Abstract: A radio frequency (RF) loopback substrate or printed circuit board (PCB) which contains receive and transmit antennas located on the bottom of the loopback substrate which are aligned with the complementary transmit and receive antennas on an antenna on package (AOP) device under test. The loopback substrate receive and transmit antennas are coupled to each other. The device under test contacts are driven by a conventional tester, which causes RF circuitry in the integrated circuit to drive an AOP transmit antenna. The corresponding loopback substrate receive antenna receives the RF signal from the AOP transmit antenna and provides it to the loopback substrate transmit antennas. The integrated circuit package AOP receive antennas then receive the RF signals from the loopback substrate transmit antennas. The signals at the integrated circuit package AOP receive antennas are monitored through the integrated circuit contacts to monitor the received RF signals.

Abstract: A radio frequency (RF) loopback substrate or printed circuit board (PCB) which contains receive and transmit antennas located on the bottom of the loopback substrate which are aligned with the complementary transmit and receive antennas on an antenna on package (AOP) device under test. The loopback substrate receive and transmit antennas are coupled to each other. The device under test contacts are driven by a conventional tester, which causes RF circuitry in the integrated circuit to drive an AOP transmit antenna. The corresponding loopback substrate receive antenna receives the RF signal from the AOP transmit antenna and provides it to the loopback substrate transmit antennas. The integrated circuit package AOP receive antennas then receive the RF signals from the loopback substrate transmit antennas. The signals at the integrated circuit package AOP receive antennas are monitored through the integrated circuit contacts to monitor the received RF signals.

Abstract: A radio frequency (RF) loopback substrate or printed circuit board (PCB) which contains receive and transmit antennas located on the bottom of the loopback substrate which are aligned with the complementary transmit and receive antennas on an antenna on package (AOP) device under test. The loopback substrate receive and transmit antennas are coupled to each other. The device under test contacts are driven by a conventional tester, which causes RF circuitry in the integrated circuit to drive an AOP transmit antenna. The corresponding loopback substrate receive antenna receives the RF signal from the AOP transmit antenna and provides it to the loopback substrate transmit antennas. The integrated circuit package AOP receive antennas then receive the RF signals from the loopback substrate transmit antennas. The signals at the integrated circuit package AOP receive antennas are monitored through the integrated circuit contacts to monitor the received RF signals.

Abstract: A radio frequency (RF) loopback substrate or printed circuit board (PCB) which contains receive and transmit antennas located on the bottom of the loopback substrate which are aligned with the complementary transmit and receive antennas on an antenna on package (AOP) device under test. The loopback substrate receive and transmit antennas are coupled to each other. The device under test contacts are driven by a conventional tester, which causes RF circuitry in the integrated circuit to drive an AOP transmit antenna. The corresponding loopback substrate receive antenna receives the RF signal from the AOP transmit antenna and provides it to the loopback substrate transmit antennas. The integrated circuit package AOP receive antennas then receive the RF signals from the loopback substrate transmit antennas. The signals at the integrated circuit package AOP receive antennas are monitored through the integrated circuit contacts to monitor the received RF signals.

Abstract: A method includes: generating, via a testing signal source, a test transmission signal; receiving the test transmission signal at an input port of a socket device having the input port, an input coupler, a divider, a combiner, an output coupler and an output port; providing, via the input coupler, an input signal based on the test transmission signal; providing, via the divider, portions of the input signal to each of respective inputs of m receivers of a transceiver having n transmitters and the m receivers; combining, via the combiner, signals provided at the respective outputs of the n transmitters into a combined output signal; providing a coupled output signal to the input coupler; providing a measured output signal to the output port; providing, via the output port, the measured output signal to a receiving signal measuring device; and testing, via the receiving signal measuring device, the measured output signal.

Abstract: A method includes; generating, via a testing signal source, a test transmission signal; receiving the test transmission signal at an input port of a socket device having the input port, an input coupler, a divider, a combiner, an output coupler and an output port; providing, via the input coupler, an input signal based on the test transmission signal; providing, via the divider, portions of the input signal to each of respective inputs of in receivers of a transceiver having n transmitters and the m receivers; combining, via the combiner, signals provided at the respective outputs of the n transmitters into a combined output signal; providing a coupled output signal to the input coupler; providing a measured output signal to the output port; providing, via the output port, the measured output signal to a receiving signal measuring device; and testing, via the receiving signal measuring device, the measured output signal.