Abstract: The present teaching relates to a method and system for path planning. Information of a current pose of a robotic arm having a plurality of operable segments is obtained. The information includes a plurality of values, each of which corresponds to an angle formed between consecutive operable segments of the robotic arm. A desired pose where the robotic arm needs to reach is also obtained. An angle step-value is computed for the current pose of the robotic arm based on a function of a distance between the current pose and the desired pose, wherein the angle step value is to be used to determine a plurality of candidate next poses of the plurality of operable segments. One or more of candidate next poses is selected based on at least one criterion, and a trajectory is determined from the current pose to the desired pose based on the selected next poses.

Abstract: Semiconductor packages with electromagnetic interference supported stacked die and a method of manufacture therefor is disclosed. The semiconductor packages may house a stack of dies in a system in a package (SiP) implementation, where one or more of the dies may be wire bonded to a semiconductor package substrate. The dies may be stacked in a partially overlapping, and staggered manner, such that portions of some dies may protrude out over an edge of a die that is below it. This dies stacking may define a cavity, and in some cases, wire bonds may be made to the protruding portions of the die. Underfill material may be provided in the cavity and cured to form an underfill support. Wire bonding of the bond pads overlying the cavity formed by the staggered stacking of the dies may be performed after the formation of the underfill support.

Abstract: Semiconductor packages with electromagnetic interference supported stacked die and a method of manufacture therefor is disclosed. The semiconductor packages may house a stack of dies in a system in a package (SiP) implementation, where one or more of the dies may be wire bonded to a semiconductor package substrate. The dies may be stacked in a partially overlapping, and staggered manner, such that portions of some dies may protrude out over an edge of a die that is below it. This dies stacking may define a cavity, and in some cases, wire bonds may be made to the protruding portions of the die. Underfill material may be provided in the cavity and cured to form an underfill support. Wire bonding of the bond pads overlying the cavity formed by the staggered stacking of the dies may be performed after the formation of the underfill support.

Abstract: Electrets can be produced from cycloolefin copolymers (COCs), and charges applied thereto are stable for long periods, even at high temperatures and high relative humidities. The reduction here in a positive charge applied to the COCs is smaller than that of negative charges applied to the COCs. The stability over time of the charges applied is impaired by adding polar additives, such as inorganic silicon compounds. Films, fibers or nonwovens produced from electrets can be processed to give filters.