Abstract: An optical coupler includes: a signal input unit including a first metal bracket and a gallium nitride (GaN)-based light-emitting diode chip disposed thereon, the GaN-based light-emitting diode chip acting as an optical signal emitter and electrically connected to the first metal bracket; a signal output unit including a second metal bracket and a photosensitive device chip disposed thereon, the photosensitive device chip acting as an optical signal receiving and current converter and electrically connected to the second metal bracket; an inner package covering the GaN-based light-emitting diode chip and the photosensitive device chip and forming an optical transmission path between the GaN-based light-emitting diode chip and the photosensitive device chip; and an outer package covering the inner package, the GaN-based light-emitting diode chip and the photosensitive device chip, and partially covering the first metal bracket and the second metal bracket to expose pins of the first and second metal brackets.

Abstract: The present application relates to a packaging leadframe and a packaging structure. The packaging leadframe includes a substrate layer and a sidewall structure. A surface of the substrate layer is provided with at least one metal bump structure, a circuit layer also is laid on the surface of the substrate layer and can be electrically coupled with a LED chip. The sidewall structure is disposed on the surface with the metal bump structure, and includes a halocarbon polymer matrix and a plurality of light reflective particles uniformly mixed together. The halocarbon polymer may be poly tetra fluoroethylene or polyvinylidene fluoride. In this regard, the packaging leadframe has high reflectivity to ultraviolet light and good resistance to ultraviolet radiation.

Abstract: A packaging frame for a photoelectric device chip exemplarily includes a lead frame, an insulator and a reflector disposed on the lead frame and the insulator. The lead frame includes a positive electrode pad and a negative electrode pad. The insulator is disposed between the positive electrode pad and the negative electrode pad. The reflector is formed with a through hole to define regions where the lead frame and the insulator are located in the through hole as a die bonding region. The reflector is connected with the lead frame by a geological polymer. The geological polymer is employed as the material of the reflector owing to the excellent interfacial bonding performance with various materials, and a connector or a connective layer formed therefrom has good chemical and thermal stabilities, excellent airtightness, high mechanical strength and weathering resistance, which can significantly enhances adhesion and mounting stability of device.

Abstract: The present application relates to a packaging leadframe and a packaging structure. The packaging leadframe includes a substrate layer and a sidewall structure. A surface of the substrate layer is provided with at least one metal bump structure, a circuit layer also is laid on the surface of the substrate layer and can be electrically coupled with a LED chip. The sidewall structure is disposed on the surface with the metal bump structure, and includes a halocarbon polymer matrix and a plurality of light reflective particles uniformly mixed together. The halocarbon polymer may be poly tetra fluoroethylene or polyvinylidene fluoride. In this regard, the packaging leadframe has high reflectivity to ultraviolet light and good resistance to ultraviolet radiation.

Abstract: A LED flip-chip package substrate includes a ceramic base (e.g., aluminum nitride base), a conductive wire layer disposed on the ceramic base and having pads in pairs, an insulating protective layer (e.g., low-temperature glass glaze layer) disposed on a same side of the ceramic base as the conductive wire layer and exposing the pads, and a metallic reflective layer (e.g., aluminum layer) disposed on a side of the insulating protective layer facing away from the ceramic base and exposing the pads. Moreover, a LED package structure adopting the LED flip-chip package substrate and other LED package structures with similar material layers such as a chip-level packaged LED package structure are provided. By comprehensively utilizing advantages of various materials, the LED flip-chip package substrate with high heat conductivity, high reflectivity, high stability and superior insulation and the LED package structure with high reliability and even high light extraction efficiency are obtained.

Abstract: A packaging frame for a photoelectric device chip exemplarily includes a lead frame, an insulator and a reflector disposed on the lead frame and the insulator. The lead frame includes a positive electrode pad and a negative electrode pad. The insulator is disposed between the positive electrode pad and the negative electrode pad. The reflector is formed with a through hole to define regions where the lead frame and the insulator are located in the through hole as a die bonding region. The reflector is connected with the lead frame by a geological polymer. The geological polymer is employed as the material of the reflector owing to the excellent interfacial bonding performance with various materials, and a connector or a connective layer formed therefrom has good chemical and thermal stabilities, excellent airtightness, high mechanical strength and weathering resistance, which can significantly enhances adhesion and mounting stability of device.

Abstract: A LED flip-chip package substrate includes a ceramic base (e.g., aluminum nitride base), a conductive wire layer disposed on the ceramic base and having pads in pairs, an insulating protective layer (e.g., low-temperature glass glaze layer) disposed on a same side of the ceramic base as the conductive wire layer and exposing the pads, and a metallic reflective layer (e.g., aluminum layer) disposed on a side of the insulating protective layer facing away from the ceramic base and exposing the pads. Moreover, a LED package structure adopting the LED flip-chip package substrate and other LED package structures with similar material layers such as a chip-level packaged LED package structure are provided. By comprehensively utilizing advantages of various materials, the LED flip-chip package substrate with high heat conductivity, high reflectivity, high stability and superior insulation and the LED package structure with high reliability and even high light extraction efficiency are obtained.