Abstract: A lead frame for a semiconductor device includes at least one row of contact terminals and a die pad for receiving an integrated circuit die. An isolation material is located between the contact terminals and the die pad. The isolation material electrically isolates adjacent lead fingers from each other and from the die pad. The isolation material also holds the lead fingers in place during a wire bonding operation and thus the bottom of the lead frame does not have to be taped during the assembly process, which saves taping and detaping steps from being performed. The isolation material also prevents resin bleed problems that sometimes occur when using tape. If a sawing step is performed, the saw need only cut through the isolation material instead of a metal, and thus saw blade life is improved.

Abstract: In a semiconductor package having a plurality of wire bond interconnections between a semiconductor chip and a chip carrier, a wire bond (20) including a first stitch bond (22) formed at a first location (24) on a bonding site (26), and a second stitch bond (40) formed at a second location (42) on the bonding site (26) such that the second bond (40) forms two crescent shaped areas (48, 50) and overlaps the first bond (22).