Patents by Inventor Guo-Shau Luo

Guo-Shau Luo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure and method of forming the same
    Patent number: 10269692
    Abstract: A package structure that includes a first redistribution structure and a second redistribution structure is provided. The first redistribution structure includes a first dielectric layer, and a first redistribution circuit in the first dielectric layer. The second redistribution structure includes a first portion on the first redistribution structure and a second portion on the first portion, and each of the portions is electrically connected to the first redistribution structure and the first portion, respectively. The circuit density of the second portion is lower than that of the first portion. The first portion includes a second dielectric layer having a second redistribution circuit therein. The second portion includes a third dielectric layer having a third redistribution circuit therein. The third dielectric layer has a stiffener layer, which is separated from the third redistribution circuit by the third dielectric layer. A method of forming a package structure is also provided.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: April 23, 2019
    Assignee: NAN YA PRINTED CIRCUIT BOARD CORPORATION
    Inventors: Chin-Yi Chuang, Guo-Shau Luo, Shing-Fun Ho