Abstract: The present invention relates to the identification of proteins which bind the dendritic cell marker known as Clec9A. The present invention provides new compounds for targeting therapeutic agents such as antigens to dendritic cells. Also provided are methods of modulating a humoral and/or T cell mediated immune response to the antigen, methods of delivery of a cytotoxic agent to dendritic cells thereof involved in diseased states, methods of modulating the uptake and/or clearance of cells with a disrupted cell membrane, cells infected with a pathogen, dying cells or dead cells, or a portion thereof, and methods of modulating antigen recognition, processing and/or presentation, as well as immune responses to material derived from cells with a disrupted cell membrane, cells infected with a pathogen, dying cells or dead cells, or a portion thereof.

Abstract: A method for performing a photolithography process includes providing a reticle on a projection apparatus, the reticle having a test pattern defined thereon, the test pattern including a plurality of one-dimensional structures and a plurality of two-dimensional structures. The test pattern defined on the reticle is transferred to at least one area on a wafer. The projection apparatus is focused on the test pattern transferred on the wafer during a photolithography process to perform a process monitoring.

Abstract: A computer system includes a chassis and an airflow guiding duct. The chassis includes a chassis bottom wall, a chassis front wall and a chassis rear wall. The chassis front wall defines a first ventilation hole, and the chassis rear wall defines a second ventilation hole. A motherboard is secured to the chassis bottom wall between the chassis front wall and the chassis rear wall. A memory card is secured to the motherboard. The airflow guiding duct is secured in the chassis and includes an entrance portion. The entrance portion covers a portion of the memory card, so as to guide airflow. Airflow flows in the chassis via the first ventilation hole, over the memory card, and then out of the chassis via the second ventilation hole.

Abstract: A heat dissipating device includes a heat sink and a fan. The heat sink includes a base configured to contact a heat generating element, and a plurality of fins extending from the base. The base defines an axis. Each fin includes an end portion extending about the axis of the base in one of a clockwise direction and an anti-clockwise direction. The fan is placed on the heat sink. The fan defines a first opening and a second opening adjacent to the base. The fan is operating and pivoted about the axis of the base in the other one of a clockwise direction and an anti-clockwise direction.

Abstract: The present invention relates to methods of modulating the uptake and/or clearance of cells with a disrupted cell membrane, cells infected with a pathogen, dying cells or dead cells, or a portion thereof, which can be used to treat and/or prevent diseases such as cancer, autoimmunity and infections. The present invention also relates to methods of modulating antigen recognition, processing and/or presentation, as well as immune responses to material derived from cells with a disrupted cell membrane, cells infected with a pathogen, dying cells or dead cells, or a portion thereof. The present invention further relates to methods of detecting cells with a disrupted cell membrane, cells infected with a pathogen, dying cells or dead cells, or a portion thereof.

Abstract: A heat dissipating system includes an enclosure, a first fan module, a second fan module of a computer power source. The enclosure has a front panel, a rear panel parallel to the front panel, a side panel, and a top panel. The rear panel defines an output vent therein. A disk drive module is disposed on the front panel and near the top panel. A motherboard with a CPU is disposed on the side panel. The first fan module is configured to dissipate heat generated by the CPU. The second fan module is placed on the rear panel and is aligned with the output vent of the rear panel. The top panel defines a plurality of airflow holes corresponding to the disk drive module. The plurality of the airflow holes is capable of allowing air to flow to the disk drive module for heat dissipating.

Abstract: A computer system includes a chassis and an airflow guiding duct. The chassis includes a chassis bottom wall, a chassis front wall and a chassis rear wall. The chassis front wall defines a first ventilation hole, and the chassis rear wall defines a second ventilation hole. A motherboard is secured to the chassis bottom wall between the chassis front wall and the chassis rear wall. A memory card is secured to the motherboard. The airflow guiding duct is secured in the chassis and includes an entrance portion. The entrance portion covers a portion of the memory card, so as to guide airflow. Airflow flows in the chassis via the first ventilation hole, over the memory card, and then out of the chassis via the second ventilation hole.

Abstract: A heat dissipating device includes a heat sink and a heat sink cover. The heat sink includes a base and a plurality of fins extending from the base. Each of the plurality of fins includes a corner projection. The heat sink cover covers the corner projections of the heat sink.

Abstract: Methods, systems, and apparatus, including computer program products feature providing a rendering of a three-dimensional assembly of components. An explosion sequence for separating first components of the assembly is determined. The explosion sequence comprises stages in which each stage represents a different spatial relationship between two or more of the first components. A first input is received from an interactive control. A first stage in the explosion sequence is selected based on the first input. The rendering of the assembly is updated, responsive to the first input, to show the first stage of the explosion sequence. A second input is received from the interactive control. A different second stage in the explosion sequence is selected based on the second input. The rendering of the assembly is updated, responsive to the second input, to show the second stage of the explosion sequence.

Abstract: A coaxial connector (100) includes a bracket (10) defining a cavity (15), a central pin (30) received in the cavity and an insulative member (20). The central pin includes a contact portion (31), a mounting portion (32), and a fixing portion (33) disposed between the contact portion and the mounting portion. The fixing portion has at least an engaging face (331) extending along a direction angled to a rotating direction of the central pin. The insulative member is mounted around the fixing portion of the central pin and disposed between the bracket and the central pin. The insulative member includes a working face (211) engaging with the engaging face of the central pin.

Abstract: A heat dissipating assembly includes a heat exchanger and an air duct. The heat exchanger includes a plurality of fins aligned in a row, and the fins cooperatively define a plurality of heat dissipating channels. A guiding slot is defined in the heat exchanger. The air duct defines a passage. A positioning hook extends from the air duct and engages in the guiding slot to so that the air duct passage and are aligned with the heat dissipating channels so that an air flow is capable of passing through the air duct passage via the heat dissipating channels.

Abstract: A housing for an electronic device includes a metallic base, a chemical plating layer, a prime layer, a color coating layer, a decorative layer, and a transparent protection layer. The chemical plating layer, the prime layer, the color coating layer, the decorative layer, and the transparent protection layer are coated on the metallic base in that order. The color coating layer defines a pattern embedded in the color coating layer. The decorative layer is coated on the color coating layer and the pattern. The decorative layer has light reflective capability, and a thickness of the decorative layer is less than a depth of the pattern.

Abstract: A housing for an electronic device includes a plastic base, a prime layer, a decorative layer, and a transparent protection layer. The prime layer is coated on the plastic base, and defines a pattern embedded in the prime layer. The decorative layer is coated on the prime layer and the pattern. The decorative layer has a light reflective capability, and a thickness of the decorative layer is less than a depth of the pattern. The transparent protection layer is coated on the decorative layer.

Abstract: A housing for an electronic device includes a plastic base, a prime layer, a decorative layer, and a transparent protection layer. The prime layer, the decorative layer, and the transparent protection layer are coated on the plastic base in that order. The decorative layer defines a pattern extending through the decorative layer.

Abstract: A housing for a portable electronic device includes a metallic base, a chemical plating layer, a prime layer, a color coating layer, a decorative layer, and a transparent protection layer. The chemical plating layer, the prime layer, the color coating layer, the decorative layer, and the transparent protection layer are coated on the metallic base in that order. The decorative layer defines a pattern extending through the decorative layer.

Abstract: A housing includes a plastic substrate, a supporting layer, a hair line layer, a decorative layer, and a transparent protection layer. The supporting layer, the hair line layer, the decorative layer, and the transparent protection layer are formed on the substrate in that order.

Abstract: A coaxial connector (1) having a moveable terminal includes a metallic bracket (10) defining a receiving space (100) therein. A contact terminal (20) is insulated assembled to the bracket and configured a stationary first part (31) and a second part (33) telescopically assembled within the first part.

Abstract: A process in which a salt of clavulanic acid, typically an amine salt or an alkali metal salt is exposed to conditions, particularly a pH of less than 6.0, which reduces the quantity of contaminating impurities. The process may be a washing process, a recrystallisation process or a preparative process.

Abstract: A coaxial connector (1, 1?, 1?) for being mounted on a panel (300) includes a metallic bracket (10, 10?, 10?) defining a receiving space (11, 11?, 11?) therein, an insulative member (20, 20?, 20?) mounted on the metallic bracket and a contact terminal (30, 30?, 30?) received in the securing portion. The insulative member has a securing portion (21, 21?, 21?) received in the receiving space and defining a passage (210, 210?, 210?), and a mounting portion (22, 22?, 22?) integrated with the securing portion for being mounted on the panel. The contact terminal is received in the passage of the securing portion.

Abstract: A heat sink includes a plurality of fins parallel to each other. The fins include a top portion having a flange. The opposite ends of each flange are rounded. Two rounded corners are located below the plane defined by the flange.