Abstract: The present invention discloses a multifunctional Petri dish with two sealing structures to ensure that the water in the medium will not evaporate during continuous culture, further affecting cultured living material growth and development. In addition to alcohol spray, the multifunctional Petri dish allows the application of acids, alkalis, alcohols, peroxides solution, or peroxides gas to immerse the multi-purpose Petri dish to remove bacteria or viruses. Various accessory devices can meet all requirements for a living culture of cells and tissues that the existing Petri dishes cannot provide. Using the dish cover operator and the dish container operator is essential to ensure that the researcher's hands will not directly touch the Petri dish in the sterile operating bench, thereby blocking all potential contamination of the medium and culture by foreign organisms.

Abstract: An automatic detection function-integrated detection apparatus includes a drill rod and an elastic water storage bag; two sides of the drill rod are a head region and a tail region, respectively; an interior of the drill rod has a water supply channel, a side wall of the drill rod is provided with a first channel, and a first valve is disposed in the first channel. The automatic detection function-integrated detection apparatus and method for the water flowing fractured zone may complete the detection of the water flowing fractured zone while drilling, and thus the labor intensity of workers may be reduced.

Abstract: A display substrate and a display device are provided. The display substrate includes a base substrate and a plurality of subpixels provided on the base substrate. Each subpixel includes a pixel circuit. The plurality of subpixels include first subpixels. The display substrate further includes power lines. Each power line is configured to provide a first supply voltage for the corresponding first subpixels, the power line is provided on a side of the pixel electrode of the first subpixel near the base substrate, and the power line includes a power line main body and a power line protrusion protruded from the power line main body. The power line protrusion is at least partially overlapped with the pixel electrode of the first subpixel in a direction perpendicular to the base substrate. The display substrate can effectively improve the display quality.

Abstract: The present disclosure provides a tension-leg floating offshore platform, including a floating body assembly and a detachable temporary floating body; where, during a process of the floating body assembly being towed to an operating sea area, the temporary floating body is movably installed on the floating body assembly; after the floating body assembly is moored to the operating sea area, the temporary floating body is separated from the floating body assembly. The tension-leg floating offshore platform provided in the present disclosure enables the tension-leg floating offshore platform to maintain stability during its installation process.

Abstract: The present disclosure provides a semiconductor device and a fabricating method thereof, and which includes a substrate, bit lines, bit line contacts, a gate structure, a first oxidized interface layer, and a second oxidized interface layer. The bit lines are disposed on the substrate, and the bit line contacts are disposed below the bit lines. The gate structure is disposed on the substrate, wherein each bit line and the gate structure respectively include a semiconductor layer, a conductive layer, and a covering layer stacked from bottom to top. The first oxidized interface layer is disposed between each bit line contact and the semiconductor layer of each bit line. The second oxidized interface layer is disposed within the semiconductor layer of the gate structure, wherein a topmost surface of the first oxidized interface layer is higher than a topmost surface of the second oxidized interface layer.

Abstract: A display substrate includes: a base substrate and a plurality of sub-pixels arranged on the base substrate, the sub-pixel include a sub-pixel driving circuit, the sub-pixel driving circuit includes: a first transistor, a driving transistor, and a first conductive connection portion; a first electrode of the first transistor is coupled to a second electrode of the driving transistor, a second electrode of the first transistor and a first end portion of the first conductive connection portion are arranged at different layers, the second electrode of the first transistor and the first end portion of the first conductive connection portion are coupled through a via hole; a second end portion of the first conductive connection portion is coupled to a gate electrode of the driving transistor.

Abstract: Disclosed is a three-axis Hall angle sensor with an accuracy of 0.3°. The sensor is mainly designed by means of finite element software and COMSOL Multiphysics. The present specification will be mainly performed in three steps. In the first step, a cross-shape horizontal Hall element for measuring the magnetic field in the vertical direction, that is, the direction z, is studied. The second section mainly studies a three-contact four-Hall vertical element for measuring the magnetic field in the directions x, y. The third part is to design the angle sensor. Compared with the horizontal Hall element, the vertical Hall element has a relatively large offset, therefore, four vertical Hall elements are used to measure the magnetic field in the horizontal direction, and two complementary vertical structures are used to eliminate the error when the magnetic field in the same horizontal direction is measured.

Abstract: Provided is an ATF (Automatic Transmission Fluid) oil and corona-resistant enameled wire for electric vehicle motors, belonging to the insulating materials field. The ATF oil and corona-resistant enameled wire for electric vehicle motors comprises a copper conductor and an insulating layer, wherein said insulating layer from inside to outside is composed of ATF oil and corona-resistant protective film, corona-resistant PAI film, ATF oil and corona-resistant protective film, corona-resistant PAI film, ATF oil and corona-resistant protective film. The ATF oil and corona resistant enameled wire of this disclosure is suitable for the preparation of oil-cooled electric vehicle motor loose winding coil due to the advantages of good manufacturability, excellent ATF oil and corona resistance, and low manufacturing cost.

Abstract: An electronic device includes a package substrate having a top surface and a bottom surface. An integrated circuit (“IC”) die is disposed on the top surface of the package substrate. The electronic device also includes a stiffener having a ring body and a plurality of support members. The ring body is secured to the top surface of the package substrate and circumscribes the IC die. The plurality of support members extend from the ring body to below the bottom surface of the package substrate.

Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a cooling component, and a frame structure that is coupled to the cooling component by way of at least one fastener. The SoW assembly can include an interposer assembly that is disposed on a SoW. At least a portion of the interposer assembly can be disposed between the cooling component and the frame structure. The SoW assembly can include a gasket disposed between the portion of the interposer assembly and the frame structure.

Abstract: A connector system is disclosed. The connector system can include a support structure, a holder coupled to the support structure, an alignment adjustment structure positioned between the support structure and the holder, and an actuator. The holder can receive a first connector of a connection line. The alignment adjustment structure is compressible along a first axis and movable along a second axis different from the first axis. The actuator is configured to provide movement of the holder so as to connect the first connector to a second connector of a processor system, such as a system on wafer (SoW) assembly.

Abstract: Electronic assemblies with a cold plate having an opening are provided. In one aspect. a system includes an array of electronic components. a control board. and a cold plate having a plurality of openings therethrough. The cold plate can be arranged between the array of electronic components and the control board. The cold plate can cool the array of electronic components. The system can also include a plurality of pass through connectors arranged in the openings in the cold plate and configured to connect the array of electronic components to the control board. The cold plate can also be used to cool the control board electronics and the connectors passing through.

Abstract: An array of compliant connectors for electronic assemblies is provided. In one aspect, a system includes an array of first electronic components and an array of second electronic components. Each of the second electronic components is paired with corresponding to one of the first electronic components. Each pair of the first and second electronic components is coupled via a plurality of compliant connectors.

Abstract: An electrical connection device includes a panel and a connector. The panel is formed with an opened hole. The connector includes an insulative housing and a locking member. The insulative housing is configured to be capable of inserting into the opened hole of the panel and moving to an assembled position. The locking member has a protecting frame and a locking arm. The protecting frame has an inner frame body, an outer frame body and two side frame bodies which connects the inner frame body and the outer frame body. The locking arm has two end portions, an elastic arm portion and a lock protruding portion. The elastic arm portion is constructed as an elastic zone. The two end portions are connected to an inner side of the outer frame body so that the two side frame bodies are constructed as a deformable zone. When the lock protruding portion is squeezed by the panel, the elastic zone and the deformable zone all are capable of bending deformation.

Abstract: Wafer assemblies and related methods of manufacture are disclosed. Such assemblies and methods can account for different heights of electronic modules positioned on a wafer. In an embodiment, a wafer assembly includes a cooling system, a wafer, a first electronic module, a second electronic module, and a height adjustment structure. A first thermal interface material (TIM) can be disposed between the first electronic module and a first portion of the cooling system. A second TIM can be disposed between the second electronic module and a second portion of the cooling system. The height adjustment structure can compensate for a height difference between the first electronic module and the second electronic module. Other wafer assemblies and methods of manufacture are disclosed.

Abstract: An electrical connector assembly, a first electrical connector and a second electrical connector are provided. The first electrical connector includes a first insulating body and a plurality of first conductive terminals. The first insulating body includes a mis-insertion proof connecting board which is provided between the two adjacent terminal receiving posts and a mis-insertion proof rib which protrudes upwardly from the terminal receiving post. The second electrical connector includes a second insulating body and a plurality of second conductive terminals. The second insulating body includes a mis-insertion proof notch which is provided on the partitioning wall and mis-insertion proof avoiding openings which are provided to a top portion of the mating cavity.

Abstract: A frame rate control method is provided. A primary scenario and a non-primary scenario are identified according to two or more windows displayed on a screen. Each of the primary scenario and the non-primary scenario is performed by an individual application. A frame rate of the non-primary scenario is decreased when a performance index indicates that a first condition is present. The application corresponding to the non-primary scenario is disabled when the performance index indicates that a second condition is present after decreasing the frame rate of the non-primary scenario, so as to remove the window corresponding to the non-primary scenario from the screen.

Abstract: A modeling method for a tubular structure includes: acquiring a structural wire-frame; generating, at each non-manifold node of non-manifold nodes of the structural wire-frame, a polyhedral structure formed by faces of a polyhedron; generating, at each manifold node of manifold nodes of the structural wire-frame, a connecting face; generating, at each end node of end nodes of the structural wire-frame, an end face; connecting vertices of the connecting wire-frame, vertices of the connecting face, and vertices of the end face; and carrying out curved-surface subdivision.

Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a first SoW assembly structure with a first coefficient of thermal expansion (CTE). The first SoW assembly structure includes first to third slots at different locations. The SoW assembly can include a second SoW assembly structure stacked on the first SoW assembly structure. The second SoW assembly structure has a second CTE different from the first CTE. The second SoW assembly structure has first to third pins extending therefrom and disposed in the first to third slots. The first and second slots shaped to allow the first and second pins to move along a first axis, and the third slot shaped to allow the third pin to move along a second axis. The first SoW assembly structure can be a SoW and the second SoW assembly structure can be a heat dissipation structure in certain applications.

Abstract: The present invention relates to a high-order parity-time (PT) symmetry wireless power transfer (WPT) system and method. The method includes the following steps: providing an N-order composite coil which includes N resonance circuits, where N is an odd number; providing an M-order composite coil which includes M resonance circuits, where M is an even number; connecting a scattering capacitor to end portions of two adjacent resonance circuits; coupling the first resonance circuits in the two composite coils to realize WPT; connecting a load to an alternating current power supply; and adjusting a capacitor in the resonance circuit symmetrical to the two first resonance circuits according to a change in coupling strength caused by a change in coupling distance in a WPT process to obtain an optimal transfer efficiency.