Patents by Inventor Guoquan Liu

Guoquan Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11882022
    Abstract: A packet sending method and device. The first node sets a next-hop of the routing information to a next-hop through which the first node reaches the first route source. The destination address of the routing information is the address prefix. When the second route source is superior to the first route source, the first node switches the next-hop of the routing information to a next-hop through which the first node reaches the second route source. Then, the first node adds, to a target packet, path information of a forwarding path from the first node to the second route source according to the switching operation, where a destination address of the target packet matches the address prefix. Finally, the first node forwards the target packet to the second route source through the forwarding path.
    Type: Grant
    Filed: September 2, 2022
    Date of Patent: January 23, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Guoquan Liu, Ruqin Lan, Zuliang Wang, Zhibo Hu, Chenxi Li
  • Publication number: 20230060363
    Abstract: A packet sending method and device. The first node sets a next-hop of the routing information to a next-hop through which the first node reaches the first route source. The destination address of the routing information is the address prefix. When the second route source is superior to the first route source, the first node switches the next-hop of the routing information to a next-hop through which the first node reaches the second route source. Then, the first node adds, to a target packet, path information of a forwarding path from the first node to the second route source according to the switching operation, where a destination address of the target packet matches the address prefix. Finally, the first node forwards the target packet to the second route source through the forwarding path.
    Type: Application
    Filed: September 2, 2022
    Publication date: March 2, 2023
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Guoquan LIU, Ruqin LAN, Zuliang WANG, Zhibo HU, Chenxi LI
  • Patent number: 11469989
    Abstract: A packet sending method and device. The first node sets a next-hop of the routing information to a next-hop through which the first node reaches the first route source. The destination address of the routing information is the address prefix. When the second route source is superior to the first route source, the first node switches the next-hop of the routing information to a next-hop through which the first node reaches the second route source. Then, the first node adds, to a target packet, path information of a forwarding path from the first node to the second route source according to the switching operation, where a destination address of the target packet matches the address prefix. Finally, the first node forwards the target packet to the second route source through the forwarding path.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: October 11, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Guoquan Liu, Ruqin Lan, Zuliang Wang, Zhibo Hu, Chenxi Li
  • Publication number: 20210409310
    Abstract: A method is applied to a network comprising a first area and a second area. A first node in the first area obtains aggregated routing information, where the aggregated routing information is obtained by aggregating a plurality of pieces of original routing information, the plurality of pieces of original routing information correspond to N nodes in a network segment, the N nodes in the network segment have a same flexible algorithm flex-algo, and the aggregated routing information carries an algorithm identifier used to indicate the flex-algo and a network segment identifier used to indicate the network segment. The first node sends the aggregated routing information to the second area, where the aggregated routing information is used to indicate a node in the second area to send a packet to the N nodes in the network segment based on the aggregated routing information.
    Type: Application
    Filed: June 23, 2021
    Publication date: December 30, 2021
    Inventors: Ruqin Lan, Guoqi Xu, Chuang Chen, Guoquan Liu, Zuliang Wang
  • Publication number: 20210399977
    Abstract: A packet sending method and device. The first node sets a next-hop of the routing information to a next-hop through which the first node reaches the first route source. The destination address of the routing information is the address prefix. When the second route source is superior to the first route source, the first node switches the next-hop of the routing information to a next-hop through which the first node reaches the second route source. Then, the first node adds, to a target packet, path information of a forwarding path from the first node to the second route source according to the switching operation, where a destination address of the target packet matches the address prefix. Finally, the first node forwards the target packet to the second route source through the forwarding path.
    Type: Application
    Filed: June 10, 2021
    Publication date: December 23, 2021
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Guoquan LIU, Ruqin LAN, Zuliang WANG, Zhibo HU, Chenxi LI
  • Patent number: 10928693
    Abstract: An array substrate, a repair method of the array substrate, a display panel and a display device are provided. The array substrate includes a base substrate, and a common electrode layer, a common electrode line mesh, a first metal layer and a second metal layer which are on the base substrate, and the common electrode line mesh is electrically connected with the common electrode layer. The first metal layer includes a first signal line extending along a first direction; the second metal layer includes a second signal line extending along a second direction and a plurality of repair connection portions; and each repair connection portion has a first overlap portion overlapping the first signal line and a second overlap portion overlapping the common electrode line mesh.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: February 23, 2021
    Assignees: Hefei Xinsheng Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Lu Che, Qiangqiang Ji, Guoquan Liu, Qiang Zhou, Xiaomei Wei
  • Patent number: 10859883
    Abstract: The embodiments of the present disclosure propose an array substrate, a display apparatus, and a maintaining method. The array substrate comprises: a first signal line disposed in a first direction; a second signal line disposed in a second direction different from the first direction; and a maintaining part disposed adjacent to an intersection region of the first signal line which overlaps with the second signal line, electrically connected to a common electrode line, and is electrically insulated from the first signal line.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: December 8, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Qiangqiang Ji, Guoquan Liu, Lu Che
  • Publication number: 20200192169
    Abstract: The embodiments of the present disclosure propose an array substrate, a display apparatus, and a maintaining method. The array substrate comprises: a first signal line disposed in a first direction; a second signal line disposed in a second direction different from the first direction; and a maintaining part disposed adjacent to an intersection region of the first signal line which overlaps with the second signal line, electrically connected to a common electrode line, and is electrically insulated from the first signal line.
    Type: Application
    Filed: October 13, 2017
    Publication date: June 18, 2020
    Applicants: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Qiangqiang Ji, Guoquan Liu, Lu Che
  • Patent number: 10685989
    Abstract: A method for manufacturing a display panel, a display panel, and a display device are provided. The method includes: forming a plurality of gate lines and a common electrode line pattern on a base substrate; forming an insulating layer on the base substrate on which the plurality of gate lines and the common electrode line pattern are formed; forming a via hole on the insulating layer; and forming a metal conductive pattern on the base substrate on which the insulating layer is formed. The common electrode line and the common electrode connection block located on two sides of a gate line are electrically connected through a bridging structure in a conductive layer made of metal, which reduces the resistance of the bridging structure, so that the voltage uniformity throughout the common electrode line pattern which is bridged through the bridging pattern is high.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: June 16, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Xingfeng Ren, Guoquan Liu, Zhengwei Chen
  • Patent number: 10497721
    Abstract: An array substrate, a manufacturing method and a maintenance method thereof, and a display device. The array substrate includes a base substrate, a signal line layer, a color filter layer, and a common line layer. The signal line layer includes multiple signal lines. The common line layer includes a plurality of first common lines and second common lines. An orthographic projection of each signal line on the base substrate is substantially parallel to an orthographic projection of each second common line on the base substrate. An orthographic projection of each signal line on the base substrate and orthographic projections of the plurality of first common lines on the base substrate have overlapping areas. A via hole penetrates the color filter layer, and an orthographic projection of the via hole on the base substrate at least partially overlaps the overlapping area.
    Type: Grant
    Filed: November 24, 2017
    Date of Patent: December 3, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Shiju Zhang, Guoquan Liu
  • Publication number: 20190243195
    Abstract: An array substrate, a repair method of the array substrate, a display panel and a display device are provided. The array substrate includes a base substrate, and a common electrode layer, a common electrode line mesh, a first metal layer and a second metal layer which are on the base substrate, and the common electrode line mesh is electrically connected with the common electrode layer. The first metal layer includes a first signal line extending along a first direction; the second metal layer includes a second signal line extending along a second direction and a plurality of repair connection portions; and each repair connection portion has a first overlap portion overlapping the first signal line and a second overlap portion overlapping the common electrode line mesh.
    Type: Application
    Filed: April 23, 2018
    Publication date: August 8, 2019
    Applicants: Hefei Xinsheng Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Lu Che, Qiangqiang Ji, Guoquan Liu, Qiang Zhou, Xiaomei Wei
  • Publication number: 20190096924
    Abstract: A method for manufacturing a display panel, a display panel, and a display device are provided. The method includes: forming a plurality of gate lines and a common electrode line pattern on a base substrate; forming an insulating layer on the base substrate on which the plurality of gate lines and the common electrode line pattern are formed; forming a via hole on the insulating layer; and forming a metal conductive pattern on the base substrate on which the insulating layer is formed. The common electrode line and the common electrode connection block located on two sides of a gate line are electrically connected through a bridging structure in a conductive layer made of metal, which reduces the resistance of the bridging structure, so that the voltage uniformity throughout the common electrode line pattern which is bridged through the bridging pattern is high.
    Type: Application
    Filed: June 29, 2018
    Publication date: March 28, 2019
    Inventors: Xingfeng Ren, Guoquan Liu, Zhengwei Chen
  • Patent number: 10204928
    Abstract: The present application discloses a display substrate comprising a base substrate; a first electrode on the base substrate; a first insulating layer on a side of the first electrode distal to the base substrate; a thin film transistor on a side of the first insulating layer distal to the first electrode; a second insulating layer on a side of the thin film transistor distal to the first insulating layer; an organic layer on a side of the second insulating layer distal to the thin film transistor; and a second electrode on a side of the organic layer distal to the second insulating layer.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: February 12, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Zhenfei Cai, Qiangqiang Ji, Guoquan Liu, Zhengwei Chen
  • Publication number: 20190035812
    Abstract: An array substrate, a manufacturing method and a maintenance method thereof, and a display device. The array substrate includes a base substrate, a signal line layer, a color filter layer, and a common line layer. The signal line layer includes multiple signal lines. The common line layer includes a plurality of first common lines and second common lines. An orthographic projection of each signal line on the base substrate is substantially parallel to an orthographic projection of each second common line on the base substrate. An orthographic projection of each signal line on the base substrate and orthographic projections of the plurality of first common lines on the base substrate have overlapping areas. A via hole penetrates the color filter layer, and an orthographic projection of the via hole on the base substrate at least partially overlaps the overlapping area.
    Type: Application
    Filed: November 24, 2017
    Publication date: January 31, 2019
    Inventors: Shiju ZHANG, Guoquan LIU
  • Patent number: 10157938
    Abstract: The present application discloses a fabrication method for forming an array substrate, including: forming, in a fanout region, a first signal-load line connected to a first group of data lead wires, and a second signal-load line connected to a second group of data lead wires; and forming, in the fanout region, at least one unidirectional device at a connection point of the first signal-load line and a data lead wire, at least one unidirectional device at a connection point of the second signal-load line and a data lead wire. The first signal-load line and the second signal-load line are each configured to transmit an external testing signal along a single direction to the data lead wires through the unidirectional devices.
    Type: Grant
    Filed: November 7, 2016
    Date of Patent: December 18, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD
    Inventors: Shiju Zhang, Xingfeng Ren, Guoquan Liu
  • Publication number: 20180348586
    Abstract: The present disclosure provides an array substrate and and a repair method thereof. The array substrate comprises a first metal layer including a signal line; a first repair layer; and a first insulating layer. The first insulating layer is disposed between, and provides insulation between, the first metal layer and the first repair layer, and it is configured to be penetrable to allow the first repair layer to electrically connect the signal line to thereby repair connection weakness of the signal line. The first repair layer can comprise a first repair line, which is disposed over and along the signal line and is configured to be able to electrically connect two ends of a weak connection portion of the signal line through vias penetrating the first insulating layer.
    Type: Application
    Filed: July 1, 2016
    Publication date: December 6, 2018
    Applicants: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD .
    Inventors: Junjie LI, Fei TENG, Guoquan LIU
  • Patent number: 9995979
    Abstract: The present disclosure provides an array substrate, a display device, a method for maintenance and a method for manufacturing the array substrate. The array substrate includes a base substrate and a plurality of signal lines arranged on the base substrate.
    Type: Grant
    Filed: December 23, 2015
    Date of Patent: June 12, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINGSHENG OPTOELECTRONICS TECHNOLOGY CO..
    Inventors: Yaoyao Feng, Guoquan Liu, Chong Fang
  • Publication number: 20180069030
    Abstract: The present application discloses a fabrication method for forming an array substrate, including: forming, in a fanout region, a first signal-load line connected to a first group of data lead wires, and a second signal-load line connected to a second group of data lead wires; and forming, in the fanout region, at least one unidirectional device at a connection point of the first signal-load line and a data lead wire, at least one unidirectional device at a connection point of the second signal-load line and a data lead wire. The first signal-load line and the second signal-load line are each configured to transmit an external testing signal along a single direction to the data lead wires through the unidirectional devices.
    Type: Application
    Filed: November 7, 2016
    Publication date: March 8, 2018
    Inventors: Shiju ZHANG, Xingfeng REN, Guoquan LIU
  • Publication number: 20170236837
    Abstract: The present application discloses a display substrate comprising a base substrate; a first electrode on the base substrate; a first insulating layer on a side of the first electrode distal to the base substrate; a thin film transistor on a side of the first insulating layer distal to the first electrode; a second insulating layer on a side of the thin film transistor distal to the first insulating layer; an organic layer on a side of the second insulating layer distal to the thin film transistor; and a second electrode on a side of the organic layer distal to the second insulating layer.
    Type: Application
    Filed: May 20, 2016
    Publication date: August 17, 2017
    Applicants: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Zhenfei Cai, Qiangqiang Ji, Guoquan Liu, Zhengwei Chen
  • Patent number: D884338
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: May 19, 2020
    Assignee: SHENZHEN NAPOV TECHNOLOGY CO., LTD
    Inventor: Guoquan Liu