Abstract: An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.

Abstract: An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.

Abstract: An abrasive composition comprising non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The inventive compositions preferably comprise soft water in combination with 0.001–20 w/w % of non-polymeric organic particles, 0.1–10 w/w % of an oxidizing agent, 0.05–10 w/w % of a chelating agent, 0.01–10 w/w % of a surfactant, and 0–10 w/w % of a passivation agent at a pH in the range of 2–12, wherein said percentages are w/w (weight/weight) percentages, based on the total weight of said compositions. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.

Abstract: An abrasive composition comprising non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The inventive compositions preferably comprise soft water in combination with 0.001-20 w/w % of non-polymeric organic particles, 0.1-10 w/w % of an oxidizing agent, 0.05-10 w/w % of a chelating agent, 0.01-10 w/w % of a surfactant, and 0-10 w/w % of a passivation agent at a pH in the range of 2-12, wherein said percentages are w/w (weight/weight) percentages, based on the total weight of said compositions. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.

Abstract: The present invention is drawn to a composition comprising abrasive particles comprising an organic resin for chemical mechanical planarization (CMP), which can be widely used in the semiconductor industry. The abrasive composition is an aqueous slurry comprising abrasive particles comprising an organic resin, wherein the slurry is held at a pH in the range of 2-12. An attractive feature of the inventive abrasive composition is that it can be tailored to selectively remove different components from the surface. The inventive abrasive composition also provides efficient polishing rates and good surface quality when used in CMP applications.

Abstract: The present invention is drawn to a composition comprising abrasive particles comprising an organic resin for chemical mechanical planarization (CMP), which can be widely used in the semiconductor industry. The abrasive composition is an aqueous slurry comprising abrasive particles comprising an organic resin, wherein the slurry is held at a pH in the range of 2-12. An attractive feature of the inventive abrasive composition is that it can be tailored to selectively remove different components from the surface. The inventive abrasive composition also provides efficient polishing rates and good surface quality when used in CMP applications.

Abstract: A one-step, in-situ, process for producing a high solids content emulsion or dispersion of partially or totally crosslinked urea formaldehyde (UF), melamine formaldehyde (MF), or melamine urea formaldehyde (MUF) resin droplets or particles, by forming a reaction mixture of (i) aqueous formaldehyde (formalin), (ii) at least one water-soluble protective colloid, (iii) water and (iv) optionally a surfactant, and mixing the reaction mixture in a reaction vessel; optionally adjusting the initial pH of the reaction mixture according to a desired value as needed; adding (i) urea or substituted urea, (ii) melamine or substituted melamine, or (iii) a mixture thereof, to the reaction mixture; and heating the reaction mixture to a temperature at which condensation takes place between the (i) urea or substituted urea, (ii) the melamine or substituted melamine, or (iii) the mixture thereof, and the formaldehyde to form a urea formaldehyde, melamine formaldehyde or melamine urea formaldehyde resin, and holding the reaction

Abstract: A one-step, in-situ, process for producing a high solids content emulsion or dispersion of partially or totally crosslinked urea formaldehyde (UF), melamine formaldehyde (MF), or melamine urea formaldehyde (MUF) resin droplets or particles, by forming a reaction mixture of (i) aqueous formaldehyde (formalin), (ii) at least one water-soluble protective colloid, (iii) water and (iv) optionally a surfactant, and mixing the reaction mixture in a reaction vessel; optionally adjusting the initial pH of the reaction mixture according to a desired value as needed; adding (i) urea or substituted urea, (ii) melamine or substituted melamine, or (iii) a mixture thereof, to the reaction mixture; and heating the reaction mixture to a temperature at which condensation takes place between the (i) urea or substituted urea, (ii) the melamine or substituted melamine, or (iii) the mixture thereof, and the formaldehyde to form a urea formaldehyde, melamine formaldehyde or melamine urea formaldehyde resin, and holding the reaction

Abstract: Method for the manufacture of a phenolic resin emulsion and/or dispersion, wherein an aldehyde, a phenolic compound and an alkaline catalyst are allowed to react at a temperature of 40-100° C. until a desired degree of condensation is achieved, and the pH of the resin is adjusted to a value below 9 using an acid in the presence of a surface active agent or a mixture thereof at a temperature below 100° C. and a phenolic resin emulsion and/or dispersion is obtained providing a colorless or light-colored glue line or surface when cured.

Abstract: A one-step, in-situ, process for producing a high solids content emulsion or dispersion of partially or totally crosslinked urea formaldehyde or melamine formaldehyde resin droplets or particles, by forming a reaction mixture of (i) aqueous formaldehyde (formalin), (ii) at least one water-soluble protective colloid, (iii) water and (iv) optionally a surfactant, and mixing the reaction mixture in a reaction vessel; optionally adjusting the initial pH of the reaction mixture according to a desired value as needed; adding (a) urea, substituted urea, or a mixture thereof, or (b) melamine, substituted melamine, or a mixture thereof, to the reaction mixture; and heating the reaction mixture to a temperature at which condensation takes place between the (a) urea, substituted urea, or the mixture thereof, or (b) melamine substituted melamine, or the mixture thereof, and the formaldehyde to form a urea formaldehyde or melamine formaldehyde resin, and holding the reaction mixture at that temperature or a higher tempera