Abstract: Provided is a production process of an S355J2 hot rolled H-beam for a Ce-containing beam-column member, relating to the production of hot-rolled H-beams. The production process can ensure the performance of the hot-rolled H-beam with multiple classes from one steel grade, and achieve low cost, stability, uniformity, consistency, and narrow composition control of various elements. In the S355J2 hot-rolled H-beam for a Ce-containing beam-column member, a hot-rolled H-beam is prepared from the following compositions by mass fraction: 0.18%-0.20% of C, 0.25%-0.30% of Si, 1.22%-1.27% of Mn, less than or equal to 0.025% of P, less than or equal to 0.025% of S, 0.008%-0.011% of Nb, 0.008%-0.012% of V, 0.004%-0.008% of N, 0.0015%-0.0055% of Ce, less than or equal to 0.015% of Al, and the rest of Fe and inevitable impurities.

Abstract: A surface-mounted polymer PTC overcurrent protection element having a small package size, comprising a PTC chip, an insulating layer (30), end electrodes (41, 42), and at least one conductive member (60). A dividing gap is designed on a first conductive electrode (21) to form first and second conductive areas (211, 212); the conductive member (60) is arranged at the edge or at least a corner of the first conductive area (211) side of the PTC chip, is used for conducting the first conductive area (211) and a second conductive electrode (22) on the PTC chip, and is not in contact with the end electrodes (41, 42); the main portion comprised in the dividing gap (70) of the first conductive electrode (21) is parallel to the longitudinal direction of the first end electrode (41) and the second end electrode (42). Also provided is a preparation method for the protection element. Thus, the miniaturized overcurrent protection element can satisfy the current PCB process to achieve requirements of mass production.

Abstract: A method for evaluating brittleness of a deep shale reservoir and a computer readable storage medium. The method includes determining a Rickman brittleness index of the deep shale reservoir and determining an effective pressure of the deep shale reservoir according to a pore pressure and an overlying formation pressure of the deep shale reservoir. The Rickman brittleness index is adjusted to obtain the brittleness index of the deep shale reservoir according to an exponential relationship of the brittleness index with the effective pressure of the deep shale reservoir. Inherent properties, such as rock brittle mineral content and the like, are better indicated by the Rickamn brittleness index, and then the brittleness index of the deep shale reservoir is obtained by utilizing the exponential relationship of the brittleness index with the effective pressure of the deep shale reservoir, to realize reasonable evaluation for the brittleness of the deep shale reservoir.

Abstract: A circuit protection assembly has a protection element having a positive temperature coefficient of resistance and consisting of a polymer-based conductive composite material layer tightly clamped and fixed between two metal electrodes and a copper clad laminate having a through hole in a middle thereof, wherein the protection element is provided in the through hole, the copper clad laminate serves as a substrate for the circuit protection assembly and has an adhesive layer on an upper surface and a lower surface thereof, so as to cover the protection element in a space formed by the copper clad laminate and the upper and the lower adhesive layers. The protection element having a positive temperature coefficient of resistance is electrically connected to a protected circuit via a conductive part.

Abstract: A circuit protection assembly has a protection element having a positive temperature coefficient of resistance and consisting of a polymer-based conductive composite material layer tightly clamped and fixed between two metal electrodes and a copper clad laminate having a through hole in a middle thereof, wherein the protection element is provided in the through hole, the copper clad laminate serves as a substrate for the circuit protection assembly and has an adhesive layer on an upper surface and a lower surface thereof, so as to cover the protection element in a space formed by the copper clad laminate and the upper and the lower adhesive layers. The protection element having a positive temperature coefficient of resistance is electrically connected to a protected circuit via a conductive part.