Abstract: Lightguides, devices incorporating lightguides, processes for making lightguides, and tools used to make lightguides are described. A lightguide includes light extractors arranged in a plurality of regions on a surface of the lightguide. The orientation of light extractors in each region is arranged to enhance uniformity and brightness across a surface of the lightguide and to provide enhanced defect hiding. The efficiency of the light extractors is controlled by the angle of a given light extractor face with respect to a light source illuminating the light guide.

Abstract: A novel etching agent for etching II-VI semiconductors is provided. The etching agent includes an aqueous solution of potassium permanganate and phosphoric acid. This etching solution can etch II-VI semiconductors at a rapid rate but tend to be much less reactive with III-V semiconductors. The provided agent can be used in a method for etching II-VI semiconductors.

Abstract: A passive electrical article including a dielectric layer having a nonwoven material.

Abstract: A multiphoton curable photoreactive composition including hydantoin hexaacrylate and a photoinitiator system. In some embodiments, the multiphoton curable photoreactive composition consists essentially of hydantoin hexaacrylate and a photoinitiator system. Additionally, the applying a multiphoton curable photoreactive composition comprising hydantoin hexaacrylate and a photoinitiator system may be applied to a substrate and a portion of the multiphoton curable photoreactive composition may be at least partially cured to form an at least partially cured structure.

Abstract: A method of forming a supported catalyst, the method comprising forming a colloidal suspension of platinum-iron catalyst nanoparticles in a solvent, depositing at least a portion of the catalyst nanoparticles onto support particles, and removing at least a portion of the iron from the deposited catalyst nanoparticles.

Abstract: An etched dielectric film for use in a hard disk drive. The dielectric film has a thickness of about 25 ?m or greater when it is attached to a supporting metal substrate, and is subsequently etched to a thickness of about 20 ?m or less.

Abstract: Provided is a composition comprising: an aqueous solution for etching a polymeric material comprising from about 30 wt. % to about 55 wt. % of an alkali metal salt; from about 10 wt. % to about 35 wt. % of a solubilizer dissolved in said solution; and from about 3 wt. % to about 30 wt. % ethylene glycol dissolved in said solution. Also provided is a process comprising: providing a polymeric film; contacting said polymeric film with an aqueous solution comprising from about 30 wt. % to about 55 wt. % of an alkali metal salt; from about 10 wt. % to about 35 wt. % of a solubilizer dissolved in said solution; and from about 3 wt. % to about 30 wt. % ethylene glycol dissolved in said solution.

Abstract: A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.

Abstract: A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.

Abstract: A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.

Abstract: An article having a benzocyclobutene-based resin layer and a coupling agent containing a mixture of a vinylsilane and an aminosilane.

Abstract: Disclosed herein is a composition for etching a polycarbonate film comprising an alkali metal salt and an amine solubilizer. Also disclosed is a method for etching polycarbonate films with the etchant and an article containing the etched film. The article is useful for, e.g., flexible circuits and carrier tapes.

Abstract: Provided are partially etched dielectric films with raised conductive features. Also provided are methods for forming the raised conductive features in the dielectric films, which methods include partially etching the dielectric films.

Abstract: Disclosed herein is a composition for etching a polycarbonate film comprising an alkali metal salt and an amine solubilizer. Also disclosed is a method for etching polycarbonate films with the etchant and an article containing the etched film. The article is useful for, e.g., flexible circuits and carrier tapes.

Abstract: Provided are partially etched dielectric films with raised conductive features. Also provided are methods for forming the raised conductive features in the dielectric films, which methods include partially etching the dielectric films.

Abstract: A process for providing a metal-seeded liquid crystal polymer comprising the steps of providing a liquid crystal polymer substrate to be treated by applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer as an etchant composition for the liquid crystal polymer substrate. Further treatment of the etched liquid crystal polymer substrate involves depositing an adherent metal layer on the etched liquid crystal polymer substrate. An adherent metal layer may be deposited using either electroless metal plating or vacuum deposition of metal such as by sputtering. When using electroless metal plating, a tin(II) solution applied to the liquid crystal polymer provides a treated liquid crystal polymer substrate to which the application of a palladium(II) solution provides the metal-seeded liquid crystal polymer. The etchant composition comprises a solution in water of from 35 wt. % to 55 wt. % of an alkali metal salt, and from 10 wt. % to 35 wt.

Abstract: Method of fabricating an optical element. A photodefinable composition is provided that includes (i) a hydrophobic, photodefinable polymer, said photodefinable polymer having a glass transition temperature in the cured state of at least about 80° C.; and (ii) a multiphoton photoinitiator system comprising at least one multiphoton photosensitizer and preferably at least one phtoinitiator that is capable of being photosensitized by the photosensitizer. One or more portions of the composition are imagewise exposed to the electromagnetic energy under conditions effective to photodefinably form at least a portion of a three-dimensional optical element.

Abstract: A supported catalyst is provided comprising catalyst metal nanoparticles having an average particle size of 3.0 nm or less, or more typically 2.0 nm or less, and typically having a standard deviation of particle size of 0.5 nm or less, which are supported on support particles at a loading of 30% or more. Typical catalyst metals are selected from platinum, palladium, ruthenium, rhodium, iridium, osmium, molybdenum, tungsten, iron, nickel and tin. Typical support particles are carbon. A method of making a supported catalyst is provided comprising the steps of: a) providing a solution of metal chlorides of one or more catalyst metals in solvent system containing at least one polyalcohol, typically ethylene glycol containing less than 2% water; b) forming a colloidal suspension of unprotected catalyst metal nanoparticles by raising the pH of the solution, typically to a pH of 10 or higher, and heating said solution, typically to 125 ° C.

Abstract: An etched dielectric film for use in microfluidic devices. Channels, recesses, and other features can be etched into the films to make them suitable for use in microfluidic devices.

Abstract: A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.