Patents by Inventor Gus Karavakis

Gus Karavakis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip connection components with adhesives and methods of making same
    Patent number: 6202299
    Abstract: A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than all of the component bottom surface, so as to provide a void-free interface when the adhesive bonds the component to the top surface of a chip. The adhesive desirably is brought to a flowable condition by heat transferred from the chip itself. The connection component may include leads having base metal strips in a trace area underlying the top surface and noble metal portions protruding beyond an edge of the top layer. A flowable, curable material encapsulates the base metal sections. Because the base metal sections desirably are free of undercuts, the same can be encapsulated in a void-free manner during formation of the component.
    Type: Grant
    Filed: December 11, 1998
    Date of Patent: March 20, 2001
    Assignee: Tessera, Inc.
    Inventors: Thomas H. DiStefano, Gus Karavakis, Zlata Kovac, Craig Mitchell
  • Method of mounting a connection component on a semiconductor chip with adhesives
    Patent number: 6045655
    Abstract: A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than all of the component bottom surface, so as to provide a void-free interface when the adhesive bonds the component to the top surface of a chip. The adhesive desirably is brought to a flowable condition by heat transferred from the chip itself. The connection component may include leads having base metal strips in a trace area underlying the top surface and noble metal portions protruding beyond an edge of the top layer. A flowable, curable material encapsulates the base metal sections. Because the base metal sections desirably are free of undercuts, the same can be encapsulated in a void-free manner during formation of the component.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: April 4, 2000
    Assignee: Tessera, Inc.
    Inventors: Thomas H. DiStefano, Gus Karavakis, Zlata Kovac, Craig Mitchell
  • Method of mounting a connection component on a semiconductor chip with adhesives
    Patent number: 5875545
    Abstract: A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than all of the component bottom surface, so as to provide a void-free interface when the adhesive bonds the component to the top surface of a chip. The adhesive desirably is brought to a flowable condition by heat transferred from the chip itself. The connection component may include leads having base metal strips in a trace area underlying the top surface and noble metal portions protruding beyond an edge of the top layer. A flowable, curable material encapsulates the base metal sections. Because the base metal sections desirably are free of undercuts, the same can be encapsulated in a void-free manner during formation of the component.
    Type: Grant
    Filed: June 5, 1996
    Date of Patent: March 2, 1999
    Assignee: Tessera, Inc.
    Inventors: Thomas H. DiStefano, Gus Karavakis, Zlata Kovac, Craig Mitchell
  • Semiconductor chip connection components with adhesives and methods for bonding to the chip
    Patent number: 5548091
    Abstract: A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than all of the component bottom surface, so as to provide a void-free interface when the adhesive bonds the component to the top surface of a chip. The adhesive desirably is brought to a flowable condition by heat transferred from the chip itself. The connection component may include leads having base metal strips in a trace area underlying the top surface and noble metal portions protruding beyond an edge of the top layer. A flowable, curable material encapsulates the base metal sections. Because the base metal sections desirably are free of undercuts, the same can be encapsulated in a void-free manner during formation of the component.
    Type: Grant
    Filed: October 26, 1993
    Date of Patent: August 20, 1996
    Assignee: Tessera, Inc.
    Inventors: Thomas H. DiStefano, Gus Karavakis, Zlata Kovac, Craig Mitchell