Patents by Inventor Guojiang Yu

Guojiang Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11237657
    Abstract: Embodiments of the present disclosure provide an array substrate, a method of manufacturing the array substrate, a display panel and a display apparatus. The array substrate includes: a substrate; a touch pad disposed on a side of the substrate; a first planarization layer disposed on a side of the touch pad facing away from the substrate; a first passivation layer disposed on a side of the first planarization layer facing away from the touch pad; a touch electrode layer disposed on a side of the first passivation layer facing away from the first planarization layer; and a first via hole sequentially passing through at least the first planarization layer and the first passivation layer. The touch electrode layer is electrically connected to the touch pad through the first via hole.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: February 1, 2022
    Assignees: ORDOS YUANSHENG OPTOELECTRONICS CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Chenglong Wang, Yezhou Fang, Feng Li, Xinguo Wu, Xiaogang Zhu, Guojiang Yu
  • Publication number: 20210089154
    Abstract: Embodiments of the present disclosure provide an array substrate, a method of manufacturing the array substrate, a display panel and a display apparatus. The array substrate includes: a substrate; a touch pad disposed on a side of the substrate; a first planarization layer disposed on a side of the touch pad facing away from the substrate; a first passivation layer disposed on a side of the first planarization layer facing away from the touch pad; a touch electrode layer disposed on a side of the first passivation layer facing away from the first planarization layer; and a first via hole sequentially passing through at least the first planarization layer and the first passivation layer. The touch electrode layer is electrically connected to the touch pad through the first via hole.
    Type: Application
    Filed: March 19, 2020
    Publication date: March 25, 2021
    Inventors: Chenglong Wang, Yezhou Fang, Feng Li, Xinguo Wu, Xiaogang Zhu, Guojiang Yu