Patents by Inventor Gurpreet S. Jalewalia

Gurpreet S. Jalewalia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structurally isolated thermal interface
    Patent number: 7743763
    Abstract: In one embodiment, an assembly having bodies of different thermal expansion rates comprises a first body, a second body having a different thermal expansion rate than the first body, and a plurality of high conductivity members attached to both the first and second bodies. The high conductivity members are more flexible than the first and second bodies in order to allow for varied thermal expansion of the first and second bodies. The assembly may comprise a solar collector assembly, wherein the first body is a solar cell attached to a substrate, and the second body is a heat sink.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: June 29, 2010
    Assignee: The Boeing Company
    Inventors: Robert E. Grip, Blaine K. Rawdon, Gurpreet S. Jalewalia
  • STRUCTURALLY ISOLATED THERMAL INTERFACE
    Publication number: 20090025712
    Abstract: In one embodiment, an assembly having bodies of different thermal expansion rates comprises a first body, a second body having a different thermal expansion rate than the first body, and a plurality of high conductivity members attached to both the first and second bodies. The high conductivity members are more flexible than the first and second bodies in order to allow for varied thermal expansion of the first and second bodies. The assembly may comprise a solar collector assembly, wherein the first body is a solar cell attached to a substrate, and the second body is a heat sink.
    Type: Application
    Filed: July 27, 2007
    Publication date: January 29, 2009
    Applicant: THE BOEING COMPANY
    Inventors: Robert E. Grip, Blaine K. Rawdon, Gurpreet S. Jalewalia