Patents by Inventor Gurnam Singh

Gurnam Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160034826
    Abstract: Systems, apparatus, and computer program products provide real-time access to seating/work station information, including seat allocations/assignments and seat availability. Users are provided the ability to request a seat for allocation and to receive confirmation of the seat allocation/assignment in real-time. The automated nature of the present invention eliminates seat request/allocation duplication caused by multiple managers individually requesting seats manually and, in doing so, eliminates the resulting rework associated with duplicate requests/allocations. Moreover, the real-time functionality of the present invention reduces or eliminates the need to consolidate allocation requests and updates. In addition, the real-time view of seat allocations provides for instantaneous and up-to-the-minute analysis, data and reporting, which results in more timely decisions regarding seat allocations.
    Type: Application
    Filed: July 29, 2014
    Publication date: February 4, 2016
    Inventors: Sukhvinder Gurnam Singh, Herbert Kailash Fernandes, Sarvesh Neelakanta Subramani
  • Patent number: 4563901
    Abstract: A dual differential pressure/static pressure unit including a housing and three approximately parallel diaphragms sealed therewith forming low and high pressure compartments. Incompressible fluid then fills the respective spaces between the center diaphragm and that on each side thereof. Differential pressure/static pressure sensors are then provided. The housing is provided with passageways to conduct each of said fluids to the respective high and low pressure sides of said sensors.
    Type: Grant
    Filed: September 9, 1983
    Date of Patent: January 14, 1986
    Assignee: International Telephone & Telegraph Corp.
    Inventor: Gurnam Singh
  • Patent number: 4528855
    Abstract: Differential and static pressure transducers are provided with piezoresistive elements connected in Wheatstone bridges on the 100 surface of a silicon chip over a diaphragm etched into the chip from the back. A thin disk diaphragm is used for differential pressure (DP) and a thicker annular diaphragm around the disk diaphragm is used for static pressure (SP) measurements. Two of the elements opposite each other in each bridge are produced along one crystallographic direction (110), and the other two are produced along an orthogonal crystallographic direction (110). Extra elements are produced for each pair to permit selection of a more closely matched set of four elements. A plurality of DP diaphragms with different diameters and respective bridges are provided along with a multiplexer for selecting a DP bridge in order to provide different ranges of sensitivity for the differential pressure measurements.
    Type: Grant
    Filed: July 2, 1984
    Date of Patent: July 16, 1985
    Assignee: ITT Corporation
    Inventor: Gurnam Singh
  • Patent number: 4395915
    Abstract: An apparatus which utilizes solid state piezoresistive strain sensing means to measure the static pressure as well as the differential pressure across a primary element, such as an orifice plate, venturi tube, nozzle or wedge.
    Type: Grant
    Filed: August 16, 1982
    Date of Patent: August 2, 1983
    Assignee: Bourns Instruments, Inc.
    Inventor: Gurnam Singh
  • Patent number: 4347745
    Abstract: An apparatus which utilizes solid state piezoresistive strain sensing means to measure the static pressure as well as the differential pressure across a primary element, such as an orifice plate, venturi tube, nozzle or wedge.
    Type: Grant
    Filed: October 6, 1981
    Date of Patent: September 7, 1982
    Assignee: Bourns Instruments, Inc.
    Inventor: Gurnam Singh
  • Patent number: 4345476
    Abstract: In a differential pressure transducer, of the type having a cantilever beam mechanically linked to a pressure-sensitive diaphragm, and piezoelectric strain gauges diffused into or bonded onto the beam, the beam has a relatively high compliance as compared with the diaphragm to facilitate operation in low pressure ranges and to increase the overall operating range of the unit. In addition, the beam is constructed so that the total bending energy is transmitted to the area of the strain gauges so as to achieve near-perfect operating efficiencies.
    Type: Grant
    Filed: July 20, 1981
    Date of Patent: August 24, 1982
    Assignee: Bourns Instruments, Inc.
    Inventor: Gurnam Singh
  • Patent number: 4278195
    Abstract: A method for low temperature bonding of silicon and silicon on sapphire and spinel to nickel and nickel steel using a layered structure with an aluminum interface between the nickel or nickel steel and the silicon. The bonding is achieved in a reducing atmosphere using a temperature of 640 to 650 degrees C. with a pressure of 100 to 150 psi on the layered structure for a period of approximately five minutes with a subsequent cooling to avoid strains in the bond. An example of the transducer apparatus utilizing such a bonding technique includes a nickel steel housing and a silicon on spinel transducer wafer having a silicon peripheral pad with an aluminum layer bonding the silicon pad to the nickel steel housing.BACKGROUND OF THE INVENTION1. Field of the InventionThe present invention relates to bonding techniques. More specifically, the present invention is directed to a method for bonding silicon to nickel and a transducer apparatus utilizing such a bonding technique.2.
    Type: Grant
    Filed: December 1, 1978
    Date of Patent: July 14, 1981
    Assignee: Honeywell Inc.
    Inventor: Gurnam Singh
  • Patent number: 4212209
    Abstract: In a differential pressure to electric current transducer, a short sapphire slab carries a strain sensitive resistive pattern. The sapphire slab is an element of a much larger beam as the beam moves to change the stress of the other surfaces of the sapphire slab and varies the resistance of the silicon resistive pattern to produce an electric current signal indicative of the differential pressure.
    Type: Grant
    Filed: September 7, 1978
    Date of Patent: July 15, 1980
    Assignee: Honeywell Inc.
    Inventors: William F. Newbold, Gurnam Singh
  • Patent number: 4203327
    Abstract: Each sensor consists of a spinel substrate in the form of a beam or a diaphragm which carries a pattern of a plurality of doped silicon piezoresistive resistors. The latter are formed from layers of doped silicon, each of which layers has been epitaxially grown on a corresponding surface of the spinel substrate. The spinel minimizes the occurrence of leakage currents with respect to the resistors, while cooperating with the silicon to provide a high degree of stress transmission to the resistors. The beam form of sensor is shown as the sensor member of a differential fluid pressure to electric signal transducer, wherein the sensor is deflected and strained in accordance with the differential pressure to be sensed.
    Type: Grant
    Filed: June 29, 1978
    Date of Patent: May 20, 1980
    Assignee: Honeywell Inc.
    Inventor: Gurnam Singh