Abstract: Provided is a method for manufacturing an array substrate. The method includes: providing a base substrate with a conductive pattern layer, wherein the base substrate is provided with a display region and a peripheral region disposed around the display region, wherein the conductive pattern layer includes a plurality of conductive lines disposed in the peripheral region; forming an electrode material film layer on the conductive pattern layer; forming a mask layer on the electrode material film layer, wherein the mask layer includes a plurality of electrode layer patterns disposed in the display region and protection patterns disposed above the conductive lines; and etching the electrode material film layer and removing the mask layer.

Abstract: The present disclosure provides a display backplane, a method for preparing the same, and a display device. The display backplane includes a substrate, an electronic device and an alignment mark arranged on the substrate, and a filling layer, the filling layer being filled in at least a part of a recessed area located on a surface of the substrate away from the electronic device, and a minimum distance between an orthogonal projection of the at least part of the recessed area on the substrate and an orthogonal projection of the alignment mark on the substrate being less than 200 ?m.

Abstract: The present disclosure provides a display backplane, a method for preparing the same, and a display device. The display backplane includes a substrate, an electronic device and an alignment mark arranged on the substrate, and a filling layer, the filling layer being filled in at least a part of a recessed area located on a surface of the substrate away from the electronic device, and a minimum distance between an orthogonal projection of the at least part of the recessed area on the substrate and an orthogonal projection of the alignment mark on the substrate being less than 200 ?m.