are arranged at different layers, the second electrode of the first transistor and the first end portion of the first conductive connection portion are coupled through a via hole; a second end portion of the first conductive connection portion is coupled to a gate electrode of the driving transistor.