Patents by Inventor Guoheng MA

Guoheng MA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED chip packaging structure, its manufacturing method, and display device
    Patent number: 8987750
    Abstract: A LED chip packaging structure, its manufacturing method, and a display device are disclosed. A conductive unit is formed at two opposite sides of a LED chip unit, and comprises a first conductive layer formed at a side of, and electrically connected to, a first electrode, a second conductive layer formed at a side of, and electrically connected to, a second electrode, and an intermediate isolation layer formed at a side of a GaN layer. The LED chip unit and the conductive unit are connected laterally to form an electrical-connection channel as a whole, without welding a gold wire for the conductive channel as in a traditional LED. Thus, the method is able to reduce the total thickness of the LED chip device, increase the thermal conductivity effect of the LED chip and the overall stability, and improve the light-extraction effect of the surface of the LED chip.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: March 24, 2015
    Assignees: Boe Technology Group Co., Ltd., Beijing Boe Chatani Electronics Co., Ltd.
    Inventors: Weixin Zheng, Guoheng Ma, Dongsheng Yang, Zhonglian Qiao
  • LED CHIP PACKAGING STRUCTURE, ITS MANUFACTURING METHOD, AND DISPLAY DEVICE
    Publication number: 20140167063
    Abstract: A LED chip packaging structure, its manufacturing method, and a display device are disclosed. A conductive unit is formed at two opposite sides of a LED chip unit, and comprises a first conductive layer formed at a side of, and electrically connected to, a first electrode, a second conductive layer formed at a side of, and electrically connected to, a second electrode, and an intermediate isolation layer formed at a side of a GaN layer. The LED chip unit and the conductive unit are connected laterally to form an electrical-connection channel as a whole, without welding a gold wire for the conductive channel as in a traditional LED. Thus, the method is able to reduce the total thickness of the LED chip device, increase the thermal conductivity effect of the LED chip and the overall stability, and improve the light-extraction effect of the surface of the LED chip.
    Type: Application
    Filed: December 13, 2013
    Publication date: June 19, 2014
    Applicants: BEIJING BOE CHATANI ELECTRONICS CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Weixin ZHENG, Guoheng MA, Dongsheng YANG, Zhonglian QIAO