Abstract: A method and apparatus for directing light to a light sensor and filtering out an infrared component from the directed light. In one embodiment, the apparatus includes an array of light sensors disposed on a substrate, wherein the light sensors are operable to convert light intensity into a voltage signal. The apparatus further includes a cover plate disposed over the light sensors such that the cover plate creates a cavity over the array of sensors. The apparatus further includes filter material disposed between the cover plate and the light sensors in the cavity formed between the light sensors and the cover plate. The filter material is operable to filter the light passing through the cover plate. In particular, in one embodiment, light having wavelengths in the infrared range may be filtered out.

Abstract: A system and method for auto-focusing light. The system includes at least one focusing lens operable to direct light toward a focal point. The system further includes a sensor array disposed adjacent to the lens assembly such that the light through the lens assembly is directed to the sensor array near the focal point and a bubble array having a plurality of bubble generators. The bubble array supports the sensor array and the bubble generators are operable to maneuver the supported sensor array with respect to the focal point. Such a light focusing system is able to provide an auto-focus capability to a camera system that does not have a large amount of space available for a motor-driven auto-focus system. Furthermore, the bubble array is power efficient and does not require the amount of energy to operate as is required for a motor-driven auto-focus system.

Abstract: An image sensing device is disclosed having a die formed with an array of photosensing sites and a structure of optical material having infrared absorbing characteristics formed over the photosensing sites. An embodiment is disclosed in which the structure of optical material having infrared absorbing characteristics is formed as an array of microlenses for directing visible image light onto the photosensing sites and at the same time filtering out infrared wavelengths that interfere with image capture. Alternatively, the structure may be designed to filter out other ranges of wavelengths outside of the visible spectrum.

Abstract: An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level packaging enclosing the IC. The wafer level packaging includes a transparent enclosure portion adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths, and a first spacing structure providing a cavity between an inner surface of the transparent enclosure portion and the image sensing device. A depth of the cavity is configurable along an axis perpendicular to the semiconductor substrate to control a distance between an outer surface of the transparent enclosure portion and the image sensing device.

Abstract: An image sensing device is disclosed having a die formed with an array of photosensing sites and a structure of optical material having infrared absorbing characteristics formed over the photosensing sites. An embodiment is disclosed in which the structure of optical material having infrared absorbing characteristics is formed as an array of microlenses for directing visible image light onto the photosensing sites and at the same time filtering out infrared wavelengths that interfere with image capture. Alternatively, the structure may be designed to filter out other ranges of wavelengths outside of the visible spectrum.

Abstract: A wire-bondable image sensor having an integral contaminant shadowing reduction structure is described. In one aspect, an image sensor includes a substrate that has a side supporting at least one imaging area and at least one wirebonding area. Light detectors are constructed and arranged to receive light through the imaging area. Bond pads are exposed in the wirebonding area for connecting to respective bond wires. A contaminant shadowing reduction structure on the imaging area has an exposed contaminant displacement surface over the imaging area and separated from the imaging area by a distance of at least 300 ?m. The contaminant shadowing reduction structure is substantially transparent to radiation within an operative wavelength range specified for the image sensor. Methods of making the above-mentioned image sensor also are described.

Abstract: A single lens that has a small spot size across a large field of view and a small height. The lens has a first surface for performing color correction functions and a second surface for primarily performing light ray bending functions. The first surface has diffraction efficiency improvement mechanism for improving the resolution of the lens. The lens also has a vignetting reducing mechanism for reducing the amount of vignetting in the corners of the image.

Abstract: An apparatus and method for generating a lamina of light. The apparatus includes an optically transparent member having an input configured to receive light and one or more facets formed in the optically transparent member. As light enters and travels through the member, a lamina of light is created by the light reflecting off the facets. In one application, the lamina of light is provided in the free space adjacent a touch screen display. When the lamina is interrupted during a data entry operation to the screen, an optical position detection device is used to determine the data input based on the location of the interrupt in the lamina. In various other embodiments, the position and uniformity of the lamina may be controlled by selecting the angle, depth and tilt of a reflective surface of the facets in the optically transparent member.

Abstract: A wire-bondable image sensor having an integral contaminant shadowing reduction structure is described. In one aspect, an image sensor includes a substrate that has a side supporting at least one imaging area and at least one wirebonding area. Light detectors are constructed and arranged to receive light through the imaging area. Bond pads are exposed in the wirebonding area for connecting to respective bond wires. A contaminant shadowing reduction structure on the imaging area has an exposed contaminant displacement surface over the imaging area and separated from the imaging area by a distance of at least 300 ?m. The contaminant shadowing reduction structure is substantially transparent to radiation within an operative wavelength range specified for the image sensor. Methods of making the above-mentioned image sensor also are described.

Abstract: An image pickup module made of clear polymer includes an imaging surface, a first mirror, and a second mirror. An object is placed on the imaging surface for imaging. Incident light reflects off the imaging surface. The first of the two mirrors directs the reflected light toward the second mirror. The second mirror directs the directed light toward an image sensor. The two mirrors focus the reflected light on the imaging sensor which converts the focused light to electronic signals to be processed by a microcontroller. The use of the mirrors to direct the reflected light (embodying the image information) has the effect of having a relatively long focal length within a relatively short image pickup module design thereby allowing the pickup module to be manufactured having reduced height compared to prior art pickup modules. The reduced height allows for manufacture of smaller, more convenient image pickup devices.

Abstract: A system and method for auto-focusing light. The system includes at least one focusing lens operable to direct light toward a focal point. The system further includes a sensor array disposed adjacent to the lens assembly such that the light through the lens assembly is directed to the sensor array near the focal point and a bubble array having a plurality of bubble generators. The bubble array supports the sensor array and the bubble generators are operable to maneuver the supported sensor array with respect to the focal point. Such a light focusing system is able to provide an auto-focus capability to a camera system that does not have a large amount of space available for a motor-driven auto-focus system. Furthermore, the bubble array is power efficient and does not require the amount of energy to operate as is required for a motor-driven auto-focus system.

Abstract: An image sensing device is disclosed having a die formed with an array of photosensing sites and a structure of optical material having infrared absorbing characteristics formed over the photosensing sites. An embodiment is disclosed in which the structure of optical material having infrared absorbing characteristics is formed as an array of microlenses for directing visible image light onto the photosensing sites and at the same time filtering out infrared wavelengths that interfere with image capture. Alternatively, the structure may be designed to filter out other ranges of wavelengths outside of the visible spectrum.

Abstract: A method and apparatus for directing light to a light sensor and filtering out an infrared component from the directed light. In one embodiment, the apparatus includes an array of light sensors disposed on a substrate, wherein the light sensors are operable to convert light intensity into a voltage signal. The apparatus further includes a cover plate disposed over the light sensors such that the cover plate creates a cavity over the array of sensors. The apparatus further includes filter material disposed between the cover plate and the light sensors in the cavity formed between the light sensors and the cover plate. The filter material is operable to filter the light passing through the cover plate. In particular, in one embodiment, light having wavelengths in the infrared range may be filtered out.

Abstract: A touch screen display system includes a display screen positioned in a first plane. A touch surface is positioned in a second plane adjacent to the display screen. An illuminating source is configured to illuminate the display screen and the touch surface. A first imaging sensor is positioned in the second plane and configured to detect an object coming in contact with the touch surface. A second imaging sensor is positioned in the second plane and configured to detect an object coming in contact with the touch surface. An imaging system is electrically coupled to the first and second imaging sensors and configured to receive electrical signals from the first and second imaging sensors relating to the detection of the object coming in contact with the touch surface. The imaging system configured to determine an angular position on the touch surface of the object coming in contact with the touch surface based upon the received electrical signals.

Abstract: An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level packaging enclosing the IC. The wafer level packaging includes a transparent enclosure portion adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths, and a first spacing structure providing a cavity between an inner surface of the transparent enclosure portion and the image sensing device. A depth of the cavity is configurable along an axis perpendicular to the semiconductor substrate to control a distance between an outer surface of the transparent enclosure portion and the image sensing device.

Abstract: An air-incident optical recording medium for use with flying heads has a system of layers, which thermally isolate the disk surface from the active, recording layer.

Abstract: An optical conduit in an optical mouse is used to channel light from a light source onto a surface for illumination. Light from the light source is totally and internally reflected within the optical conduit towards the surface. To improve the efficiency of light transmission, the light source is glued to the exterior of the optical conduit, or embedded within the optical conduit itself. A reflector cup can be used to surround the light source so as to redirect light from the light source towards the output end of the optical conduit. The optical conduit can have curved surfaces that fit parabolic or hyperbolic equations, or other equations of second-order or higher.

Abstract: This application describes structures of storage media for optical storage systems, including systems in the near-field configuration to couple radiation between the optical head and the media at least in part by evanescent fields. Disk cartridges for various optical disk drives are also described.

Abstract: An image pickup module made of clear polymer includes an imaging surface, a first mirror, and a second mirror. An object is placed on the imaging surface for imaging. Incident light reflects off the imaging surface. The first of the two mirrors directs the reflected light toward the second mirror. The second mirror directs the directed light toward an image sensor. The two mirrors focus the reflected light on the imaging sensor which converts the focused light to electronic signals to be processed by a microcontroller. The use of the mirrors to direct the reflected light (embodying the image information) has the effect of having a relatively long focal length within a relatively short image pickup module design thereby allowing the pickup module to be manufactured having reduced height compared to prior art pickup modules. The reduced height allows for manufacture of smaller, more convenient image pickup devices such as mobile telephone, security scanners, and computer mouse.

Abstract: Structures of storage media for optical storage systems, especially for systems in the near-field configuration to couple radiation between the optical head and the media at least in part by evanescent fields.