Abstract: In a water cooling arrangement for insertable component parts groups in devices of power electronics, the carrier element on which the component parts are arranged is fashioned as a component parts carrier independent of the cooling member. A water-traversed cooling member which is seated essentially apparatus-rigid can be individually brought into thermal interaction with every component parts carrier inserted into the device in the composite of an insert being brought into thermal interaction therewith by the force of resilient elements at heat transmission surfaces precisely mating to one another which are fashioned at component parts carriers and cooling members. With a mechanical device all cooling members can be distanced in common from the apertaining component parts carriers opposite the acting direction of the forces of the resilient elements. A replacement of component parts carriers is thereby enabled without performing manipulations at devices of the cooling water circulation.