Abstract: A heat dissipating device (1) for removing heat from electronic devices is disclosed. The heat dissipating device includes a heat sink (30) and at least one heat pipe (20). The heat sink includes a Y-shaped heat conductive body and a plurality of fins (35) extending from the body. The body includes a solid block (32) and two extension arms (34) extending aslant from a top of the block in opposite directions. An U-shaped groove (35) is defined in the block and extends to an upper portion (33) of the block. The heat pipe comprises an evaporating portion (22) and a condensing portion (24) extending upwardly from the evaporating portion. The heat pipe is received in the groove so that the heat pipe absorbs heat via the evaporating portion and transfers the heat to the upper portion of the block via the condensing portion thereof.

Abstract: A heat dissipating device (1) for removing heat from electronic devices is disclosed. The heat dissipating device includes a heat sink (30) and at least one heat pipe (20). The heat sink includes a Y-shaped heat conductive body and a plurality of fins (35) extending from the body. The body includes a solid block (32) and two extension arms (34) extending aslant from a top of the block in opposite directions. An U-shaped groove (35) is defined in the block and extends to an upper portion (33) of the block. The heat pipe comprises an evaporating portion (22) and a condensing portion (24) extending upwardly from the evaporating portion. The heat pipe is received in the groove so that the heat pipe absorbs heat via the evaporating portion and transfers the heat to the upper portion of the block via the condensing portion thereof.