Patents by Inventor Gurshan Deol
Gurshan Deol has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11926096Abstract: According to some aspects, an additive fabrication device and a build platform suitable for use within an additive fabrication device are provided. The build platform may include a build surface on which material may be formed by the additive fabrication device when the build platform is installed within the additive fabrication device. According to some embodiments, the build platform may include a flexible build layer and at least one removal mechanism configured to be actuated to apply a force to the flexible build layer. Such actuation may cause the flexible build layer to deform, thereby enabling separation of material adhered to the build surface from the build platform. According to some embodiments, the build platform may comprise a restorative mechanism that acts to return the flexible build layer to a flat state so that subsequent additive fabrication may form material on a flat build surface.Type: GrantFiled: January 25, 2021Date of Patent: March 12, 2024Assignee: Formlabs, Inc.Inventors: Craig Broady, Gurshan Deol, Gagandeep Singh
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Patent number: 11550369Abstract: An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.Type: GrantFiled: January 26, 2021Date of Patent: January 10, 2023Assignee: APPLE INC.Inventors: Mikael M. Silvanto, Simon J. Trivett, Matthew S. Theobald, Dinesh C. Mathew, Simon R. Lancaster-Larocque, Robert Y. Cao, Ari P. Miller, Kevin M. Robinson, Houtan R. Farahani, Francesco Ferretti, John Raff, Robert J. Lockwood, Genie Kim, Karan Bir, Keith J. Hendren, Gurshan Deol, Antonio Clarke, Prabhu Sathyamurthy, William A. Counts
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Publication number: 20210229353Abstract: According to some aspects, an additive fabrication device and a build platform suitable for use within an additive fabrication device are provided. The build platform may include a build surface on which material may be formed by the additive fabrication device when the build platform is installed within the additive fabrication device. According to some embodiments, the build platform may include a flexible build layer and at least one removal mechanism configured to be actuated to apply a force to the flexible build layer. Such actuation may cause the flexible build layer to deform, thereby enabling separation of material adhered to the build surface from the build platform. According to some embodiments, the build platform may comprise a restorative mechanism that acts to return the flexible build layer to a flat state so that subsequent additive fabrication may form material on a flat build surface.Type: ApplicationFiled: January 25, 2021Publication date: July 29, 2021Applicant: Formlabs, Inc.Inventors: Craig Broady, Gurshan Deol, Gagandeep Singh
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Publication number: 20210149458Abstract: An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.Type: ApplicationFiled: January 26, 2021Publication date: May 20, 2021Inventors: Mikael M. Silvanto, Simon J. Trivett, Matthew S. Theobald, Dinesh C. Mathew, Simon R. Lancaster-Larocque, Robert Y. Cao, Ari P. Miller, Kevin M. Robinson, Houtan R. Farahani, Francesco Ferretti, John Raff, Robert J. Lockwood, Genie Kim, Karan Bir, Keith J. Hendren, Gurshan Deol, Antonio Clarke, Prabhu Sathyamurthy, William A. Counts
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Patent number: 10915151Abstract: An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.Type: GrantFiled: September 27, 2018Date of Patent: February 9, 2021Assignee: APPLE INC.Inventors: Mikael M. Silvanto, Simon J. Trivett, Matthew S. Theobald, Dinesh C. Mathew, Simon R. Lancaster-Larocque, Robert Y. Cao, Ari P. Miller, Kevin M. Robinson, Houtan R. Farahani, Francesco Ferretti, John Raff, Robert J. Lockwood, Genie Kim, Karan Bir, Keith J. Hendren, Gurshan Deol, Antonio Clarke, Prabhu Sathyamurthy, William A. Counts
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Patent number: 10899077Abstract: According to some aspects, an additive fabrication device and a build platform suitable for use within an additive fabrication device are provided. The build platform may include a build surface on which material may be formed by the additive fabrication device when the build platform is installed within the additive fabrication device. According to some embodiments, the build platform may include a flexible build layer and at least one removal mechanism configured to be actuated to apply a force to the flexible build layer. Such actuation may cause the flexible build layer to deform, thereby enabling separation of material adhered to the build surface from the build platform. According to some embodiments, the build platform may comprise a restorative mechanism that acts to return the flexible build layer to a flat state so that subsequent additive fabrication may form material on a flat build surface.Type: GrantFiled: July 13, 2020Date of Patent: January 26, 2021Assignee: Formlabs, Inc.Inventors: Craig Broady, Gurshan Deol, Gagandeep Singh
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Publication number: 20200368966Abstract: According to some aspects, an additive fabrication device and a build platform suitable for use within an additive fabrication device are provided. The build platform may include a build surface on which material may be formed by the additive fabrication device when the build platform is installed within the additive fabrication device. According to some embodiments, the build platform may include a flexible build layer and at least one removal mechanism configured to be actuated to apply a force to the flexible build layer. Such actuation may cause the flexible build layer to deform, thereby enabling separation of material adhered to the build surface from the build platform. According to some embodiments, the build platform may comprise a restorative mechanism that acts to return the flexible build layer to a flat state so that subsequent additive fabrication may form material on a flat build surface.Type: ApplicationFiled: July 13, 2020Publication date: November 26, 2020Applicant: Formlabs, Inc.Inventors: Craig Broady, Gurshan Deol, Gagandeep Singh
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Patent number: 10710303Abstract: According to some aspects, an additive fabrication device and a build platform suitable for use within an additive fabrication device are provided. The build platform may include a build surface on which material may be formed by the additive fabrication device when the build platform is installed within the additive fabrication device. According to some embodiments, the build platform may include a flexible build layer and at least one removal mechanism configured to be actuated to apply a force to the flexible build layer. Such actuation may cause the flexible build layer to deform, thereby enabling separation of material adhered to the build surface from the build platform. According to some embodiments, the build platform may comprise a restorative mechanism that acts to return the flexible build layer to a flat state so that subsequent additive fabrication may form material on a flat build surface.Type: GrantFiled: December 7, 2017Date of Patent: July 14, 2020Assignee: Formlabs, Inc.Inventors: Craig Broady, Gurshan Deol, Gagandeep Singh
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Publication number: 20190220065Abstract: This application relates to hidden fasteners within an electronic device. An electronic device can include a top portion and a base portion that includes a housing and a cover attached to the housing by at least one fastener that is not visible through an external surface of the cover. Each fastener includes a receiver housing that retrains spherical components and a pin that can be inserted into an opening in the receiver housing. The pin is retained in the receiver housing by a force imparted against a surface of the pin by the spherical components, which are biased towards an inner surface of the receiver housing sloped towards the opening. The pin can be released when an external magnetic field from a magnet placed proximate the bottom surface of the receiver housing retracts the spherical components away from the opening, thereby reducing the force against the surface of the pin.Type: ApplicationFiled: January 15, 2019Publication date: July 18, 2019Inventors: Simon Regis Louis LANCASTER-LAROCQUE, Kent JOHNSTON, Michael MALONEY, John C. DIFONZO, Gurshan DEOL, Kamal H. HABBOUB, Keith J. HENDREN, Karan BIR, Steven J. OSBORNE, Christiaan A. LIGTENBERG
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Publication number: 20190101960Abstract: An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.Type: ApplicationFiled: September 27, 2018Publication date: April 4, 2019Inventors: Mikael M. Silvanto, Simon R. Trivett, Matthew S. Theobald, Dinesh C. Mathew, Simon R. Lancaster-Larocque, Robert Y. Cao, Ari P. Miller, Kevin M. Robinson, Houtan R. Farahani, Francesco Ferretti, John Raff, Robert J. Lockwood, Genie Kim, Karan Bir, Keith J. Hendren, Gurshan Deol, Antonio Clarke, Prabhu Sathyamurthy, William A. Counts