Patents by Inventor Gurshan Deol

Gurshan Deol has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11926096
    Abstract: According to some aspects, an additive fabrication device and a build platform suitable for use within an additive fabrication device are provided. The build platform may include a build surface on which material may be formed by the additive fabrication device when the build platform is installed within the additive fabrication device. According to some embodiments, the build platform may include a flexible build layer and at least one removal mechanism configured to be actuated to apply a force to the flexible build layer. Such actuation may cause the flexible build layer to deform, thereby enabling separation of material adhered to the build surface from the build platform. According to some embodiments, the build platform may comprise a restorative mechanism that acts to return the flexible build layer to a flat state so that subsequent additive fabrication may form material on a flat build surface.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: March 12, 2024
    Assignee: Formlabs, Inc.
    Inventors: Craig Broady, Gurshan Deol, Gagandeep Singh
  • Patent number: 11550369
    Abstract: An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: January 10, 2023
    Assignee: APPLE INC.
    Inventors: Mikael M. Silvanto, Simon J. Trivett, Matthew S. Theobald, Dinesh C. Mathew, Simon R. Lancaster-Larocque, Robert Y. Cao, Ari P. Miller, Kevin M. Robinson, Houtan R. Farahani, Francesco Ferretti, John Raff, Robert J. Lockwood, Genie Kim, Karan Bir, Keith J. Hendren, Gurshan Deol, Antonio Clarke, Prabhu Sathyamurthy, William A. Counts
  • Publication number: 20210229353
    Abstract: According to some aspects, an additive fabrication device and a build platform suitable for use within an additive fabrication device are provided. The build platform may include a build surface on which material may be formed by the additive fabrication device when the build platform is installed within the additive fabrication device. According to some embodiments, the build platform may include a flexible build layer and at least one removal mechanism configured to be actuated to apply a force to the flexible build layer. Such actuation may cause the flexible build layer to deform, thereby enabling separation of material adhered to the build surface from the build platform. According to some embodiments, the build platform may comprise a restorative mechanism that acts to return the flexible build layer to a flat state so that subsequent additive fabrication may form material on a flat build surface.
    Type: Application
    Filed: January 25, 2021
    Publication date: July 29, 2021
    Applicant: Formlabs, Inc.
    Inventors: Craig Broady, Gurshan Deol, Gagandeep Singh
  • Publication number: 20210149458
    Abstract: An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.
    Type: Application
    Filed: January 26, 2021
    Publication date: May 20, 2021
    Inventors: Mikael M. Silvanto, Simon J. Trivett, Matthew S. Theobald, Dinesh C. Mathew, Simon R. Lancaster-Larocque, Robert Y. Cao, Ari P. Miller, Kevin M. Robinson, Houtan R. Farahani, Francesco Ferretti, John Raff, Robert J. Lockwood, Genie Kim, Karan Bir, Keith J. Hendren, Gurshan Deol, Antonio Clarke, Prabhu Sathyamurthy, William A. Counts
  • Patent number: 10915151
    Abstract: An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: February 9, 2021
    Assignee: APPLE INC.
    Inventors: Mikael M. Silvanto, Simon J. Trivett, Matthew S. Theobald, Dinesh C. Mathew, Simon R. Lancaster-Larocque, Robert Y. Cao, Ari P. Miller, Kevin M. Robinson, Houtan R. Farahani, Francesco Ferretti, John Raff, Robert J. Lockwood, Genie Kim, Karan Bir, Keith J. Hendren, Gurshan Deol, Antonio Clarke, Prabhu Sathyamurthy, William A. Counts
  • Patent number: 10899077
    Abstract: According to some aspects, an additive fabrication device and a build platform suitable for use within an additive fabrication device are provided. The build platform may include a build surface on which material may be formed by the additive fabrication device when the build platform is installed within the additive fabrication device. According to some embodiments, the build platform may include a flexible build layer and at least one removal mechanism configured to be actuated to apply a force to the flexible build layer. Such actuation may cause the flexible build layer to deform, thereby enabling separation of material adhered to the build surface from the build platform. According to some embodiments, the build platform may comprise a restorative mechanism that acts to return the flexible build layer to a flat state so that subsequent additive fabrication may form material on a flat build surface.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: January 26, 2021
    Assignee: Formlabs, Inc.
    Inventors: Craig Broady, Gurshan Deol, Gagandeep Singh
  • Publication number: 20200368966
    Abstract: According to some aspects, an additive fabrication device and a build platform suitable for use within an additive fabrication device are provided. The build platform may include a build surface on which material may be formed by the additive fabrication device when the build platform is installed within the additive fabrication device. According to some embodiments, the build platform may include a flexible build layer and at least one removal mechanism configured to be actuated to apply a force to the flexible build layer. Such actuation may cause the flexible build layer to deform, thereby enabling separation of material adhered to the build surface from the build platform. According to some embodiments, the build platform may comprise a restorative mechanism that acts to return the flexible build layer to a flat state so that subsequent additive fabrication may form material on a flat build surface.
    Type: Application
    Filed: July 13, 2020
    Publication date: November 26, 2020
    Applicant: Formlabs, Inc.
    Inventors: Craig Broady, Gurshan Deol, Gagandeep Singh
  • Patent number: 10710303
    Abstract: According to some aspects, an additive fabrication device and a build platform suitable for use within an additive fabrication device are provided. The build platform may include a build surface on which material may be formed by the additive fabrication device when the build platform is installed within the additive fabrication device. According to some embodiments, the build platform may include a flexible build layer and at least one removal mechanism configured to be actuated to apply a force to the flexible build layer. Such actuation may cause the flexible build layer to deform, thereby enabling separation of material adhered to the build surface from the build platform. According to some embodiments, the build platform may comprise a restorative mechanism that acts to return the flexible build layer to a flat state so that subsequent additive fabrication may form material on a flat build surface.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: July 14, 2020
    Assignee: Formlabs, Inc.
    Inventors: Craig Broady, Gurshan Deol, Gagandeep Singh
  • Publication number: 20190220065
    Abstract: This application relates to hidden fasteners within an electronic device. An electronic device can include a top portion and a base portion that includes a housing and a cover attached to the housing by at least one fastener that is not visible through an external surface of the cover. Each fastener includes a receiver housing that retrains spherical components and a pin that can be inserted into an opening in the receiver housing. The pin is retained in the receiver housing by a force imparted against a surface of the pin by the spherical components, which are biased towards an inner surface of the receiver housing sloped towards the opening. The pin can be released when an external magnetic field from a magnet placed proximate the bottom surface of the receiver housing retracts the spherical components away from the opening, thereby reducing the force against the surface of the pin.
    Type: Application
    Filed: January 15, 2019
    Publication date: July 18, 2019
    Inventors: Simon Regis Louis LANCASTER-LAROCQUE, Kent JOHNSTON, Michael MALONEY, John C. DIFONZO, Gurshan DEOL, Kamal H. HABBOUB, Keith J. HENDREN, Karan BIR, Steven J. OSBORNE, Christiaan A. LIGTENBERG
  • Publication number: 20190101960
    Abstract: An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.
    Type: Application
    Filed: September 27, 2018
    Publication date: April 4, 2019
    Inventors: Mikael M. Silvanto, Simon R. Trivett, Matthew S. Theobald, Dinesh C. Mathew, Simon R. Lancaster-Larocque, Robert Y. Cao, Ari P. Miller, Kevin M. Robinson, Houtan R. Farahani, Francesco Ferretti, John Raff, Robert J. Lockwood, Genie Kim, Karan Bir, Keith J. Hendren, Gurshan Deol, Antonio Clarke, Prabhu Sathyamurthy, William A. Counts