Abstract: An integrated circuit package system includes a bottom lid, a base integrated circuit over the bottom lid, and a top lid with an integrated circuit window opening over the bottom lid.

Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a paddle having an indented planar surface intersecting an outwardly extending planar surface at an angle of approximately 135 degrees plus 25 degrees or minus 5 degrees; mounting an integrated circuit over the paddle; and forming an encapsulation over the integrated circuit and under the extension void free.

Abstract: A method of manufacture of an integrated circuit packaging system includes: applying a conductive material on a support structure; providing a bottom integrated circuit package having a bottom lead extended therefrom; attaching the bottom lead to the conductive material; stacking a top integrated circuit package over the bottom integrated circuit package, the top integrated circuit package having a top lead extending therefrom and the top lead over the bottom lead; attaching a conductive paste at an end portion of the top lead; and forming a stacking joint by flowing the conductive paste and the conductive material, the stacking joint below the top lead as well as below and above the bottom lead.

Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a paddle having an indented planar surface intersecting an outwardly extending planar surface at an angle of approximately 135 degrees plus 25 degrees or minus 5 degrees; mounting an integrated circuit over the paddle; and forming an encapsulation over the integrated circuit and under the extension void free.

Abstract: A method of manufacture of an integrated circuit packaging system includes: applying a conductive material on a support structure; providing a bottom integrated circuit package having a bottom lead extended therefrom; attaching the bottom lead to the conductive material; stacking a top integrated circuit package over the bottom integrated circuit package, the top integrated circuit package having a top lead extending therefrom and the top lead over the bottom lead; attaching a conductive paste at an end portion of the top lead; and forming a stacking joint by flowing the conductive paste and the conductive material, the stacking joint below the top lead as well as below and above the bottom lead.

Abstract: Pick-up heads and systems are especially useful for picking up, transporting, and placing semiconductor dies at bond sites on packaging substrates. Alternatively, the heads and systems are useful for performing these tasks with any of various other planar objects. An exemplary head includes a shank and a body. The body includes a compliant end portion contactable by the shank, and the end portion includes a face. The shank is movable relative to the end portion such that, whenever the shank is retracted, the face has a substantially planar contour, and whenever the shank is extended, the shank contacts and urges the end portion to provide the face with a convex contour. The end portion desirably defines at least one vacuum orifice connected to an evacuation device (e.g., a vacuum pump) that evacuates the vacuum orifice sufficiently to cause the planar object to adhere to the face.

Abstract: An integrated circuit package system including: providing a substrate having a support mounted thereover; mounting an integrated circuit die above the substrate; mounting a wire-bonded die offset above the integrated circuit die creating an overhang supported by the support; connecting the wire-bonded die to the substrate with bond wires; and encapsulating the integrated circuit die, the wire-bonded die and the bond wires with an encapsulation.

Abstract: An integrated circuit package system including: providing a substrate having a support mounted thereover; mounting an integrated circuit die above the substrate; mounting a wire-bonded die offset above the integrated circuit die creating an overhang supported by the support; connecting the wire-bonded die to the substrate with bond wires; and encapsulating the integrated circuit die, the wire-bonded die and the bond wires with an encapsulation.

Abstract: Pick-up heads and systems including such heads are disclosed. The pick-up heads and systems are especially useful for picking up, transporting, and placing semiconductor dies at bond sites on packaging substrates. Alternatively, the heads and systems are useful for performing these tasks with any of various other planar objects. An exemplary head includes a shank and a body. The body includes a compliant end portion contactable by the shank, and the end portion includes a face. The shank is movable relative to the end portion such that, whenever the shank is retracted, the face has a substantially planar contour, and whenever the shank is extended, the shank contacts and urges the end portion to provide the face with a convex contour. The end portion desirably defines at least one vacuum orifice connected to an evacuation device (e.g., a vacuum pump) that evacuates the vacuum orifice sufficiently to cause the planar object to adhere to the face.

Abstract: An integrated circuit package system includes a bottom lid, a base integrated circuit over the bottom lid, and a top lid with an integrated circuit window opening over the bottom lid.