Patents by Inventor Guru Thalapaneni

Guru Thalapaneni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8369832
    Abstract: Systems and methods are described for remotely managing mobile devices provided by an enterprise. Embodiments are described in which a client is provided to a mobile device whereby the client maintains a list of authorized contacts authorizes connections of the mobile device based on the list. The client responds to commands including commands to delete the list, prevent access to the list and synchronize the list. An administrative function is described for organizing users into groups, each user having access to a mobile device and each group being associated with a list of authorized contacts common to each user in the group.
    Type: Grant
    Filed: February 12, 2008
    Date of Patent: February 5, 2013
    Assignee: Remoba, Inc.
    Inventors: Guru Thalapaneni, Ramana Anuganti, Kumar M. Ranganath, Rajeswari Aluri
  • Publication number: 20090029676
    Abstract: Systems and methods are described for remotely managing mobile devices provided by an enterprise. Embodiments are described in which a client is provided to a mobile device whereby the client maintains a list of authorized contacts authorizes connections of the mobile device based on the list. The client responds to commands including commands to delete the list, prevent access to the list and synchronize the list. An administrative function is described for organizing users into groups, each user having access to a mobile device and each group being associated with a list of authorized contacts common to each user in the group.
    Type: Application
    Filed: February 12, 2008
    Publication date: January 29, 2009
    Inventors: Guru Thalapaneni, Ramana Anuganti, Kumar M. Ranganath, Rajeswari Aluri
  • Publication number: 20090017790
    Abstract: Systems and methods are described that enable remote restriction of workforce mobile phones, media players, computers and other devices. In particular, systems, apparatus and methods are described that deny or allow connections involving the mobile device based on the content of a preauthorized contact list provided by a business administrator. The connection may be any combination of incoming connection, outgoing connection, voice connection, data connection. The list of preauthorized contacts maybe updated upon receipt of a synchronization command from a business administrator. Access to the list of contacts can be blocked upon receiving a lockdown command from the business administrator. The list of contacts can be destroyed upon receiving a poison pill command from the business administrator. A client is described for controlling use of the mobile device.
    Type: Application
    Filed: February 12, 2008
    Publication date: January 15, 2009
    Inventors: Guru Thalapaneni, Srinivas Naidu Doddapaneni
  • Patent number: 5939790
    Abstract: Pad structures for an integrated circuit are provided that use via holes or slots rather than large pad openings to form electrical connections between successive metal interconnection layers. The via holes or slots are filled using standard metal etchback deposition techniques. The pad structures minimize particle generation during circuit fabrication. A number of the via holes or slots in the pad structure can be interconnected in parallel to provide a sufficient current handling capacity to distribute power to the active components on the integrated circuit.
    Type: Grant
    Filed: April 9, 1996
    Date of Patent: August 17, 1999
    Assignee: Altera Corporation
    Inventors: Francois Gregoire, Raminda Madurawe, Guru Thalapaneni
  • Patent number: 5572067
    Abstract: An integrated circuit chip die (12) is manufactured with sacrificial structures (16) placed at the areas of die that are likely to experience cracks. According to one embodiment of the invention, these sacrificial structures are placed at the corners of the die. The sacrificial structures are constructed with metal lines (22, 24) that resist propagation of cracks into the area of the die containing electronic devices. The metal lines form lattice steps so that the surface of the die will more tightly bond to the molding compound that makes up the die package.
    Type: Grant
    Filed: October 6, 1994
    Date of Patent: November 5, 1996
    Assignee: Altera Corporation
    Inventor: Guru Thalapaneni