Patents by Inventor Guowen Liu

Guowen Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220399644
    Abstract: A millimeter-wave antenna-in-package includes a substrate, and a radiation structure and a first antenna feeder that are disposed in the substrate. The first antenna feeder includes an antenna matching stub, a feeder transmission strap, and a first harmonic suppression unit. A first end of the antenna matching stub is connected to the radiation structure. The first harmonic suppression unit includes a first transmission part and a first bent part. A first end of the first bent part is connected to a first end of the first transmission part, and a second end of the first bent part and a second end of the first transmission part form a first opening. A second end of the antenna matching stub is connected to the feeder transmission strap through the first transmission part, and the feeder transmission strap extends along the first reference direction.
    Type: Application
    Filed: August 19, 2022
    Publication date: December 15, 2022
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Weixi ZHOU, Xianbiao WANG, Guowen LIU
  • Publication number: 20220336387
    Abstract: The invention provides a chip including a package substrate, at least one subunit, and a radio frequency chip. Each subunit includes an end-fire antenna disposed on an upper surface of the package substrate. The end-fire antenna is electrically connected to the radio frequency chip through a feed line. The radio frequency chip is located on a lower surface of the package substrate. According to the millimeter-wave antenna chip provided in this application, the end-fire antenna may be lifted to the upper surface of the package substrate of the chip by using stacked metal via holes of the package substrate, and a height of the end-fire antenna relative to a peripheral component may be increased by using a thickness of the package substrate.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 20, 2022
    Inventors: Weixi ZHOU, Liangsheng LIU, Guowen LIU
  • Patent number: 11430760
    Abstract: A chip package device includes a chip, and a first substrate and a second substrate that are disposed opposite to each other, where the chip is disposed on a surface that is of the first substrate and that faces the second substrate. The chip is electrically connected to the first substrate through a first conductive part, the first substrate is electrically connected to the second substrate through a second conductive part, and a heat dissipation passage is formed between the chip and the second substrate through a thermally conductive layer. The chip package device may further include a molding compound that is configured to wrap the chip. The thermally conductive layer disposed between the chip and the second substrate can quickly dissipate a large amount of heat generated by the chip to the second substrate so that the chip maintains a normal temperature.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: August 30, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jiajie Tang, Guanhong Ye, Laicun Lin, Guowen Liu, Shuai Zheng, Huafeng Zhang
  • Patent number: 11049823
    Abstract: An integrated circuit package apparatus deployed with an antenna and a method for manufacturing an integrated circuit package apparatus, where the integrated circuit package apparatus includes a package substrate, an antenna, a chip, and a connection circuit. The package substrate includes at least one ground plane, the antenna is deployed on an external surface of one side of the package substrate and is located on one side of the at least one ground plane, the chip and the connection circuit are deployed on the other side of the at least one ground plane, where the antenna is isolated from the chip and the connection circuit using the at least one ground plane, and the antenna is coupled to the chip using the connection circuit and a first metal through hole in a thickness direction of the package substrate.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: June 29, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Tewei Chen, Guowen Liu
  • Publication number: 20200350274
    Abstract: A chip package device includes a chip, and a first substrate and a second substrate that are disposed opposite to each other, where the chip is disposed on a surface that is of the first substrate and that faces the second substrate. The chip is electrically connected to the first substrate through a first conductive part, the first substrate is electrically connected to the second substrate through a second conductive part, and a heat dissipation passage is formed between the chip and the second substrate through a thermally conductive layer. The chip package device may further include a molding compound that is configured to wrap the chip. The thermally conductive layer disposed between the chip and the second substrate can quickly dissipate a large amount of heat generated by the chip to the second substrate so that the chip maintains a normal temperature.
    Type: Application
    Filed: July 17, 2020
    Publication date: November 5, 2020
    Inventors: Jiajie TANG, Guanhong YE, Laicun LIN, Guowen LIU, Shuai ZHENG, Huafeng ZHANG
  • Publication number: 20190081013
    Abstract: An integrated circuit package apparatus deployed with an antenna and a method for manufacturing an integrated circuit package apparatus, where the integrated circuit package apparatus includes a package substrate, an antenna, a chip, and a connection circuit. The package substrate includes at least one ground plane, the antenna is deployed on an external surface of one side of the package substrate and is located on one side of the at least one ground plane, the chip and the connection circuit are deployed on the other side of the at least one ground plane, where the antenna is isolated from the chip and the connection circuit using the at least one ground plane, and the antenna is coupled to the chip using the connection circuit and a first metal through hole in a thickness direction of the package substrate.
    Type: Application
    Filed: November 9, 2018
    Publication date: March 14, 2019
    Inventors: Tewei Chen, Guowen Liu
  • Patent number: 9365893
    Abstract: Described are methods for the high-throughput discovery and genotyping of nucleotide polymorphisms in DNA, including single nucleotide polymorphism (SNPs) and short deletions and insertions. These methods take advantage of the fact that differences in DNA sequence result in the differential presence of restriction endonuclease digestion sites. Approaches involve isolation of short DNA fragments (“tags”) near restriction endonuclease sites. The presence of one (or two) of these tags indicates that a site was present. Regions of DNA with a restriction site in only one individual create an opportunity for primer extension to produce labeled material, which can be assayed on a platform that employs a collection of nucleic acids. Efficient variant detection microarrays and bead libraries are provided that contain genomic tags with different representations between two populations, so that most elements in the collection of nucleic acids contain a SNP between populations of interest.
    Type: Grant
    Filed: May 10, 2006
    Date of Patent: June 14, 2016
    Assignee: State of Oregon Acting by and through the State Board of Higher Education on behalf of the University of Oregon
    Inventors: Eric A. Johnson, Guowen Liu, Michael R. Miller
  • Publication number: 20110198436
    Abstract: A vehicle capable of driving on land, air or water comprises of a fuselage (1), a main engine or a main motor, and a power control and transmitting system. A main shaft (2) is provided at two sides of the fuselage. Blade sleeves (6) are fixed to the main shafts. Blade handles (7) capable of spinning around own axes are mounted on the blade sleeves. Blades are fixed to the blade handles. Blade open-close devices are installed on the fuselage and/or on the main shafts to control the blades to rotate relative to the blade sleeves and the main shafts. The blade open-close device is a mechanism that can open and close the blades once a cycle of rotating along with the main shaft. When opened, blades' broad flat surfaces are parallel or generally parallel with the main shafts. When closed, the blades' broad flat surfaces are perpendicular or generally perpendicular to the main shafts.
    Type: Application
    Filed: April 21, 2011
    Publication date: August 18, 2011
    Inventors: Guowen Liu, Wanbing W. Liu, Quanwen Liu
  • Patent number: 7563581
    Abstract: This disclosure provides methods for detecting and localizing DNA mutations by DNA microarray. In various embodiments, the described methods include use of restriction endonuclease(s) and/or mismatch-recognition nuclease(s) to detect and/or localize mutations. In one representative method, reference and target DNA are digested using one or more restriction endonucleases, resultant DNA strands are labeled (e.g., using a DNA polymerase), and the labeled mixture of DNAs is hybridized to a microarray. In another representative method, reference and target DNA are denatured and annealed to form a mixture containing heteroduplex DNA, one or more mismatch-recognition nuclease(s) are used to nick or cleave at least a portion of the heteroduplex DNA, resultant DNA strands are labeled (e.g., using a DNA polymerase) and the labeled mixture of DNAs is hybridized to a microarray.
    Type: Grant
    Filed: April 29, 2008
    Date of Patent: July 21, 2009
    Assignee: State of Oregon acting by and through the State Board of Higher Education on Behalf of the University of Oregon
    Inventor: Guowen Liu
  • Publication number: 20080206875
    Abstract: This disclosure provides methods for detecting and localizing DNA mutations by DNA microarray. In various embodiments, the described methods include use of restriction endonuclease(s) and/or mismatch-recognition nuclease(s) to detect and/or localize mutations. In one representative method, reference and target DNA are digested using one or more restriction endonucleases, resultant DNA strands are labeled (e.g., using a DNA polymerase), and the labeled mixture of DNAs is hybridized to a microarray. In another representative method, reference and target DNA are denatured and annealed to form a mixture containing heteroduplex DNA, one or more mismatch-recognition nuclease(s) are used to nick or cleave at least a portion of the heteroduplex DNA, resultant DNA strands are labeled (e.g., using a DNA polymerase) and the labeled mixture of DNAs is hybridized to a microarray.
    Type: Application
    Filed: April 29, 2008
    Publication date: August 28, 2008
    Inventor: Guowen Liu
  • Publication number: 20080194418
    Abstract: Described herein are methods for the high-throughput discovery and genotyping of nucleotide polymorphisms in DNA, including single nucleotide polymorphism (SNPs) and short deletions and insertions. These methods take advantage of the fact that differences in DNA sequence result in the differential presence of restriction endonuclease digestion sites. Differences can be detected between individuals, or the relative presence detected in a population. Provided approaches involve isolation of short DNA fragments (“tags) near restriction endonuclease sites. The presence of one (or two) of these tags indicates that a site was present. Distinguishable labeling of tags from two individual or populations allows comparative presence of these sites to be assayed on a platform that employs a collection of nucleic acids. Other approaches depend on the differential presence of restriction endonuclease sites, but involve mixing genomic DNA from the two individuals.
    Type: Application
    Filed: May 10, 2006
    Publication date: August 14, 2008
    Inventors: Eric A. Johnson, Guowen Liu, Michael R. Miller
  • Patent number: 7378245
    Abstract: This disclosure provides methods for detecting and localizing DNA mutations by DNA microarray. In various embodiments, the described methods include use of restriction endonuclease(s) and/or mismatch-recognition nuclease(s) to detect and/or localize mutations. In one representative method, reference and target DNA are digested using one or more restriction endonucleases, resultant DNA strands are labeled (e.g., using a DNA polymerase), and the labeled mixture of DNAs is hybridized to a microarray. In another representative method, reference and target DNA are denatured and annealed to form a mixture containing heteroduplex DNA, one or more mismatch-recognition nuclease(s) are used to nick or cleave at least a portion of the heteroduplex DNA, resultant DNA strands are labeled (e.g., using a DNA polymerase) and the labeled mixture of DNAs is hybridized to a microarray.
    Type: Grant
    Filed: November 28, 2006
    Date of Patent: May 27, 2008
    Assignee: State of Oregon Acting by and Through the State Board of Higher Education on Behalf of the University of Oregon
    Inventor: Guowen Liu
  • Publication number: 20070184468
    Abstract: This disclosure provides methods for detecting and localizing DNA mutations by DNA microarray. In various embodiments, the described methods include use of restriction endonuclease(s) and/or mismatch-recognition nuclease(s) to detect and/or localize mutations. In one representative method, reference and target DNA are digested using one or more restriction endonucleases, resultant DNA strands are labeled (e.g., using a DNA polymerase), and the labeled mixture of DNAs is hybridized to a microarray. In another representative method, reference and target DNA are denatured and annealed to form a mixture containing heteroduplex DNA, one or more mismatch-recognition nuclease(s) are used to nick or cleave at least a portion of the heteroduplex DNA, resultant DNA strands are labeled (e.g., using a DNA polymerase) and the labeled mixture of DNAs is hybridized to a microarray.
    Type: Application
    Filed: November 28, 2006
    Publication date: August 9, 2007
    Inventor: Guowen Liu
  • Patent number: 7141371
    Abstract: This disclosure provides methods for detecting and localizing DNA mutations by DNA microarray. In various embodiments, the described methods include use of restriction endonuclease(s) and/or mismatch-recognition nuclease(s) to detect and/or localize mutations. In one representative method, reference and target DNA are digested using one or more restriction endonucleases, resultant DNA strands are labeled (e.g., using a DNA polymerase), and the labeled mixture of DNAs is hybridized to a microarry. In another representative method, reference and target DNA are denatured and annealed to form a mixture containing heteroduplex DNA, one or more mismatch-recognition nuclease(s) are used to nick or cleave at least a portion of the heteroduplex DNA, resultant DNA strands are labeled (e.g., using a DNA polymerase) and the labeled mixture of DNAs is hybridized to a microarray.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: November 28, 2006
    Assignee: State of Oregon Acting by and through the State Board of Higher Education on behalf of the University of Oregon
    Inventor: Guowen Liu
  • Publication number: 20040048257
    Abstract: This invention provides two methods for detecting and localizing DNA mutations by DNA microarray.
    Type: Application
    Filed: September 6, 2002
    Publication date: March 11, 2004
    Inventor: Guowen Liu