Abstract: The present disclosure provides a laser diode package module. The laser diode package module includes a substrate including a first surface; a cover disposed on the first surface of the substrate; an accommodation space formed between the substrate and the cover; a laser diode die disposed in the accommodation space; and a reflective surface disposed in the accommodation space for outputting light of the laser diode die reflected by the reflective surface and transmitted through a light-transmitting area. The light-transmitting area is at least partially disposed on a surface of the cover opposite the substrate.

Abstract: A sensor system can comprise a detector with a plurality of units, wherein the detector is configured to generate a first set of electrical signals based on received photon energy of a light beam that is reflected back from a first plurality of points on one or more objects, in a first configuration. Additionally, the detector is configured to generate a second set of electrical signals based on received photon energy of a light beam that is reflected back from a second plurality of points on one or more objects in a second configuration, wherein the first configuration and the second configuration are with a predetermined correlation. Furthermore, the detector can determine distance to each of the first plurality of points and the second plurality of points on the one or more objects based on the first set of electrical signals and the second set of electrical signals.

Abstract: A sensor system can comprise a detector with a plurality of units, wherein the detector is configured to generate a first set of electrical signals based on received photon energy of a light beam that is reflected back from a first plurality of points on one or more objects, in a first configuration. Additionally, the detector is configured to generate a second set of electrical signals based on received photon energy of a light beam that is reflected back from a second plurality of points on one or more objects in a second configuration, wherein the first configuration and the second configuration are with a predetermined correlation. Furthermore, the detector can determine distance to each of the first plurality of points and the second plurality of points on the one or more objects based on the first set of electrical signals and the second set of electrical signals.

Abstract: A laser distance measuring device, a laser distance measuring method, and a movable platform are provided. The laser distance measuring device includes a transmitting module and a receiving module. The transmitting module includes a transmitting circuit and an optical transmitting system, the transmitting circuit is configured to transmit laser pulses, and the optical transmitting system is configured to disperse the laser pulse, to make the laser pulses cover a designated field-of-view area. The receiving module includes a receiving circuit and an optical receiving system, the receiving circuit includes an APD array operating in a linear mode and is configured to receive at least some of returning laser pulses upon the laser pulses being reflected back by a measured object, and convert the at least some of the returning laser pulses into an electrical signal.

Abstract: The present disclosure provides a laser diode package module. The laser diode package module includes a substrate including a first surface; a cover disposed on the first surface of the substrate; an accommodation space formed between the substrate and the cover; a laser diode die disposed in the accommodation space; and a reflective surface disposed in the accommodation space for outputting light of the laser diode die reflected by the reflective surface and transmitted through a light-transmitting area. The light-transmitting area is at least partially disposed on a surface of the cover opposite the substrate.

Abstract: Systems and techniques associated light detection and ranging (LIDAR) applications are described. In one representative aspect, techniques can be used to implement a packaged semi-conductive apparatus is disclosed. The apparatus includes a substrate; a diode die carried by the substrate and positioned to emit an electromagnetic energy beam; and a shell coupled to the substrate to enclose the diode die. The shell includes an opening or a transparent area to allow the electromagnetic energy beam emitted from the diode die to pass through the shell.

Abstract: Systems and techniques associated light detection and ranging (LIDAR) applications are described. In one representative aspect, techniques can be used to implement a packaged semi-conductive apparatus is disclosed. The apparatus includes a substrate; a diode die carried by the substrate and positioned to emit an electromagnetic energy beam; and a shell coupled to the substrate to enclose the diode die. The shell includes an opening or a transparent area to allow the electromagnetic energy beam emitted from the diode die to pass through the shell.

Abstract: The present disclosure provides a laser diode module. The laser diode module includes a substrate including a first surface and a second surface opposite to each other; a cover disposed on the first surface of the substrate, and an accommodation space being formed between the substrate and the cover; and a laser diode die disposed in the accommodation space.

Abstract: Systems and techniques associated light detection and ranging (LIDAR) applications are described. In one representative aspect, techniques can be used to implement a sensor device. The sensor device includes an electromagnetic energy emitter module positioned to emit an electromagnetic energy beam directed to one or more objects, a beam steering module positioned to receive at least a portion of the electromagnetic energy beam that is reflected from the one or more objects, and an array of receiver units positioned to convert the portion of the electromagnetic energy beam into multiple electrical signals. The beam steering module is further positioned to direct the portion of the electromagnetic energy beam to the array of receiver units, with individual receiver units positioned to detect multiple optical signals from the portion of the electromagnetic energy beam and convert the multiple optical signals into electrical signals.

Abstract: The present invention discloses a package structure of a MEMS microphone. The package structure comprises a package substrate and a package shell, wherein the package shell is provided on the package substrate and forms a closed cavity with the package substrate. In the package structure provided by the present invention, the sound-absorbing layer is arranged on the inner wall of the Helmholtz resonant cavity. The sound-absorbing layer has a certain absorption capacity to high-frequency sound waves, but has a very low absorption to low-frequency sound waves, so it may be equivalent to a “low-pass filter”. Through the absorption of the high-frequency sound waves, a high-frequency amplitude value of sound waves can be suppressed, reducing high-frequency response of the Helmholtz resonant cavity. That is, a high-frequency cut-off frequency of the sound waves is improved, widening operation bandwidth of the MEMS microphone.

Abstract: A sensor system can comprise a light source configured to emit a light beam. Furthermore, the sensor system comprises one or more optical elements that is configured to homogenize the emitted light beam, which is directed toward a field of view (FOV) of the sensor system. Additionally, the sensor system comprises a detector with a plurality of photo detection devices, wherein each photo detection device of the plurality of photo detection devices is configured to receive at least a portion of photon energy of the light beam that is reflected back from one or more objects in the FOV of the sensor system and generate at least one electrical signal based on the received photon energy.

Abstract: Methods and systems for detecting and ranging an object may include or be configured to carry out the steps of emitting, by a laser light source, a first beam of light incident on a surface of the object, receiving, at an avalanche photodiode (APD) array, a second beam of light reflected from the surface of the object; reading, by a readout integrated circuit (ROIC) array, from the APD array; and processing, by the ROIC array, accumulated photocurrent from the APD array for outputting a signal representative of the object detected by the APD array.

Abstract: A sensor system can comprise a detector with a plurality of units, wherein the detector is configured to generate a first set of electrical signals based on received photon energy of a light beam that is reflected back from a first plurality of points on one or more objects, in a first configuration. Additionally, the detector is configured to generate a second set of electrical signals based on received photon energy of a light beam that is reflected back from a second plurality of points on one or more objects in a second configuration, wherein the first configuration and the second configuration are with a predetermined correlation. Furthermore, the detector can determine distance to each of the first plurality of points and the second plurality of points on the one or more objects based on the first set of electrical signals and the second set of electrical signals.

Abstract: The present invention discloses an MEMS pressure sensing element, including a substrate provided with a groove; a pressure-sensitive film disposed above the substrate, the pressure-sensitive film sealing an opening of the groove to form a sealed cavity; and a movable electrode plate and a fixed electrode plate which are located in the sealed cavity and form a capacitor structure, wherein the fixed electrode plate is fixed on a bottom wall of the groove of the substrate, and the movable electrode plate is suspended above the fixed electrode plate and opposite to the fixed electrode plate; and the pressure-sensitive film is connected to the movable electrode plate so as to drive the movable electrode plate to move under the action of an external pressure.

Abstract: The present invention discloses a differential capacitive MEMS pressure sensor and a manufacturing method thereof. The MEMS pressure sensor includes a sensitive structural layer, which includes a common sensitive part and a common supporting part located on the edge of the common sensitive part, a thickness of the common supporting part being larger than that of the common sensitive part; and the MEMS pressure sensor also includes an upper fixed electrode structural layer and a lower fixed electrode structural layer which are vertically symmetric relative to the sensitive structural layer and used for forming differential capacitors with the common sensitive part. According to the MEMS pressure sensor of the present invention, by the differential capacitor structures, inhibition of chips on common-mode signals is enhanced, and a signal to noise ratio of output signals is improved.

Abstract: An integrated structure of an MEMS pressure sensor and an MEMS inertia sensor are provided, comprising: an insulating layer formed on a substrate, a first lower electrode and a second lower electrode both formed on the insulating layer, further comprising a first upper electrode forming an air pressure-sensitive capacitor together with the first lower electrode, and a second upper electrode forming a reference capacitor together with the second lower electrode; further comprising an inertia-sensitive structure supported above the substrate by a third support part, and a fixed electrode plate forming an inertia detecting capacitor of an inertia sensor together with the inertia-sensitive structure; and a cover body which packages the inertia detecting capacitor composed of the inertia-sensitive structure and the fixed electrode plate on the substrate.

Abstract: The present invention discloses a quasi-differential capacitive MEMS pressure sensor and manufacturing methods thereof. The quasi-differential capacitive MEMS pressure sensor includes a first lower electrode, a second lower electrode, a first upper electrode supported above the first lower electrode, and a second upper electrode supported above the second lower electrode, wherein the first upper electrode is a pressure-sensitive film, and a cavity between the first upper electrode and the first lower electrode is a closed cavity, so that the first upper electrode and the first lower electrode constitute an air pressure-sensitive type capacitor; and the second upper electrode and the second lower electrode constitute a reference capacitor whose capacitance does not vary with external air pressure.

Abstract: The present invention discloses a package structure of a MEMS microphone. The package structure comprises a closed inner cavity formed by a package shell in a surrounding manner, as well as a MEMS chip and an ASIC chip which are located in the closed inner cavity, wherein a sound hole allowing sound to flow into the closed inner cavity is formed in the package shell; the MEMS chip comprises a substrate as well as a vibrating diaphragm and a back plate which are provided on the substrate; the vibrating diaphragm divides the closed inner cavity into a front cavity and a back cavity; and a sound-absorbing structure is provided in the back cavity.

Abstract: An MEMS pressure sensing element is disclosed, comprising a substrate with a groove; a pressure-sensitive film on the substrate for sealing an opening of the groove to form a sealed cavity body; and a pressure-sensitive beam suspended in the sealed cavity body and parallel with the pressure-sensitive film provided with varistors, wherein a center of the pressure-sensitive beam is fixedly connected to that of the pressure-sensitive film, and a periphery is fixedly connected to a bottom wall of the groove of the substrate, such that the pressure-sensitive film drives the pressure-sensitive beam to bending deformation under an external pressure.

Abstract: The present invention discloses an MEMS pressure sensing element, including a substrate provided with a groove; a pressure-sensitive film disposed above the substrate, the pressure-sensitive film sealing an opening of the groove to form a sealed cavity; and a movable electrode plate and a fixed electrode plate which are located in the sealed cavity and form a capacitor structure, wherein the fixed electrode plate is fixed on a bottom wall of the groove of the substrate, and the movable electrode plate is suspended above the fixed electrode plate and opposite to the fixed electrode plate; and the pressure-sensitive film is connected to the movable electrode plate so as to drive the movable electrode plate to move under the action of an external pressure.