Patents by Inventor Guoyu SU

Guoyu SU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9893433
    Abstract: The present disclosure provides an array antenna. The array antenna includes a cavity power divider that receives an input signal and performs power division to output a first power-divided signal. The array antenna also includes a final-stage power dividing, coupling, and radiating unit that includes a dielectric substrate and a first and a second metal surface layer. A coupling slot array is formed on the second metal surface layer to receive the first power-divided signal. A radiating slot array corresponding to the coupling slot array is formed on the first metal surface layer; Several plated through-hole units are provided on the dielectric substrate, where the plated through-hole units go through the first and second metal surface layers vertically, and a range corresponding to each plated through-hole unit encloses a coupling slot and a radiating slot corresponding to the coupling slot.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: February 13, 2018
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chang Cao, Fabio Morgia, Uhland Goebel, Guoyu Su
  • Patent number: 9647313
    Abstract: The invention relates to a surface mount microwave system, comprising a multilayer arrangement comprising a first conductive layer, a second conductive layer and a dielectric layer, wherein the first conductive layer is arranged on the dielectric layer, and wherein the dielectric layer is arranged on the second conductive layer, wherein the first conductive layer comprises a microwave circuit and wherein the second conductive layer forms a reference potential layer, a hollow microwave waveguide being at least partly formed in the second conductive layer, and a microwave transition structure for electromagnetically coupling the first conductive layer with the hollow microwave waveguide. According to some implementation forms, a reflector on a cover covering the multilayer arrangement may be avoided.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: May 9, 2017
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Franco Marconi, Fabio Morgia, Haiou Gou, Stefano Verzura, Guoyu Su
  • Publication number: 20160301143
    Abstract: The present disclosure provides an array antenna. The array antenna includes a cavity power divider that receives an input signal and performs power division to output a first power-divided signal. The array antenna also includes a final-stage power dividing, coupling, and radiating unit that includes a dielectric substrate and a first and a second metal surface layer. A coupling slot array is formed on the second metal surface layer to receive the first power-divided signal. A radiating slot array corresponding to the coupling slot array is formed on the first metal surface layer; Several plated through-hole units are provided on the dielectric substrate, where the plated through-hole units go through the first and second metal surface layers vertically, and a range corresponding to each plated through-hole unit encloses a coupling slot and a radiating slot corresponding to the coupling slot.
    Type: Application
    Filed: June 10, 2016
    Publication date: October 13, 2016
    Inventors: Chang Cao, Fabio Morgia, Uhland Goebel, Guoyu Su
  • Publication number: 20150102870
    Abstract: A directional coupler arrangement comprising an air waveguide and a coupler port having a coupler line arranged inside the air waveguide. A method for producing a directional coupler arrangement comprising forming an air waveguide and forming a coupler port having a coupler line arranged inside the air waveguide is also disclosed.
    Type: Application
    Filed: December 15, 2014
    Publication date: April 16, 2015
    Inventors: Guoyu SU, Fabio MORGIA, Franco MARCONI
  • Publication number: 20140327490
    Abstract: The invention relates to a surface mount microwave system, comprising a multilayer arrangement (101) comprising a first conductive layer (103), a second conductive layer (105) and a dielectric layer (107), wherein the first conductive layer (103) is arranged on the dielectric layer (107), and wherein the dielectric layer (107) is arranged on the second conductive layer (105), wherein the first conductive layer (103) comprises a microwave circuit (109) and wherein the second conductive layer (105) forms a reference potential layer, a hollow microwave waveguide (111) being at least partly formed in the second conductive layer (105), and a microwave transition structure (113) for electromagnetically coupling the first conductive layer (103) with the hollow microwave waveguide (111). According to some implementation forms, a reflector on a cover covering the multilayer arrangement (101) may be avoided.
    Type: Application
    Filed: July 18, 2014
    Publication date: November 6, 2014
    Inventors: Franco MARCONI, Fabio MORGIA, Haiou GOU, Stefano VERZURA, Guoyu SU