Abstract: A hard disk assembly includes a tray, a bracket, and a carrier. The tray includes plural protrusions. The bracket is disposed on the tray for fastening a hard disk device. The bracket includes a bracket body having plural slots thereon, and plural pins disposed on opposite sides of the bracket body. The slots are respectively engaged with the protrusions. The pins are disposed between the bracket and the tray. The carrier is pivotally connected to the tray. The carrier includes two ribs. Each rib has a curved surface for touching and pulling the pins. Therefore the bracket can be slidably moved on the tray along the slots.

Abstract: A hard disk assembly includes a tray, a bracket, and a carrier. The tray includes plural protrusions. The bracket is disposed on the tray for fastening a hard disk device. The bracket includes a bracket body having plural slots thereon, and plural pins disposed on opposite sides of the bracket body. The slots are respectively engaged with the protrusions. The pins are disposed between the bracket and the tray. The carrier is pivotally connected to the tray. The carrier includes two ribs. Each rib has a curved surface for touching and pulling the pins. Therefore the bracket can be slidably moved on the tray along the slots.

Abstract: A conference system for independently adjusting audio parameters is provided, including a microphone module, a storage module, a digital signal processing module and an amplifier. When any microphone of the microphone module generates an audio signal transmitted to the digital signal processing module, the priority controller determines the priority order of the audio signals entering the digital signal processing module, the digital signal processing module will read the corresponding adjustment parameters stored in the storage module, and the volume controller, equalizer, feedback suppressor perform adjustment on the audio signal. Finally, the mixer mixes the audio signals and outputs to the amplifier. The amplifier amplifies the mixed audio signal and outputs to speakers. In this manner, a single digital signal processing module can adjust different audio signals from different microphones based on different adjustment parameters, without affecting the audio signal from other microphones.

Abstract: A real-time ring-loop surveillance network system is provided. By using digital communication network, multiple channels of media data and control data are transmitted in a ring-loop. The media data includes any forms of digital audio and video data, which is transmitted through 802.3/802.3u physical layer interface. The media data reaches all the stations in the network at the same time, and the number of the stations in the system depends on the system requirements. The number of the channels depends on the transceiver's speed. The present invention defines frames to encompass the media data and control data for transmission. The point-to-point delay is less than 0.15 ms. When 32 stations are connected in a ring-loop, the maximum delay is less than 5 ms. A backup mechanism is also included to detect and automatically switch to maintain the normal operation of the surveillance network system. The monitor signals are also encompassed in frames transmitted in the same network.

Abstract: A method of water analysis for detecting the presence of microorganisms in a water sample, comprising the steps of: first, providing a bio-membrane as a filter; filtering out the microorganisms in the water sample, using the bio-membrane; cultivating the microorganisms on the bio-membrane; staining the microorganisms on the bio-membrane with potassium permanganate (KMnO4); rinsing the bio-membrane with purified deionized water; and finally, counting microorganisms.

Abstract: A server housing, comprising a top cover and a base frame, is provided. The top cover has a top piece and parallel first side and second side. The two parallel sides are coupled with two opposite sides of the top piece. Each of the top piece and the two parallel sides has an interior. The top cover further comprises: two approximately parallel latches, five approximately parallel tabs, two first prominences and two second prominences. The two approximately parallel latches are on the interior of the top piece. The five approximately parallel tabs are on the interior of the top piece. The two first prominences are on the interior of the first side. The two second prominences are on the interior of the second side. The base frame is assembled with the top cover and comprises: a first side panel, a second side panel and a mounting bracket. The first side panel comprises two first guiding recesses for receiving the first prominences. The second side panel is parallel to the first side panel.

Abstract: This specification discloses an anti-EMI device used in electronic products. The device contains a U-shape component and a spring component. The U-shape component is embedded inside the housing of an electronic product for fixing and connecting the anti-EMI device to the electronic product. The spring component is used to shield the EMI from the electronic product. The spring component is connected to the bottom surface of the U-shape component, extending along both sidewalls toward the opening of the U-shape component and protruding out of the electronic product housing.

Abstract: A mechanism to assemble a fan on an electronic device without using any screw is disclosed. The mechanism comprises: (a) a first extension of the housing, wherein in the first extension has a first hole thereon; (b) a first fastener fixed on the electronic device, wherein the first fastener is able to mount in the first hole on the first extension; (c) a second extension of the housing, wherein in the second extension is substantially away from the first extension and has a second hole thereon; and (d) a second fastener fixed on the electronic device, wherein the first fastener is able to mount in the first hole on the first extension and the second fastener is able to mount in the second hole on the second extension while the power input terminal is plugged in the socket.

Abstract: A server housing, comprising a top cover and a base frame, is provided. The top cover has a top piece and parallel first side and second side. The two parallel sides are coupled with two opposite sides of the top piece. Each of the top piece and the two parallel sides has an interior. The top cover further comprises: two approximately parallel latches, five approximately parallel tabs, two first prominences and two second prominences. The two approximately parallel latches are on the interior of the top piece. The five approximately parallel tabs are on the interior of the top piece. The two first prominences are on the interior of the first side. The two second prominences are on the interior of the second side. The base frame is assembled with the top cover and comprises: a first side panel, a second side panel and a mounting bracket. The first side panel comprises two first guiding recesses for receiving the first prominences. The second side panel is parallel to the first side panel.

Abstract: A motherboard module includes a motherboard, a backboard, and a modular mechanism. The modular mechanism for fast assembly and disassembly of a motherboard includes an upright, an upstanding structure, and a fastener. The upstanding structure is used for positioning the motherboard. Since the upstanding structure is perpendicularly attached to the back edge of the motherboard and the backboard is adhered to one surface of the upstanding structure, the fastener presses and engages the backboard so that the upright clinches the slit in the motherboard and the motherboard is thus secured.

Abstract: This specification discloses an anti-EMI device used in electronic products. The device contains a U-shape component and a spring component. The U-shape component is embedded inside the housing of an electronic product for fixing and connecting the anti-EMI device to the electronic product. The spring component is used to shield the EMI from the electronic product. The spring component is connected to the bottom surface of the U-shape component, extending along both sidewalls toward the opening of the U-shape component and protruding out of the electronic product housing.

Abstract: A heatsink assembly having a stabilization plate is described. The stabilization plate, such as an n-shaped PORON slice, is disposed under a heatsink, and is surrounding a thermal pad under the heatsink. The stabilization plate is helpful to stabilize the combination of the thermal pad up to the heatsink. With the stabilization, the thermal pad is efficiently stuck on to a die for dissipating the heat therefrom.