Abstract: A laminated substrate separating device used for separating a first substrate from a second substrate of a laminated substrate is provided. The first and the second substrates are misaligned at an edge of the laminated substrate. The laminated substrate separating device includes a base where the laminated substrate is disposed thereon, and a separating tool movably disposed on the base along an axis. The separating tool presses a portion of the first substrate being exposed out of the second substrate at a misaligned edge such that a gap is formed between the first and the second substrates. The separating tool inserts into the gap at the misaligned edge to press the first substrate, such that the second substrate is separated from the first substrate. A method for separating laminated substrate is also provided.

Abstract: A laminated substrate separating device used for separating a first substrate from a second substrate of a laminated substrate is provided. The first and the second substrates are misaligned at an edge of the laminated substrate. The laminated substrate separating device includes a base where the laminated substrate is disposed thereon, and a separating tool movably disposed on the base along an axis. The separating tool presses a portion of the first substrate being exposed out of the second substrate at a misaligned edge such that a gap is formed between the first and the second substrates. The separating tool inserts into the gap at the misaligned edge to press the first substrate, such that the second substrate is separated from the first substrate. A method for separating laminated substrate is also provided.

Abstract: A testing method of bending stress and a testing apparatus thereof are provided. The method includes the following steps. A stress distribution model of a structure to be tested is built. Next, a testing sample of the structure to be tested is provided, and a force is applied on two ends of the testing sample to bend the testing sample till it breaks at a breaking point, so as to obtain a first distance between the two ends of the testing sample when the testing sample breaks, or a second distance from the breaking point to a closer end of the two ends. Next, a maximum principle stress value of the stress distribution model or a break point principle stress value at the breaking point of the stress distribution model is obtained according to the first distance or the second distance.

Abstract: A measuring device linked to a conveyor for transporting a flexible glass is provided. The measuring device includes a base, a first roller, and at least one second roller. The first roller disposed on the base moves back and forth along a first axis. The second roller disposed on the base moves back and forth along a second axis. The flexible glass enters the conveyor passing through the second roller and the first roller. An operation method of the measuring device is also provided.

Abstract: A conveying apparatus used for conveying an object is provided. The conveying apparatus includes a first conveying unit, a second conveying unit, and a supporting unit. An object leans against the first conveying unit and the second conveying unit and moves from the first conveying unit toward the second conveying unit along a conveying path. The supporting unit is configured between the first conveying unit and the second conveying unit to support and guide the object.

Abstract: A testing method of bending stress and a testing apparatus thereof are provided. The method includes the following steps. A stress distribution model of a structure to be tested is built. Next, a testing sample of the structure to be tested is provided, and a force is applied on two ends of the testing sample to bend the testing sample till it breaks at a breaking point, so as to obtain a first distance between the two ends of the testing sample when the testing sample breaks, or a second distance from the breaking point to a closer end of the two ends. Next, a maximum principle stress value of the stress distribution model or a break point principle stress value at the breaking point of the stress distribution model is obtained according to the first distance or the second distance.

Abstract: A conveying apparatus used for conveying an object is provided. The conveying apparatus includes a first conveying unit, a second conveying unit, and a supporting unit. An object leans against the first conveying unit and the second conveying unit and moves from the first conveying unit toward the second conveying unit along a conveying path. The supporting unit is configured between the first conveying unit and the second conveying unit to support and guide the object.

Abstract: A conveyor apparatus including a control module, an unwinding module, at least one tension sensing module, and a rewinding module is provided. The tension sensing module includes a load cell disposed between a set of rollers. An objet is conveyed along a conveying direction perpendicular to an axis of the roller. A wrap angle is formed by the object and the roller with a fulcrum of the loadi cell served as a center, and the wrap angle is less than 180°. The rewinding and unwinding modules have different actuating units electrically connected to the control module respectively, such that the object is wound or unwound by the rewinding and the unwinding modules.

Abstract: A measuring device linked to a conveyor for transporting a flexible glass is provided. The measuring device includes a base, a first roller, and at least one second roller. The first roller disposed on the base moves back and forth along a first axis. The second roller disposed on the base moves back and forth along a second axis. The flexible glass enters the conveyor passing through the second roller and the first roller. An operation method of the measuring device is also provided.

Abstract: A plasma assisted apparatus for organic film deposition, comprising: a plasma chamber, capable of thermally cracking a precursor in the plasma chamber; and a deposition chamber, being channeled with the plasma chamber for receiving the thermally cracked precursor. In an exemplary embodiment, the deposition chamber further comprises a substrate device, being provided for the thermally cracked precursor to deposit thereon to form an organic film. As the plasma chamber is separated from the deposition chamber in the aforesaid apparatus, a low-temperature film deposition process can be used for forming organic films while preventing the substrate device from being bombarded directly by plasma. In addition, as there is a flow guiding device arranged at the outlet of the plasma chamber, the thermally cracked precursor is guided or disturbed and thus is prevented from overly concentrating at the outlet or the center of the substrate device.

Abstract: A method and an apparatus for inspecting radio frequency identification (RFID) tags which utilize a way of shielding for inspecting whether RFID tags function properly or not. The method of the present invention comprises steps of: reading a plurality of RFID tags in a readable zone; and determining whether there is any malfunctional RFID tag in the plurality of RFID tags. If all the plurality of RFID tags function properly, the method will check a next plurality of RFID tags. If there is at least one unreadable RFID tag, the at least one malfunctional RFID tag will be found by shielding one or the plurality of RFID tags. By means of the disclosure in the present invention, the present method and apparatus are capable of improving the efficiency during inspection and simplifying the design of a readable zone.

Abstract: A plasma assisted apparatus for organic film deposition, comprising: a plasma chamber, capable of thermally cracking a precursor in the plasma chamber; and a deposition chamber, being channeled with the plasma chamber for receiving the thermally cracked precursor. In an exemplary embodiment, the deposition chamber further comprises a substrate device, being provided for the thermally cracked precursor to deposit thereon to form an organic film. As the plasma chamber is separated from the deposition chamber in the aforesaid apparatus, a low-temperature film deposition process can be used for forming organic films while preventing the substrate device from being bombarded directly by plasma. In addition, as there is a flow guiding device arranged at the outlet of the plasma chamber, the thermally cracked precursor is guided or disturbed and thus is prevented from overly concentrating at the outlet or the center of the substrate device.

Abstract: A method and an apparatus for inspecting radio frequency identification (RFID) tags which utilize a way of shielding for inspecting whether RFID tags function properly or not. The method of the present invention comprises steps of: reading a plurality of RFID tags in a readable zone; and determining whether there is any malfunctional RFID tag in the plurality of RFID tags. If all the plurality of RFID tags function properly, the method will check a next plurality of RFID tags. If there is at least one unreadable RFID tag, the at least one malfunctional RFID tag will be found by shielding one or the plurality of RFID tags. By means of the disclosure in the present invention, the present method and apparatus are capable of improving the efficiency during inspection and simplifying the design of a readable zone.

Abstract: A wafer bonding method, comprising steps of: coating a medium layer respectively on the surfaces of two wafers; removing impurities formed on the surface of each medium layer; laminating the two wafers while enabling the surface coated with the medium layer of one of the two wafers to face the surface coated with the medium layer of another wafer; and applying an ultra-sonic oscillation and a bonding pressure upon the laminated wafers for bonding the two wafers.

Abstract: A wafer bonding method, comprising steps of: coating a medium layer respectively on the surfaces of two wafers; removing impurities formed on the surface of each medium layer; laminating the two wafers while enabling the surface coated with the medium layer of one of the two wafers to face the surface coated with the medium layer of another wafer; and applying an ultra-sonic oscillation and a bonding pressure upon the laminated wafers for bonding the two wafers.

Abstract: A balancing vertical load device for a motor, to be used in conjunction with a vertical driving device with a force- and position-controlled motor, comprising a motor assembly and a sealed air pressure system. The motor assembly has a motor, and a load weight which, driven by the motor, performs a vertical movement. The sealed air pressure system has an air cylinder, a piston, gliding inside the air cylinder with low friction and being connected with the load weight, an air container, storing a relatively large air volume, and an air pressure source. The sealed air pressure system balances a load of the load weight, so that precise control of force and position of a vertically moving object, as if moving horizontally, is achieved.

Abstract: A balancing vertical load device for a motor, to be used in conjunction with a vertical driving device with a force- and position-controlled motor, comprising a motor assembly and a sealed air pressure system. The motor assembly has a motor, and a load weight which, driven by the motor, performs a vertical movement. The sealed air pressure system has an air cylinder, a piston, gliding inside the air cylinder with low friction and being connected with the load weight, an air container, storing a relatively large air volume, and an air pressure source. The sealed air pressure system balances a load of the load weight, so that precise control of force and position of a vertically moving object, as if moving horizontally, is achieved.